Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
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| Number | Title | Issue Date |
| 8081466 | Overmolded electronics enclosure An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component... | 12/20/2011 |
| 8064203 | Process for preparing conductive films and articles prepared using the process A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the ma... | 11/22/2011 |
| 8059408 | Layered heat spreader and method of making the same A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z... | 11/15/2011 |
| 7969741 | Substrate structure It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. Th... | 06/28/2011 |
| 7907410 | Universal patterned metal thermal interface The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for couplin... | 03/15/2011 |
| 7869216 | Composite avionics chassis An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lo... | 01/11/2011 |
| 7859848 | Heat spreader and method of making the same A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z... | 12/28/2010 |
| 7808787 | Heat spreader and method of making the same A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z... | 10/05/2010 |
| 7800908 | Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink The invention relates to a novel device made up of a heat source that is formed by at least one electrical or electronic component or is provided with such a component, a heat sink, and an intermediate layer which is located between the heat source and the heat sink... | 09/21/2010 |
| 7791888 | Electronic control apparatus An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a ci... | 09/07/2010 |
| 7613002 | Heat dissipation device A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output unit. The input interface is used for receiving an input signal, which... | 11/03/2009 |
| 7480145 | Thin, passive cooling system A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to t... | 01/20/2009 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7433187 | Heat spreader module A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the interme... | 10/07/2008 |
| 7394657 | Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pres... | 07/01/2008 |
| 7385812 | Method and apparatus for a thermally conductive packaging technique for cooling electronic systems A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The... | 06/10/2008 |
| 7382620 | Method and apparatus for optimizing heat transfer with electronic components A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Inc... | 06/03/2008 |
| 7372699 | Plasma display apparatus A plasma display apparatus includes a Plasma Display Panel (PDP). A thermal conductive sheet is attached to one side of the PDP, and a chassis base is connected to the side of the PDP on which the thermal conductive sheet has been attached. The chassis base can be a... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365988 | Cycling LED heat spreader A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting ... | 04/29/2008 |
| 7365983 | Grease protecting apparatus for heat sink A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to th... | 04/29/2008 |
| 7365985 | Memory module assembly including heat sink attached to integrated circuits by adhesive A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory dev... | 04/29/2008 |
| 7360365 | Thermoelectric heat pumps The thermoelectric heat pump comprises one or more thermoelectric modules having a hot side connected to a first heat exchanger and a cold side connected to a second heat exchanger, and is characterized in that it comprises a pair of elongated bar-like elements made... | 04/22/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7362588 | Flying capacitor type battery voltage detector In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS s... | 04/22/2008 |
| 7355849 | Non-metal mesh cover for metal chassis The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the... | 04/08/2008 |
| 7355853 | Module structure and module comprising it A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history... | 04/08/2008 |
| 7352584 | Diamond-like carbon coated devices Thermally dynamic housings and methods of utilizing and manufacturing such housings are disclosed and described. In one embodiment, a thermally dynamic housing is provided which encloses and cools an area containing a heat source. The housing may include a metal lay... | 04/01/2008 |
| 7349215 | Aerogel/PTFE composite insulating material A material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder is formed having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. The material is moldable or formable, having little or no shedding of filler par... | 03/25/2008 |
| 7342793 | Aerogel/PTFE composite insulating material A material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder is formed having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. The material is moldable or formable, having little or no shedding of filler par... | 03/11/2008 |
| 7330354 | Mobile terminal device and method for radiating heat therefrom In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the elec... | 02/12/2008 |
| 7326857 | Method and structure for creating printed circuit boards with stepped thickness A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the bre... | 02/05/2008 |
| 7324343 | Thermally conductive holder The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubbe... | 01/29/2008 |
| 7319592 | Recyclable protective cover for a heat-conductive medium A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, a... | 01/15/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7312996 | Heat sink for memory strips A heat sink for memory strips comprises two heat transfer plates respectively attached on two sides of a memory strip. The upper edges of the heat transfer plates are further provided with retaining tongues and retaining rings. The extended portion of the combined h... | 12/25/2007 |
| 7312985 | Cooler of notebook personal computer and fabrication method thereof Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated from a heat generation device of the notebook personal computer; a cool... | 12/25/2007 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
