Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 8166446 | Flexible test fixture A system for testing an electronic circuit board (ECB) having a plurality of test points in a pre-defined arrangement on a measurement device having a plurality of resources includes an interface fixture having a plurality of contact pads arranged in an array on a f... | 04/24/2012 |
| 8164905 | Heat sink assembly An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes... | 04/24/2012 |
| 8144470 | Two-piece heat sink stud A fastening system for a heat sink mounted on a circuit board utilizes a self-clinching stud assembly constructed by axially interfitting two flat sheet metal members. Each member has forked ends which when axially plugged together in criss-cross fashion create a un... | 03/27/2012 |
| 8139361 | Apparatus and method for attaching selected components to a printed circuit board Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for r... | 03/20/2012 |
| 8120920 | Computer system with heat sink A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are... | 02/21/2012 |
| 8120919 | Adjustable mounting bracket for a computer component A bracket, computer component and method for connecting to connection points associated with a socket on a computer circuit board are provided. The bracket and computer component have a mounting device including a fastener connectable to one of the connection points... | 02/21/2012 |
| 8111517 | Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly A heat sink assembly, a portable electronic device using the same and a wireless modem using the heat sink assembly are disclosed. The heat sink assembly assembled within the portable electronic for dissipating the heat source generated within the portable electroni... | 02/07/2012 |
| 8111516 | Housing used as heat collector A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material cover... | 02/07/2012 |
| 8107242 | Electrical equipment unit A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provid... | 01/31/2012 |
| 8085542 | Heat dissipation device and electronic system incorporating the same A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is m... | 12/27/2011 |
| 8081475 | Heat sinking assembly and method for power electronics in a trolling motor controller head To prevent water intrusion, trolling motor heads cannot utilize ventilation methods of removing heat from power electronics. The assembly and method of the present application utilizes the existing metal column of a trolling motor to remove heat from the power elect... | 12/20/2011 |
| 8081474 | Embossed heat spreader One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (... | 12/20/2011 |
| 8081473 | Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat ... | 12/20/2011 |
| 8081476 | Electromagnetic shielding device with heat dissipating function An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed o... | 12/20/2011 |
| 8072763 | Printed circuit board assembly A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generat... | 12/06/2011 |
| 8072761 | Power semiconductor heatsinking A heatsink includes a thermally conductive body including a plurality of fins configured to conduct and dissipate heat. The body is configured to receive a circuit board containing heat-producing electrical components along a width of the body. The heatsink further ... | 12/06/2011 |
| 8072762 | Printed circuit board assembly A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipat... | 12/06/2011 |
| 8064204 | Electronic apparatus An electronic apparatus includes a housing, first and second circuit boards disposed in the housing in such a way that the first and second circuit boards are stacked on each other, and a pump block disposed between the first and second circuit boards, the pump bloc... | 11/22/2011 |
| 8059410 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting b... | 11/15/2011 |
| 8050039 | Portable environmentally robust enclosure optimized for size, weight, and power dissipation An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat... | 11/01/2011 |
| 8050038 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting b... | 11/01/2011 |
| 8040676 | Carrier body for components or circuits A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive. In order to simplify the carrier body while at the same time providing extremely improved heat dissipation, the ... | 10/18/2011 |
| 8040677 | Plasma display device A plasma display device includes a circuit board on which a driving circuit is to be mounted and a first heat sink fastened to one side surface of a semiconductor device, the first heat sink being disposed spaced apart from the circuit board, and the semiconductor d... | 10/18/2011 |
| 8023268 | Printed circuit board unit and semiconductor package A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward ... | 09/20/2011 |
| 8014152 | Electronic substrate device This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electro... | 09/06/2011 |
| 8009429 | Electrical component thermal management Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad tha... | 08/30/2011 |
| 8004845 | Fastening assembly for heat dissipation device A fastening assembly used for securing a heat dissipation device to a printed circuit board, comprises a sleeve, an inserting device extending through the sleeve, a spring encircling the inserting device and received in the sleeve, and a supporting device inserted i... | 08/23/2011 |
| 7990720 | Electronic system with heat dissipation structure An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The mo... | 08/02/2011 |
| 7990721 | Computer system with heat sink A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for coolin... | 08/02/2011 |
| 7990719 | Electronic system with heat dissipation device A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at le... | 08/02/2011 |
| 7986529 | Mounting apparatus for heat dissipating device An apparatus includes a base plate, a circuit board mounted on the base plate, and a supporting bracket adapted to support a heat dissipating device. A securing post protrudes from the base plate and defines a securing groove. The supporting bracket is disposed abov... | 07/26/2011 |
| 7983048 | Structure for mounting semiconductor package A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front ... | 07/19/2011 |
| 7983047 | Mounting assembly for heat sink A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink incl... | 07/19/2011 |
| 7978475 | Strain reduction fixing structure A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates. ... | 07/12/2011 |
| 7961473 | Retention module for toolless heat sink installation An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably ... | 06/14/2011 |
| 7961474 | Heat dissipation device and power module A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrug... | 06/14/2011 |
| 7957148 | Low profile computer processor retention device A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socke... | 06/07/2011 |
| 7952881 | Thermal-electrical assembly for a portable communication device A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206 | 05/31/2011 |
| 7929309 | Heat sink assembly having clip A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotal... | 04/19/2011 |
| 7911797 | Apparatus and methods for thermal management of electronic devices An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between ... | 03/22/2011 |
