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| Number | Title | Issue Date |
| 7613002 | Heat dissipation device A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output unit. The input interface is used for receiving an input signal, which... | 11/03/2009 |
| 7480145 | Thin, passive cooling system A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to t... | 01/20/2009 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7433187 | Heat spreader module A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the interme... | 10/07/2008 |
| 7394657 | Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pres... | 07/01/2008 |
| 7385812 | Method and apparatus for a thermally conductive packaging technique for cooling electronic systems A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The... | 06/10/2008 |
| 7382620 | Method and apparatus for optimizing heat transfer with electronic components A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Inc... | 06/03/2008 |
| 7372699 | Plasma display apparatus A plasma display apparatus includes a Plasma Display Panel (PDP). A thermal conductive sheet is attached to one side of the PDP, and a chassis base is connected to the side of the PDP on which the thermal conductive sheet has been attached. The chassis base can be a... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365988 | Cycling LED heat spreader A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting ... | 04/29/2008 |
| 7365983 | Grease protecting apparatus for heat sink A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to th... | 04/29/2008 |
| 7365985 | Memory module assembly including heat sink attached to integrated circuits by adhesive A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory dev... | 04/29/2008 |
| 7360365 | Thermoelectric heat pumps The thermoelectric heat pump comprises one or more thermoelectric modules having a hot side connected to a first heat exchanger and a cold side connected to a second heat exchanger, and is characterized in that it comprises a pair of elongated bar-like elements made... | 04/22/2008 |
| 7362588 | Flying capacitor type battery voltage detector In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS s... | 04/22/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7355849 | Non-metal mesh cover for metal chassis The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the... | 04/08/2008 |
| 7355853 | Module structure and module comprising it A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history... | 04/08/2008 |
| 7352584 | Diamond-like carbon coated devices Thermally dynamic housings and methods of utilizing and manufacturing such housings are disclosed and described. In one embodiment, a thermally dynamic housing is provided which encloses and cools an area containing a heat source. The housing may include a metal lay... | 04/01/2008 |
| 7349215 | Aerogel/PTFE composite insulating material A material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder is formed having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. The material is moldable or formable, having little or no shedding of filler par... | 03/25/2008 |
| 7342793 | Aerogel/PTFE composite insulating material A material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder is formed having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. The material is moldable or formable, having little or no shedding of filler par... | 03/11/2008 |
| 7330354 | Mobile terminal device and method for radiating heat therefrom In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the elec... | 02/12/2008 |
| 7326857 | Method and structure for creating printed circuit boards with stepped thickness A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the bre... | 02/05/2008 |
| 7324343 | Thermally conductive holder The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubbe... | 01/29/2008 |
| 7319592 | Recyclable protective cover for a heat-conductive medium A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, a... | 01/15/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7312996 | Heat sink for memory strips A heat sink for memory strips comprises two heat transfer plates respectively attached on two sides of a memory strip. The upper edges of the heat transfer plates are further provided with retaining tongues and retaining rings. The extended portion of the combined h... | 12/25/2007 |
| 7312985 | Cooler of notebook personal computer and fabrication method thereof Disclosed is a cooler of a notebook personal computer allowing more much heat to be rapidly discharged to the outside. The cooler includes: a heat absorbing part fan for absorbing heat generated from a heat generation device of the notebook personal computer; a cool... | 12/25/2007 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7303005 | Heat spreaders with vias Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the g... | 12/04/2007 |
| 7295433 | Electronics assembly having multiple side cooling and method An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device p... | 11/13/2007 |
| 7295438 | Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a high heat generation rate contacts with the heat transfer part of th... | 11/13/2007 |
| 7292441 | Thermal solution for portable electronic devices A thermal solution for a portable electronic device, which is positioned between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the ... | 11/06/2007 |
| 7289331 | Interposable heat sink for adjacent memory modules A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first... | 10/30/2007 |
| 7287873 | Hermetically sealed flashlight assembly A lighting assembly that incorporates a high brightness LED in a compact assembly that is sealed and sufficiently durable for a continuous operational range of between 350 feet below sea level and 35,000 feet above sea level. Further, the flashlight of the present i... | 10/30/2007 |
| 7280359 | Heat-radiating structure of electronic apparatus In a heat-radiating structure HRS1 in which heat generated in a heat-generating component built in a housing of an electronic apparatus is conducted to the outside, the central portion of a flexible graphite sheet that is folded and shaped so as to be elastic... | 10/09/2007 |
| 7273987 | Flexible interconnect structures for electrical devices and light sources incorporating the same A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at le... | 09/25/2007 |
| 7272015 | Electronic unit with EMC shielding To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and elect... | 09/18/2007 |
| 7271347 | Wired circuit board A wired circuit board is provided having excellent heat radiation characteristics, including when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. An insulating base layer defines a base opening portion in a mounting r... | 09/18/2007 |