Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 8169781 | Power supply and heat dissipation module thereof A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation pla... | 05/01/2012 |
| 7961471 | Image processing apparatus with heat dissipating structure An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on... | 06/14/2011 |
| 7952880 | Graphics card and heat dissipation method thereof A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the he... | 05/31/2011 |
| 7914940 | Fuel cell providing improved stack and cooling plate A fuel cell stack having an improved sealing structure of a cooling plate in which the cooling plates therein each have a coolant flow channel through which a coolant flows to remove heat from the fuel cell stack and a groove that surrounds the coolant flow channel,... | 03/29/2011 |
| 7855891 | Modular heat sinks for housings for electronic equipment A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components that generate heat. Thermal conductors or mesas contact the electrical... | 12/21/2010 |
| 7839641 | Condenser for power module and power module A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is... | 11/23/2010 |
| 7663885 | IC fixing structure The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through h... | 02/16/2010 |
| 7646608 | Heat transfer plate An apparatus for coupling a heat-generating device to a heat-removing device. The apparatus includes a thermally-conductive plate having a first side and a second side. The apparatus also includes a plurality of first channels that intersect with a plurality of seco... | 01/12/2010 |
| 7554809 | Heatsink assembly structure A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and a... | 06/30/2009 |
| 7468886 | Method and structure to improve thermal dissipation from semiconductor devices A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at lea... | 12/23/2008 |
| 7427148 | Light modules Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting el... | 09/23/2008 |
| 7423341 | Plastic overmolded packages with mechanically decoupled lid attach attachment The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug. ... | 09/09/2008 |
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cool... | 09/02/2008 |
| 7411648 | Liquid crystal display panel with heat radiation plate An auxiliary plate (10) is fixed to a rear plane of a housing for fixedly holding a lamp unit (6) having a plurality of lamps. In the auxiliary plate (10), a convex portion and a concave portion are combined. The convex portion has a space betwe... | 08/12/2008 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate phy... | 08/05/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7408779 | Heat-dissipating element with connecting structures A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening ... | 08/05/2008 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 07/15/2008 |
| 7393236 | Integrated thermal and electrical connection system for power devices An electrical system as described herein is suitable for use in an electric or hybrid vehicle. The electrical system includes electrical devices, such as power transistors, coupled to an electrically and thermally conductive bus bar. The respective nodes of the elec... | 07/01/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7342794 | Heat sink with integral card guide A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least on... | 03/11/2008 |
| 7339791 | CVD diamond enhanced microprocessor cooling system Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a... | 03/04/2008 |
| 7336493 | Cold plate cooling apparatus for a rack mounted electronic module Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower sur... | 02/26/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7277244 | Lens barrel for image taking lens A heat sink is attached to a subject-side end portion of a barrel body of a lens barrel. The heat sink is provided with a large number of radiation fins formed in whorl. A heat pipe is disposed between the heat sink and a mount-side end portion of the barrel body. A... | 10/02/2007 |
| 7277284 | Microchannel heat sink A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one ... | 10/02/2007 |
| 7272001 | External conductive heat dissipating device for microcomputers A conductive heat dissipating device for microcomputers includes a motherboard having an opening and a first electric connector installed adjacent to the front side of the opening, an adapter board having a second electric connector connected to the first electric c... | 09/18/2007 |
| 7266321 | Apparatus for supplying voltage to developing device A voltage supply device for developing devices of a color image forming apparatus has a printed circuit board (PCB) connected with a high voltage supply source, a plurality of fixed contact point terminals provided at one end of the respective color developing devic... | 09/04/2007 |
| 7265979 | Cooling integrated circuits using a cold plate with two phase thin film evaporation A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the co... | 09/04/2007 |
| 7254030 | Heat sink A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in co... | 08/07/2007 |
| 7239515 | Thermal assembly for cooling an electronics module A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat g... | 07/03/2007 |
| 7200006 | Compliant thermal interface for electronic equipment A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and he... | 04/03/2007 |
| 7193854 | Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the pr... | 03/20/2007 |
| 7164587 | Integral heatsink grounding arrangement An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shield... | 01/16/2007 |
| 7145774 | Backside cooling apparatus for modular platforms A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an open... | 12/05/2006 |
| 7145231 | Electronic apparatus The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a... | 12/05/2006 |
| 7133286 | Method and apparatus for sealing a liquid cooled electronic device A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate,... | 11/07/2006 |
| 7126825 | Combined chip/heat-dissipating metal plate and method for manufacturing the same A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Pre... | 10/24/2006 |
| 7111674 | Heat dissipating housing with interlocking chamfers and ESD resistance A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one ... | 09/26/2006 |
