Bizarre Patents
Mouse device with a built-in printer
A mouse device for use as an input device of a computer is provided that includes a housing in which recording paper is loadable, and a printer unit provided within the housing for printing on the recording paper print information received from the computer.
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| Number | Title | Issue Date |
| 7667971 | Electronic control device and method of manufacturing electronic control device Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power devi... | 02/23/2010 |
| 7394665 | LSI package provided with interface module and method of mounting the same In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals o... | 07/01/2008 |
| 7369398 | Terminal box and a method of providing it Terminal plates (30) are juxtaposed on a base plate (11) for electrically connecting positive and negative electrodes of a solar battery module (90) to cables (80) for external connection. A rectifying device (50) spans between adj... | 05/06/2008 |
| 7365965 | Terminal box for a solar battery module, a rectifying-device unit A terminal box for a solar battery module is provided with a plurality of terminal plates (30) juxtaposed on a base plate (11) and connectable with positive and negative electrodes of the solar battery module, cables for external connection connectable... | 04/29/2008 |
| 7355502 | Direct relay connection to a fusible link An assembly provides a direct electrical connection between a relay and a fusible link on the surface of a vehicle junction block. A fuse housing for the fusible link has a first, female terminal located near a top portion of the fuse housing. The first terminal is ... | 04/08/2008 |
| 7342707 | Indicators and illuminators using a semiconductor radiation emitter package A vehicle lamp assembly includes a housing and an LED lamp carried in the housing. A signal mirror includes a mirror and an LED lamp. The LED lamp includes a heat extraction member. ... | 03/11/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7313001 | Electrical switch having a mount for an electrical circuit The invention relates to an electrical circuit arrangement (3) having electrical and/or electronic components (4). The components (4) are arranged on a mount substrate (5). The conductor tracks (6) for electrical connection of the ... | 12/25/2007 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7295438 | Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a high heat generation rate contacts with the heat transfer part of th... | 11/13/2007 |
| 7282789 | Back-to-back semiconductor device assemblies A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semicond... | 10/16/2007 |
| 7276387 | Castellation wafer level packaging of integrated circuit chips Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and, depending on the embodiment, input/output pads. The castellation blocks and i... | 10/02/2007 |
| 7264378 | Power surface mount light emitting die package A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power... | 09/04/2007 |
| 7258808 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the ... | 08/21/2007 |
| 7254031 | Display apparatus having heat dissipating structure for driver integrated circuit A display apparatus having a heat dissipating structure for a driver integrated circuit is provided. The display apparatus may be a plasma display apparatus including a chassis base, a plasma display panel (PDP) adjacent to a first side of the chassis base, and a dr... | 08/07/2007 |
| 7254034 | Thermal management for shielded circuit packs A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components... | 08/07/2007 |
| 7215545 | Liquid cooled diamond bearing heat sink A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with t... | 05/08/2007 |
| 7203071 | Component mounting circuit board with resin-molded section covering circuit pattern and inner components A component mounting circuit board includes a circuit pattern including a plurality of electrically conductive plates, an inner electrical component electrically connected to the circuit pattern, and a resin molded section made of a resin by way of molding so as to ... | 04/10/2007 |
| 7180750 | Structure for preventing stacking connectors on boards from coming apart and electronic device A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member.... | 02/20/2007 |
| 7176063 | High density 3-D integrated circuit package A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fi... | 02/13/2007 |
| 7172927 | Warpage control of array packaging During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-in... | 02/06/2007 |
| 7172711 | Interface materials and methods of production and use thereof An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as... | 02/06/2007 |
| 7147051 | Cooling element The basis taken is a cooling element (1) made of a metal or of a metal alloy having at least one cooling rib (4) which is connected to a metal housing (11) for an operating means. The intention is to provide a cooling element (1) which ha... | 12/12/2006 |
| 7132313 | Diamond heat spreading and cooling technique for integrated circuits A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the... | 11/07/2006 |
| 7128623 | Tab terminal A tab terminal, capable of being mounted in a parts mounting space on a printed circuit board which is small in height, includes a terminal body, an extension portion formed integrally with the terminal body so as to extend from one end edge of the terminal body in ... | 10/31/2006 |
| 7094459 | Method for cooling electronic components and thermally conductive sheet for use therewith A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The ins... | 08/22/2006 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to as... | 08/08/2006 |
| 7078254 | LED package die having a small footprint A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coup... | 07/18/2006 |
| 7048451 | Optical transceiver and optical module used in the same The optical module includes a main housing to which the optical fiber can be attached and a light-emitting component and a light-receiving component attached to the main housing. At least a part of a surface of the main housing has an irregular pattern to enhance a ... | 05/23/2006 |
| 7027304 | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and cond... | 04/11/2006 |
| 6958533 | High density 3-D integrated circuit package A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fi... | 10/25/2005 |
| 6949838 | Integrated circuit device The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a synchronous-link dynamic random access memory edge-mounted device. According to... | 09/27/2005 |
| 6946190 | Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di... | 09/20/2005 |
| 6836014 | Optical testing of integrated circuits with temperature control Method and apparatus for optically testing (e.g., using a laser beam) an operating integrated circuit (device under test—DUT) that actively control the operating temperature of the DUT. This is chiefly useful with flip-chip packaged ICs. The temperature of the DUT... | 12/28/2004 |
| 6819562 | Cooling apparatus for stacked components A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards.... | 11/16/2004 |
| 6801420 | Selective potting for controlled failure and electronic devices employing the same A selectively protected electrical system includes or operates with a power source, a load, a power driver circuit for controllably transferring power from the power source to the load, the power driver circuit being encapsulated in a potting material, and a control... | 10/05/2004 |
| 6788540 | Optical transceiver cage The present invention relates to a cage for holding an optical transceiver module in electrical contact with a host circuit board. The cage includes front, middle and rear sections, and facilitates the insertion of the optical transceiver into the cage, as well as p... | 09/07/2004 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6780927 | Non-silicone conductive paste for the electrical industry, and its use A conductive paste based on an elastomer of the polyoxypolyolefin type or on a member of the polyolefin family is described, provided with an admixture of conductive particles for the production, in the electronics industry, of a sealing element, of a contact elemen... | 08/24/2004 |
| 6778398 | Thermal-conductive substrate package A substrate material for mounting an integrated circuit contains a non-electrically-conductive mesh of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces that ar... | 08/17/2004 |
