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| Number | Title | Issue Date |
| 8125781 | Semiconductor device A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expo... | 02/28/2012 |
| 8081463 | Water-cooled communication chassis A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a f... | 12/20/2011 |
| 8059407 | Control device for a motor vehicle For a motor vehicle control device, a housing lid and a base plate form a hollow area that contains an interconnect device arranged on the inner side of the housing lid. The housing lid has at least one opening surrounding the interconnect device, adjacent to an ele... | 11/15/2011 |
| 8031465 | Electronic apparatus The invention discloses an electronic apparatus comprising a motherboard, a connector, a card member and a first holder. The connector is disposed on the motherboard and the card member is disposed on the connector. The motherboard comprises a first fixing portion a... | 10/04/2011 |
| 8023266 | AC photovoltaic module and inverter assembly An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and ... | 09/20/2011 |
| 8000103 | Cooling system for contact cooled electronic modules Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components.... | 08/16/2011 |
| 7986528 | Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant introducing and discharging ports disposed side by side on an outer surface of ... | 07/26/2011 |
| 7948758 | Circuit board unit and method for production thereof The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate f... | 05/24/2011 |
| 7916483 | Open flow cold plate for liquid cooled electronic packages A method and associated assembly is provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold p... | 03/29/2011 |
| 7859846 | Low thermal resistance power module assembly A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate f... | 12/28/2010 |
| 7843695 | Apparatus and method for thermal management using vapor chamber An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least ... | 11/30/2010 |
| 7751191 | Technique for cooling a device A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat so... | 07/06/2010 |
| 7742304 | Control device housing for an electronic brake A control device housing for an electronic brake system includes a lid, a housing part closable by the lid, a component support member for electronic components, and a cooling element that is in direct or indirect thermal contact with at least part of the electronic... | 06/22/2010 |
| 7719839 | Heat conduction apparatus providing for selective configuration for heat conduction In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response ... | 05/18/2010 |
| 7706143 | Mounting plate for electronic components A mounting plate for electronic components, including cooling conduits that are integrated into a plate body and that are traversed by a coolant, a fixing device for mounting electronic components that are to be cooled being located on the plate body. The mounting p... | 04/27/2010 |
| 7672132 | Electronic packaging apparatus and method An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conducti... | 03/02/2010 |
| 7639500 | Mounting plate for electronic components A mounting plate for electronic components, including cooling conduits that are integrated into a plate body and that are traversed by a coolant, and a fixing device for mounting the electronic components being located on the plate body. The fixing device includes a... | 12/29/2009 |
| 7518870 | Card slot apparatus having a movable heat radiating unit and electronic machine having the same A card slot apparatus of a card and an electronic machine includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart from the card and a second position contacting the card. A moving unit m... | 04/14/2009 |
| 7518871 | Liquid-based cooling system for cooling a multi-component electronics system A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cool... | 04/14/2009 |
| 7515418 | Adjustable height liquid cooler in liquid flow through plate An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An exampl... | 04/07/2009 |
| 7511960 | Balanced chilled fluid cooling system for a data center in a shipping container A movable data center is disclosed that comprises a movable enclosure having partitions that define a closed-loop air flow path. A plurality of fans and a plurality of data processing modules are disposed in the air flow path. A pipe network is disposed within the e... | 03/31/2009 |
| 7499279 | Cold plate stability A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate... | 03/03/2009 |
| 7495916 | Low cost cold plate with film adhesive An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which ... | 02/24/2009 |
| 7477516 | Air cooled computer chip A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the co... | 01/13/2009 |
| 7443677 | Heat dissipation device A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat... | 10/28/2008 |
| 7440261 | Power regulator with a bypass and splice capability A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a conductive resilient tab and a conductive rigid tab. The cooling fins are ... | 10/21/2008 |
| 7433193 | Techniques for controlling a position of a transceiver module relative to a connector An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a transceiver module space. The rail further includes a blocking struc... | 10/07/2008 |
| 7430121 | Heat sink fastener A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The... | 09/30/2008 |
| 7430119 | Impeller and aligned cold plate According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle.... | 09/30/2008 |
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cool... | 09/02/2008 |
| 7417857 | Power-electronic-cooling device A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the invention, the cooling circuit can include deflectors and/or turbulato... | 08/26/2008 |
| 7414845 | Circuit board assembly for a liquid submersion cooled electronic device A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, the... | 08/19/2008 |
| 7414844 | Liquid cooled heat sink with cold plate retention mechanism A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient col... | 08/19/2008 |
| 7411790 | Heat sink with built-in heat pipes for semiconductor packages A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent por... | 08/12/2008 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate phy... | 08/05/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7405936 | Hybrid cooling system for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/29/2008 |
| 7400503 | Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented w... | 07/15/2008 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/15/2008 |
| 7400507 | Fastening structure A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat spreader having its attached side connected to the heatsink module, he... | 07/15/2008 |
