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Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 8081467 | Electronics package including heat sink in the housing and related methods An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also i... | 12/20/2011 |
| 8081469 | Thermal interface material and method of using the same and electronic assembly having the same An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plu... | 12/20/2011 |
| 8081468 | Memory modules including compliant multilayered thermally-conductive interface assemblies According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly ... | 12/20/2011 |
| 8059409 | Avionics chassis An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the... | 11/15/2011 |
| 8009428 | Guiding apparatus A guiding apparatus for guiding a heat sink easily to be attached to a circuit board to cool an electronic element mounted on the circuit board and includes a seat, and a pair of guiding members. The heat sink includes a pair of fasteners movably attached thereto. A... | 08/30/2011 |
| 7995344 | High performance large tolerance heat sink A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foi... | 08/09/2011 |
| 7990717 | Heat sink and electronic device using same An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader ... | 08/02/2011 |
| 7990718 | Heat dissipation device having a clip assembly A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom for in contact with the electronic component. The wire clip includes a... | 08/02/2011 |
| 7990716 | Heat sink structure and test head with same A heat sink structure having an improved heat radiation efficiency is disclosed. The heat sink structure comprises a plate-shaped heat sink having a top surface and a bottom surface, wherein through holes along a planar direction of a board are formed between the to... | 08/02/2011 |
| 7969743 | Heat sink assembly with temperature display A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog sig... | 06/28/2011 |
| 7940528 | Electronic device and heat sink thereof An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable the... | 05/10/2011 |
| 7924567 | Heat dissipation device A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion,... | 04/12/2011 |
| 7924566 | Heat dissipation device A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and r... | 04/12/2011 |
| 7924568 | Heat sink device with a shielding member A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic ... | 04/12/2011 |
| 7916485 | Fin-type heat sink and electronic device using same A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the ... | 03/29/2011 |
| 7916484 | Heat sink having enhanced heat dissipation capacity A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic ... | 03/29/2011 |
| 7907411 | Heat sink assembly having interdigitated cooling fins A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal cont... | 03/15/2011 |
| 7903416 | Flat panel display A flat panel display including a base frame, a display panel module, and a heat-conductive structure is provided. The base frame includes a control unit. The display panel module is disposed in the base frame and includes a back bracket, a first heating element, and... | 03/08/2011 |
| 7903415 | Airflow guider for use in heat sink An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise for... | 03/08/2011 |
| 7898809 | Heat sink and method of manufacturing the same A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mo... | 03/01/2011 |
| 7885077 | Solderless heatsink anchor A heatsink may be releasably secured to a substructure of an electronic system, such as a circuit board, in engagement with a heat-generating component, such as a processor. One embodiment provides an anchor that includes an anchor body, a hook coupled to the anchor... | 02/08/2011 |
| 7869217 | Toolless locking device A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located a... | 01/11/2011 |
| 7835152 | Heat dissipating module A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure inc... | 11/16/2010 |
| 7813133 | Semiconductor device A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to ... | 10/12/2010 |
| 7808789 | Structure and method to form a heat sink The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat ... | 10/05/2010 |
| 7768784 | Heat dissipation assembly A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention modul... | 08/03/2010 |
| 7755900 | Heat dissipating module A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting o... | 07/13/2010 |
| 7755898 | Semiconductor module and inverter device A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow fo... | 07/13/2010 |
| 7755899 | Miniaturized high conductivity thermal/electrical switch The present invention is a thermally controlled switch with high thermal or electrical conductivity. Microsystems Technology manufacturing methods are fundamental for the switch that comprises a sealed cavity formed within a stack of bonded wafers, wherein the upper... | 07/13/2010 |
| 7746647 | Clip and heat dissipation assembly using the same A clip (50) for securing a heat dissipating device to a heat source comprises a spring arm (510) and an ear (530). The spring arm comprises two wires (512) substantially parallel to each other, a hook (514) formed at one end of the... | 06/29/2010 |
| 7742306 | LED lamp with a heat sink assembly An LED lamp includes a first heat sink, a pair of second heat sinks arranged at two opposite sides of the first heat sink, a plurality of heat pipes connecting the first heat sink to the pair of second heat sinks, and an LED module mounted on the first heat sink. Wi... | 06/22/2010 |
| 7733654 | Heat dissipation module A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the ba... | 06/08/2010 |
| 7729122 | Fastener for heat sinks A fastener includes a rod and a sleeve. The rod has a flat top for depression and a rod body extending downwardly from the flat top. The upper end of the rod body is provided with a circular groove. The sleeve is formed with a through hole and a flange close to its ... | 06/01/2010 |
| 7719840 | Heat sink assembly having a fixing base thereof A heat sink assembly includes a fixing base and a heat sink mounted on the fixing base. The fixing base has a bottom face attached to an electronic component mounted on a printed circuit board. The fixing base includes a pair of hooks extending from a rear side ther... | 05/18/2010 |
| 7710727 | Heat sink assembly A heat sink assembly for an add-on card includes a heat sink and a clip received in the heat sink. The heat sink includes a supporting plate and a first and a second heat absorbing plates extending downwardly from the supporting plate. The first and second heat abso... | 05/04/2010 |
| 7672135 | Heat sink A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange. ... | 03/02/2010 |
| 7660123 | Heat dissipating fin assembly for clamping dynamic random access memory to dissipate heat An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the he... | 02/09/2010 |
| 7656668 | Secure device for a heat sink and CPU A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle ... | 02/02/2010 |
| 7646607 | Quasi-radial heatsink with rectangular form factor and uniform fin length In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermal... | 01/12/2010 |
| 7643299 | Clip for heat sink A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of ... | 01/05/2010 |
