Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7929308 | Power device package having enhanced heat dissipation A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power ... | 04/19/2011 |
| 7924569 | Semiconductor device comprising an in-chip active heat transfer system By providing thermoelectric elements, such as Peltier elements, in a semiconductor device, the overall heat management may be increased. In some illustrative embodiments, the corresponding active cooling/heating systems may be used in a stacked chip configuration to... | 04/12/2011 |
| 7898810 | Air cooling for a phased array radar In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar... | 03/01/2011 |
| 7889502 | Heat spreading circuit assembly A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between th... | 02/15/2011 |
| 7804689 | High-power thyristor module having cooling effect A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting fram... | 09/28/2010 |
| 7636238 | Electronic apparatus and heat radiating unit A heat radiating unit provided in an electronic apparatus includes: a fan for blowing air; and a heat radiating member in which heat radiation fins for transmitting heat to passing air are arranged and which has an endothermic section that contacts a top surface of ... | 12/22/2009 |
| 7633758 | Module type multiphase inverter A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat si... | 12/15/2009 |
| 7505275 | LED with integral via A light emitting diode comprising a body and a thermal via integral therewith and which extends from the body. ... | 03/17/2009 |
| 7463488 | Accessor movably disposed within an automated data storage and retrieval system An accessor moveably disposed within an autowated data storage and retrieval system is provided, wherein the automated data storage and retrieval system includes one or more power supply modules removeably disposed therein. Each of the one or more power supply modul... | 12/09/2008 |
| 7443681 | Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal t... | 10/28/2008 |
| 7429720 | Electric heating pipe and electric heating apparatus using it The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast hea... | 09/30/2008 |
| 7430121 | Heat sink fastener A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The... | 09/30/2008 |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7417862 | Heat sink fixing device A heat sink fixing device for fixing a heat sink on a printed circuit board is disclosed. The fixing device comprises a connecting portion fixed on one side of the heat sink, an extension portion connected with the connecting portion, a first pin extended downward f... | 08/26/2008 |
| 7394659 | Apparatus and methods for cooling semiconductor integrated circuit package structures The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat... | 07/01/2008 |
| 7385824 | Processor module with rigidly coupled processor and voltage-regulator heat sinks A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the process... | 06/10/2008 |
| 7365986 | Semiconductor cooling device and stack of semiconductor cooling devices To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a se... | 04/29/2008 |
| 7365425 | Heat radiation structure of semiconductor element and heat sink According to a heat radiation structure of a semiconductor element of the invention, by providing a recess for a thermal conductive sheet on the bottom surface of a mounting seat of a heat sink, disposing the thermal conductive sheet in this recess, and screwing a s... | 04/29/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7360586 | Wrap around heat sink apparatus and method A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In t... | 04/22/2008 |
| 7360365 | Thermoelectric heat pumps The thermoelectric heat pump comprises one or more thermoelectric modules having a hot side connected to a first heat exchanger and a cold side connected to a second heat exchanger, and is characterized in that it comprises a pair of elongated bar-like elements made... | 04/22/2008 |
| 7355858 | Heat sink for surface-mounted semiconductor devices and mounting method A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-acti... | 04/08/2008 |
| 7342784 | Cooling method and device for an electronic component A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradu... | 03/11/2008 |
| 7338837 | Semiconductor packages for enhanced number of terminals, speed and power performance An integrated circuit device package with a first part (101) having a cavity (104) to mount the chip (105), further I/O terminals (102) on the top surface and terminals (103) on the bottom surface. The chip has contact pads (107... | 03/04/2008 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a ... | 03/04/2008 |
| 7339795 | Structure for fastening a circuit board on a case A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupl... | 03/04/2008 |
| 7336494 | Electronic device having compact heat radiation structure A liquid crystal display (LCD) is fixed to an upper housing half by an LCD fixing frame made of a material having a high thermal conductivity. The LCD fixing frame is attached to the upper housing half in contact with a lower surface of the LCD on the opposite side ... | 02/26/2008 |
| 7336495 | Power component cooling device with a heat sink and one or more cooling fins Where power components are fixed on a heat sink 1 inclusive of a heat sink base 1b and cooling fins 1a provided on the heat sink base 1b, one 1c of the cooling fins, which is made thicker, is arranged up... | 02/26/2008 |
| 7327581 | Circuit device A circuit device includes plural semiconductor circuit devices that are formed on independent substrates, respectively, and communicate with each other. Each of the semiconductor circuit devices includes: plural modules of an identical type, functions of which are s... | 02/05/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7307841 | Electronic package and method of cooling electronics An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry... | 12/11/2007 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7295440 | Integral cold plate/chasses housing applicable to force-cooled power electronics An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral par... | 11/13/2007 |
| 7292441 | Thermal solution for portable electronic devices A thermal solution for a portable electronic device, which is positioned between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the ... | 11/06/2007 |
| 7275833 | Cooling system and projection-type image display apparatus using the same A cooling system for cooling a semiconductor device including a display device provided in a projection-type image display apparatus with high cooling efficiency without sacrificing cooling performance is disclosed. The cooling system includes a radiating member pro... | 10/02/2007 |
| 7265983 | Power unit comprising a heat sink, and assembly method The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissi... | 09/04/2007 |
| 7254031 | Display apparatus having heat dissipating structure for driver integrated circuit A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma display panel (PDP) adjacent to a first side of the chassis base, and a dr... | 08/07/2007 |
| 7242585 | Electronic device An electronic device is thin and includes heat-generating components that are cooled efficiently. The electronic device includes heat-transmitting sheets 72 and 47 being stuck to inside surfaces of a lower section and an upper section of the electronic... | 07/10/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
