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| Number | Title | Issue Date |
| 8164904 | Electronic component module An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit ... | 04/24/2012 |
| 7903417 | Electrical circuit assembly for high-power electronics An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electr... | 03/08/2011 |
| 7864532 | Molded or encapsulated transmit-receive module or TR module/antenna element for active array An array of electrically conductive waveguides is made a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered ... | 01/04/2011 |
| 7778035 | Portable electronic apparatus A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic dev... | 08/17/2010 |
| 7760507 | Thermally and electrically conductive interconnect structures An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and... | 07/20/2010 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7359201 | Heat-generating electronic part cover and cover mounting method A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, op... | 04/15/2008 |
| 7359144 | Overmold component seal in an electronic device housing In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for ... | 04/15/2008 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7262968 | Device for decreasing the temperature from address IC of plasma display panel and the method thereof A device for dissipating a heat from addressing integrated circuits (addressing ICs) of a plasma display panel that uses a back plate which has a greater surface area, to dissipate the heat from the addressing integrated circuits directly. For embodiment of the devi... | 08/28/2007 |
| 7242584 | Housing for power semiconductor modules A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection trac... | 07/10/2007 |
| 7232332 | Support and grounding structure Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and... | 06/19/2007 |
| 7206202 | Electronic apparatus with heat-dissipating structure An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation ... | 04/17/2007 |
| 7187545 | Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for intr... | 03/06/2007 |
| 7151671 | Power supply A power supply comprising switching elements (20), wherein the power supply is provided with first heat sinks (30) having electrical conductivity to which the switching elements are fitted and a second heat sink (40) mounted with the first heat ... | 12/19/2006 |
| 7147051 | Cooling element The basis taken is a cooling element (1) made of a metal or of a metal alloy having at least one cooling rib (4) which is connected to a metal housing (11) for an operating means. The intention is to provide a cooling element (1) which ha... | 12/12/2006 |
| 7130196 | Apparatus and method for transferring heat from control devices A control device configured for mounting within an enclosure having a thermally conductive surface is disclosed. The control device includes a housing, a heat-generating device disposed within the housing, and a thermal conductor. The thermal conductor has a first p... | 10/31/2006 |
| 7097914 | Composite structural material, and method of producing the same A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first m... | 08/29/2006 |
| 7095615 | Environmentally tuned circuit card assembly and method for manufacturing the same A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an o... | 08/22/2006 |
| 7066741 | Flexible circuit connector for stacked chip module The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from a... | 06/27/2006 |
| 7057896 | Power module and production method thereof A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic components; a heat sink; and a member with insulation characteristics a... | 06/06/2006 |
| 7026708 | Low profile chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a variety of methods and materials. A consolidated low profile contact stru... | 04/11/2006 |
| 7004244 | Thermal interface wafer and method of making and using the same A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material f... | 02/28/2006 |
| 6980418 | Method and apparatus for controlling the temperature of electronic device enclosures An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduc... | 12/27/2005 |
| 6956739 | High temperature stable thermal interface material A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is confo... | 10/18/2005 |
| 6940729 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 09/06/2005 |
| 6919507 | Electrical assembly and method for manufacturing the electrical assembly An electrical assembly including an electrical circuit situated in a housing, and a method for the manufacture of such an assembly, in which the electrical circuit is covered at least partially with a protective layer, wherein the protective layer has first and seco... | 07/19/2005 |
| 6919626 | High density integrated circuit module The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external po... | 07/19/2005 |
| 6914324 | Memory expansion and chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with th... | 07/05/2005 |
| 6909602 | Temperature-controlled user interface A system, includes a user input device, a temperature changing unit coupled to the user input device, and a controller, coupled to the temperature changing unit, for controlling the temperature of the user input device. ... | 06/21/2005 |
| 6831834 | Assembly process and heat sink design for high powerd processor The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface o... | 12/14/2004 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6778398 | Thermal-conductive substrate package A substrate material for mounting an integrated circuit contains a non-electrically-conductive mesh of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces that ar... | 08/17/2004 |
| 6627989 | Semiconductor device and method for manufacturing same To provide a semiconductor device that is capable of transmitting heat evolved in an active element efficiently to a heat sink member, and a manufacturing method for the semiconductor device. One of the terminals (such as drain electrode) of an active ele... | 09/30/2003 |
| 6625027 | Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers ar... | 09/23/2003 |
| 6587344 | Mounting system for high-voltage semiconductor device A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and... | 07/01/2003 |
| 6549025 | System and method for thermal testing of circuit boards using thermal films A burn-in board and a method for thermally testing the burn-in board determines if the burn-in board is defective. The burn-in board includes components on a front side of the burn-in board and thermal tape on the back side of the burn-in board. Power and... | 04/15/2003 |
| 6549409 | Power converter assembly A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative sem... | 04/15/2003 |
| 6538878 | Bus bar assembly The present invention relates to a bus bar assembly comprising a high power transistor module directly mounted to a bus bar. The bus bar has an improved solderability characteristic and is designed so that a solid, effective soldered connection results du... | 03/25/2003 |
| 6537351 | Compact light weight condenser assembly A gas stream moisture condenser assembly for use in a fuel cell power plant includes a gas stream flow path which is formed from a monolithic open cell foam body. The foam body is preferably formed from a high temperature material such as stainless steel,... | 03/25/2003 |
