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| Number | Title | Issue Date |
| 7974097 | Printed circuit board and heat sink A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from... | 07/05/2011 |
| 7796392 | Electronic construction unit and electrical circuit carrier An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanicall... | 09/14/2010 |
| 7420216 | Reflection type light-emitting diode device A reflection type light-emitting diode device of a kind capable of emitting rays of light to the outside after having been reflected by a reflecting surface includes a recessed casing (22) having a cavity defining the reflecting surface (15) and also h... | 09/02/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7375963 | System and method for cooling a module Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of n... | 05/20/2008 |
| 7372704 | Heat dissipating structure for IC chip of plasma display module and plasma display module having the same A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The... | 05/13/2008 |
| 7349214 | Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of... | 03/25/2008 |
| 7342783 | Portable computer with docking station A portable computer system having a computer body and a display unit coupled to the computer body includes a docking station to be connectable to and disconnectable from the computer body, a heat discharging member provided on the computer body to cool a heat genera... | 03/11/2008 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of t... | 02/19/2008 |
| 7312525 | Thermally enhanced package for an integrated circuit A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channe... | 12/25/2007 |
| 7304852 | Inverter apparatus An inverter assembly including a storage compartment for multiple cables adapted to be releasably connected to the inverter. A body of the inverter assembly includes interior and exterior fins for the dissipation of heat energy. ... | 12/04/2007 |
| 7283363 | Computer casing A computer casing has a frame, two fixing panels arranged inside the frame, and two side panels assembled on opposing sides of the frame. The frame, the fixing panels and the side panels are all made of aluminum. The frame includes a top panel, a bottom panel, a fro... | 10/16/2007 |
| 7223681 | Interconnection pattern design An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the i... | 05/29/2007 |
| 7218523 | Liquid cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat... | 05/15/2007 |
| 7199461 | Semiconductor package suitable for high voltage applications A semiconductor package has a structure in which a leadframe pad to which a semiconductor die is attached and inner leads electrically connected to the leadframe pad are covered by a molded housing, and outer leads extending from the inner leads protrude from a side... | 04/03/2007 |
| 7164587 | Integral heatsink grounding arrangement An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shield... | 01/16/2007 |
| 7158381 | Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink... | 01/02/2007 |
| 7132698 | Compression assembled electronic package having a plastic molded insulation ring A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ri... | 11/07/2006 |
| 7126823 | Locking device for heat dissipating device A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer ... | 10/24/2006 |
| 7102217 | Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical attachment, as by wire bonding, to conductive traces on the opposite side of ... | 09/05/2006 |
| 7091820 | Methods for manufacturing resistors using a sacrificial layer A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface,... | 08/15/2006 |
| 7085136 | Heat duct-equipped heat-radiating device for power supply A heat duct-equipped heat-radiating device for power supply, including: a heat conductive board tightly attached to a heat source of the power supply; a heat duct tightly bridged over the heat conductive board, one end of the heat duct outward protruding from the ho... | 08/01/2006 |
| 7084490 | Leads under chip IC package A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantia... | 08/01/2006 |
| 7064428 | Wafer-level package structure A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed with a chip and a conductive layer. The conductive layer is arranged... | 06/20/2006 |
| 7026664 | DC-DC converter implemented in a land grid array package A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least ... | 04/11/2006 |
| 7027303 | Electronic power module The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically anti-parallel manner and which are clamped between two metal bars, havin... | 04/11/2006 |
| 7016192 | Electrical power converter method and system employing multiple-output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 03/21/2006 |
| 7006354 | Heat radiating structure for electronic device A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is located between the electronic part and the heat spreader and having a coef... | 02/28/2006 |
| 6965515 | Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks A base station for a wireless communications system having a tower-mounted amplifier system with a low-noise amplifier transistor and a thermoelectric cooler that reduces the operating temperature of the low-noise amplifier transistor. The amplifier system has addit... | 11/15/2005 |
| 6963265 | Ball grid array resistor network having a ground plane A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and... | 11/08/2005 |
| 6956446 | Nonreciprocal device having heat transmission arrangement An isolator with resistive termination and carbon steel housing wherein required magnetic performance is combined with improved efficiency of transmission of heat from termination to the heat sink. The improvement is achieved due to the copper/aluminum plug that mec... | 10/18/2005 |
| 6924983 | Heat sink fan A heat sink fan comprises a heat sink (2) including a base member (21) and a plurality of thin heat radiating fins (22) fixed thereto, and a fan case (1) for supporting an axial flow fan (18) that induces air flow for cooling the h... | 08/02/2005 |
| 6909614 | Power backplane for power electronic devices A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isol... | 06/21/2005 |
| 6865083 | Clip for heat sink A clip (30) for securing a heat sink (40) to an electronic device (52) includes a pin (32) and a pressing member (34), each of which are integrally formed by stamping sheet metal. The pin includes a cylindrical body having a vertic... | 03/08/2005 |
| 6861622 | Negative temperature coefficient thermistor and method for manufacturing the same A negative temperature coefficient thermistor includes a thermistor element containing a transition metal oxide as a main component; internal electrodes disposed in the thermistor element; and external electrodes, electrically connected to the internal electrodes. A... | 03/01/2005 |
| 6836005 | Semiconductor device A semiconductor device includes a semiconductor package, a substrate provided under the semiconductor package, a metal substrate provided on the semiconductor package, and a fixing member positioning the semiconductor package and the metal substrate on the substrate... | 12/28/2004 |
| 6829149 | Placement of sacrificial solder balls underneath the PBGA substrate The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the pac... | 12/07/2004 |
| 6829143 | Heatsink retention apparatus Some disclosed embodiments include a retention apparatus having a unidirectional locking member, the unidirectional locking member defining a bore therethrough, a post disposed through the bore of the unidirectional locking member, wherein the post is adapted to be ... | 12/07/2004 |
| 6809935 | Thermally compliant PCB substrate for the application of chip scale packages A new method is provided for mounting a semiconductor on the surface of a Printed Circuit Board. A layer of Elastomer is deposifed on the surface face of the PCB, this layer of Elastomer makes the PCB into a thermally compliant PCB such that the thermal mismatch bet... | 10/26/2004 |
