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| Number | Title | Issue Date |
| 7667972 | Connector with a heat sink A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a... | 02/23/2010 |
| 7613003 | Electrical connector A high voltage electrical connector includes a connector body. A first connector is supported within the connector body. A second connector is supported within the connector body and electrically connected to the first connector. A high voltage circuit protection de... | 11/03/2009 |
| 7606032 | Structural screw secure device for a radiator assembly A structural screw device for a radiator assembly includes a frame and four screw members. The frame with four corners provides at least a leg post with an axial through hole respectively. The respective screw member is inserted into the leg post and the main body o... | 10/20/2009 |
| 7583504 | Cooling assembly A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic co... | 09/01/2009 |
| 7567438 | Heat sink with precompressed bias member A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member... | 07/28/2009 |
| 7525803 | Power converter having multiple layer heat sinks A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configure... | 04/28/2009 |
| 7515421 | Electronic device comprising secure heat dissipation A multi-component housing including a housing shell and a housing lid is disclosed. A support plate that is fitted with at least one power electronics component is disposed on a base plate of the housing shell. The housing lid supports a mounting device for fastenin... | 04/07/2009 |
| 7515422 | Electric power converter The present invention provides an electric power converter in which a tip portion of a cooling fin on an air flow inlet side is limited to flow a large quantity of air around a connection portion, where the fin efficiency is high, of a base surface of the cooling fi... | 04/07/2009 |
| 7505273 | Cooling body and rectifier module for an electrical machine A heat sink, in particular for a rectifier unit of an electrical machine has at least one diode opening, and disposed around the at least one diode opening at least partially ring-shaped cooling air openings and at least one mass-increasing raised area, wherein the ... | 03/17/2009 |
| 7443678 | Flexible circuit board with heat sink A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface... | 10/28/2008 |
| 7443683 | Cooling apparatus for electronic devices In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core s... | 10/28/2008 |
| 7443682 | Computer system A computer system includes a chassis (10), a securing panel (30), a motherboard (20), and a heat sink (40). The chassis includes a plate (12) having at least one positioning post (14) extending upwardly therefrom. The securi... | 10/28/2008 |
| 7443680 | Heat dissipation apparatus for heat producing device A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced a... | 10/28/2008 |
| 7443023 | High capacity thin module system Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry ... | 10/28/2008 |
| 7443684 | Heat sink apparatus The present invention relates to a heat sink apparatus, which discloses that by using a meshed member as a heat sink member, the heat-sinking efficiency will be enhanced owing to increased surface areas. Furthermore, a first linear member is made to contact with a s... | 10/28/2008 |
| 7440283 | Thermal isolation devices and methods for heat sensitive downhole components A device for isolating a heat sensitive component includes a heat sink positioned adjacent to the heat sensitive component. The heat sink has a stepped thermal response to an applied heat. The heat sink may include two or more thermally decoupled masses. Thermal dec... | 10/21/2008 |
| 7436670 | Heat sink retaining device A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating co... | 10/14/2008 |
| 7436671 | Retention module for a heat sink A retention module (10) for securing a heat sink (20) to a printed circuit board (30) includes a pair of carriage arms (12) separated by a space and a connecting wall (14) interconnecting opposite rear free ends of the carriage arm... | 10/14/2008 |
| 7430120 | Induction lighting system An improved induction lighting system is presented where the electronic power supply device powering the induction lamp is insulated and an extensive set of heat sink fins is provided to control the temperature of the power supply. Reduction of power supply device t... | 09/30/2008 |
| 7430122 | Electronic device assembly with clips for mounting a heat sink thereon An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has ... | 09/30/2008 |
| 7423880 | Secure device capable of engaging with a heat sink firmly A secure device for a heat sink includes a frame and a plurality of cylindrical posts. The frame provides a plurality of elongated projections at the inner side thereof. Each of the cylindrical posts is attached to the outer side of the frame. A plurality of split p... | 09/09/2008 |
| 7423882 | Rotating clip Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip int... | 09/09/2008 |
| 7423341 | Plastic overmolded packages with mechanically decoupled lid attach attachment The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug. ... | 09/09/2008 |
| 7423873 | Heat dissipation device having fan holder for attachment of a fan A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16... | 09/09/2008 |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7416789 | Refractory metal substrate with improved thermal conductivity A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second ... | 08/26/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7417860 | Heat dissipation device A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the ... | 08/26/2008 |
| 7414848 | Heat dissipation device A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat... | 08/19/2008 |
| 7414841 | Electronic cooling system having a ventilating duct A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) moun... | 08/19/2008 |
| 7411792 | Thermal switch, methods of use and manufacturing methods for same The present disclosure concerns embodiments of a thermal switch used to control the transfer of heat from a heat source to a heat sink. According to one aspect, the thermal switch can be activated, or turned “on”, so as to establish a path of low thermal resista... | 08/12/2008 |
| 7408777 | Plasma display device A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a circuit unit for supplying a driving signal to the panel, includes a cavity... | 08/05/2008 |
| 7408779 | Heat-dissipating element with connecting structures A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening ... | 08/05/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7408781 | Cooling device for memory chips A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit an... | 08/05/2008 |
| 7405448 | Semiconductor device having a resistance for equalizing the current distribution A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside th... | 07/29/2008 |
| 7405934 | Fan and cooling apparatus Holding arms of a frame member of a fan axially extend and project outward from both sides of a housing in a direction perpendicular to a rotational axis of the fan. Catch projections are provided on inner surface of the axial ends of the holding arms in a front-rea... | 07/29/2008 |
| 7403389 | Heat dissipation device A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by th... | 07/22/2008 |
| 7400050 | Quantum well thermoelectric power source A quantum well thermoelectric module providing very high conversion of heat energy in to electrical energy. In prefered embodiments the module provides electric power for monitoring, measuring or detecting any of a variety of things (such as temperature, smoke, othe... | 07/15/2008 |
| 7400239 | Universal control apparatus and methods Apparatus and methods for control of one or more functions within a premises. In one embodiment, the control apparatus comprises a “universal” electronic switch which can be configured according to any number of different desired functional and/or aesthetic sche... | 07/15/2008 |