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| Number | Title | Issue Date |
| 8081470 | Heat-dissipating mechanism implemented in cage for optical transceiver A mechanism for the heat sink to adhere to the transceiver inserted in the cage is disclosed. The heat sink provides a guide in the side thereof, while, the cage provides a slit in the side. A pair of elastic tabs is diagonally formed in the slit. The transceiver sl... | 12/20/2011 |
| 8081471 | Module for an automation device A module for an automation device with a plurality of adjacent modules is provided. The module includes a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. Further, an automation device includin... | 12/20/2011 |
| 8018723 | Heat dissipation for electronic modules A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. T... | 09/13/2011 |
| 7974098 | Mechanism to make a heat sink in contact with a pluggable transceiver, a pluggable optical transceiver and a cage assembly providing the same A heat-dissipating mechanism with a thermo-conducting sheet is arranged between a pluggable optical transceiver and a heat sink. One of the optical transceiver and the heat sink includes the thermo-conducting sheet. The heat sink is assembled with a cage to be movab... | 07/05/2011 |
| 7965515 | Heat radiating structure for electronic module and electronic device having the same A heat radiating structure for an electronic module and an electronic device having the same structure thereon. The heat radiating structure is formed at the bottom of the electronic module to release the generated heat from the electronic module, and includes an im... | 06/21/2011 |
| 7965516 | Power semiconductor module and method for its production A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housi... | 06/21/2011 |
| 7907412 | Electronic device with improved heat dissipation properties An electronic device with improved heat dissipation properties comprises metallic housing. A base circuit board may be positioned within the housing in a plane parallel to the backside. Multiple connectors for coupling cassettes to the base circuit board may be posi... | 03/15/2011 |
| 7864533 | Semiconductor device A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a cont... | 01/04/2011 |
| 7859849 | Modular heatsink mounting system In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removab... | 12/28/2010 |
| 7852633 | Connector for connection to a module board Provided is a connector for connection to a module board including an eject mechanism selectively ejecting a module from a module accommodating section. The eject mechanism includes a locking member that has a locking nib engageable with a recess of a case of the mo... | 12/14/2010 |
| 7839643 | Heat spreader for memory modules A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with... | 11/23/2010 |
| 7800910 | Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module The invention relates to an electronic appliance (1), provided with a cooling assembly (10) for cooling a module (4) that during use can be inserted in the appliance (1) by a consumer. The cooling assembly (10) comprises a cooling ... | 09/21/2010 |
| 7796393 | Assembly device and assembly method for a cooling element A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adap... | 09/14/2010 |
| 7787250 | Metallic cover of miniaturization module A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the ... | 08/31/2010 |
| 7773381 | Semiconductor device A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a cont... | 08/10/2010 |
| 7768785 | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the... | 08/03/2010 |
| 7764504 | Heat transfer system for a receptacle assembly A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the el... | 07/27/2010 |
| 7751193 | Electronic control apparatus An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circui... | 07/06/2010 |
| 7746649 | Modular soft starter Modular soft starters are disclosed having a plurality of soft starter modules with stacked SCRs and heat sinks for accommodating a single phase of a three phase motor, where the modules may be connected serially for starting each phase of a higher voltage motor, an... | 06/29/2010 |
| 7746648 | Modular heat-radiation structure and controller including the structure A modular heat-radiation structure includes a module for generating heat, including a first main unit having a heat-radiation fin, fixed to the top face of the first main unit for radiating heat generated in the module and a resin-made and insulating heat shield ins... | 06/29/2010 |
| 7679915 | Motor control apparatus and method of assembling motor control apparatus There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in... | 03/16/2010 |
| 7663886 | Electric circuit device and the manufacturing method An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin... | 02/16/2010 |
| 7619893 | Heat spreader for electronic modules A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreade... | 11/17/2009 |
| 7609523 | Memory module assembly including heat sink attached to integrated circuits by adhesive and clips A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory dev... | 10/27/2009 |
| 7606035 | Heat sink and memory module using the same Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins he... | 10/20/2009 |
| 7606034 | Thermally enhanced memory module A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreade... | 10/20/2009 |
| 7561429 | Power converter unit A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module and fixed to the metal casing; a heat dissipating sheet disposed on the... | 07/14/2009 |
| 7532478 | Plasma display module A plasma display module including a plasma display panel adapted to display an image with gas discharge, a chassis adapted to support the plasma display panel, a driving unit arranged on the chassis and adapted to generate an electrical signal that drives the plasma... | 05/12/2009 |
| 7529094 | Integrated heat sink and light pipe mounting assembly A heat sink and light pipe assembly is provided for an electronic module configured to be mounted on a circuit board. The assembly includes a bracket configured to be held proximate the electronic module. The bracket includes a light pipe mounting post and the brack... | 05/05/2009 |
| 7529093 | Circuit device A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating layer. Circuit elements are connected to the conductive pattern. Seal... | 05/05/2009 |
| 7483273 | Semiconductor module and semiconductor module heat radiation plate In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semi... | 01/27/2009 |
| 7477518 | Sub-assembly According to an embodiment, a power semiconductor module comprises a heat-dissipation contact area configured to thermally connect the power semiconductor module to a cooling element. The power semiconductor module also comprises a housing and a press-on element. Th... | 01/13/2009 |
| 7463487 | Cooling apparatus for flat display device There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module, an ... | 12/09/2008 |
| 7457125 | Cooling apparatus for flat display device and cross-flow fan of the cooling apparatus A cooling apparatus for a flat display device includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module; an air inlet formed on a portion of the back... | 11/25/2008 |
| 7457124 | Electronic apparatus An electronic apparatus includes a main body housing having a corner portion in its rear, a display section, and a hinge device which rotatively movably connects the display section to the main body housing. The corner portion projects outward more than a side wall ... | 11/25/2008 |
| 7450389 | Sub-assembly A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to... | 11/11/2008 |
| 7450388 | Power converter connection configuration EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits th... | 11/11/2008 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7443678 | Flexible circuit board with heat sink A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface... | 10/28/2008 |
| 7443686 | Electronic system An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole... | 10/28/2008 |
