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Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 8107234 | Variable flow computer cooling system for a data center and method of operation Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted ... | 01/31/2012 |
| 8102652 | Base for power module A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a h... | 01/24/2012 |
| 8102653 | Electric unit having capacitor A PCU has an inside sealed by a case made of aluminum and a bottom plate. Interior space of the PCU accommodates an IPM, a control substrate, and a capacitor. The IPM is provided to abut an upper surface of the bottom plate. The control substrate is a rectangular pl... | 01/24/2012 |
| 8094452 | Cooling and power grids for data center A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps ... | 01/10/2012 |
| 8094453 | Compliant conduction rail assembly and method facilitating cooling of an electronics structure Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail therma... | 01/10/2012 |
| 8094454 | Immersion cooling apparatus for a power semiconductor device An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid co... | 01/10/2012 |
| 8089765 | Extruded server case A liquid submersion cooled computer that includes a seamless, extruded main body used to form a liquid-tight case holding a cooling liquid that submerges components of the computer. By forming the main body as a seamless extrusion, the number of possible leakage pat... | 01/03/2012 |
| 8089764 | Case and rack system for liquid submersion cooling of electronic devices connected in an array A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, h... | 01/03/2012 |
| 8089766 | Server case with optical input/output and/or wireless power supply A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible f... | 01/03/2012 |
| 8085538 | Fluid-cooled electronic housing assembly and system A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCEHA and a plurality of electronic components. The FCEHA is capa... | 12/27/2011 |
| 8077460 | Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same A heat exchanger fluid distribution manifold includes a manifold body defining a coolant fluid chamber, a single fluid inlet, and a plurality of fluid outlets. The single fluid inlet is configured to introduce a coolant fluid into the coolant fluid chamber. The plur... | 12/13/2011 |
| 8059404 | Power inverters Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a fi... | 11/15/2011 |
| 8050036 | Liquid cooling unit and heat receiver therefor A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. An outflow nozzle has an inflow opening at the downstream end of the flow passage at a position outside the ... | 11/01/2011 |
| 8045329 | Thermal dissipation mechanism for an antenna According to one embodiment, a heat dissipation system includes an elongated radar absorbing member configured with a thermal dissipation mechanism. The radar absorbing member extends proximate a junction of a microwave antenna enclosure that houses an antenna and a... | 10/25/2011 |
| 8035972 | Method and apparatus for liquid cooling computer equipment A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above t... | 10/11/2011 |
| 8027162 | Liquid-cooled electronics apparatus and methods of fabrication Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel exten... | 09/27/2011 |
| 8027161 | Electronic power converter and mounting structure of semiconductor device An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wirin... | 09/27/2011 |
| 8018717 | Facility for cooling a detection device and detection device A facility is disclosed for cooling a detection device. In at least one embodiment, the facility includes at least one first cooling unit, through which a thermal contact to the detection device is able to be established and through which heat arising during operati... | 09/13/2011 |
| 8018718 | Multiple chip module cooling system and method of operation thereof Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooli... | 09/13/2011 |
| 8009419 | Liquid submersion cooling system A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electroni... | 08/30/2011 |
| 8009427 | Image display apparatus An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube tha... | 08/30/2011 |
| 8004841 | Method and apparatus of water cooling several parallel circuit cards each containing several chip packages A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the h... | 08/23/2011 |
| 8004831 | Orthogonally system arrangements for data center facility A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps ... | 08/23/2011 |
| 8004832 | Variable flow computer cooling system for a data center and method of operation Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted ... | 08/23/2011 |
| 8000102 | Apparatus and arrangement for housing voltage conditioning and filtering circuitry components for an electrostatic precipitator A unitary-enclosure housing apparatus and arrangement for protecting and cooling the high voltage electronic conditioning and filtering circuitry components used for providing a high-voltage waveform to an electrostatic precipitator device includes a hermetically se... | 08/16/2011 |
| 7995343 | Cooling unit and electronic device A cooling unit includes: a heat-radiating section in which a coolant flows and which radiates heat caught by the coolant; and a path where the coolant flows through the heat-radiating section; a pump on the path to cause the coolant to flow; and heat absorbing secti... | 08/09/2011 |
| 7990710 | Data center A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the ... | 08/02/2011 |
| 7990711 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured... | 08/02/2011 |
| 7983041 | Electric module The electric module includes a sealed enclosure (104), at least one item of electrical equipment (106) arranged in the sealed enclosure (104) and which, in operation, heats the atmosphere, and a secondary cooling circuit. The secondary circuit i... | 07/19/2011 |
| 7983040 | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant ... | 07/19/2011 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflow... | 07/12/2011 |
| 7978472 | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mo... | 07/12/2011 |
| 7978471 | Electric power conversion apparatus An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current ... | 07/12/2011 |
| 7978470 | Electronic apparatus A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these f... | 07/12/2011 |
| 7974095 | Power source apparatus A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is placed in the case in a state in which the fan is immersed in the coolin... | 07/05/2011 |
| 7969735 | Power converter The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semi... | 06/28/2011 |
| 7969736 | System for cooling memory modules DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the in... | 06/28/2011 |
| 7965508 | Cooling device for electronic component and power converter equipped with the same A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a hi... | 06/21/2011 |
| 7965510 | Power conversion apparatus and power module A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts which are screwed with bolts projecting from the rear face of the cooli... | 06/21/2011 |
| 7965509 | High performance dual-in-line memory (DIMM) array liquid cooling assembly and method A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally ... | 06/21/2011 |
