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| Number | Title | Issue Date |
| 7679909 | Integral swivel hydraulic connectors, door hinges, and methods and systems for their use The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies ... | 03/16/2010 |
| 7675751 | Frame-type computer cooling device A frame-type computer cooling device for installation in a host computer is provided. The host computer has a heat-generating source and a slot compartment. The slot compartment communicates with the inside of the host computer and the outside of the host computer. ... | 03/09/2010 |
| 7675748 | Disk array system A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read/write head, an... | 03/09/2010 |
| 7672130 | Heat dissipating device A heat dissipating device includes a sealed container having hollow floors and floor-spacing assemblies. Each floor-spacing assembly includes hollow spacing walls. Each hollow spacing wall extends from a respective hollow floor and is spaced apart from an adjacent o... | 03/02/2010 |
| 7672129 | Intelligent microchannel cooling A cooling system for a heat producing component includes a base having two or more cells. The cells may include microchannel passages. A pump system may be coupled to the base. The pump system may circulate fluid independently in each of two or more of the cells. Th... | 03/02/2010 |
| 7667969 | Pump structures integral to a fluid filled heat transfer apparatus Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted... | 02/23/2010 |
| 7660122 | Electrical apparatus, cooling system therefor, and electric vehicle An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial struct... | 02/09/2010 |
| 7652884 | Electronic apparatus including liquid cooling unit A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative... | 01/26/2010 |
| 7639499 | Liquid cooling apparatus and method for facilitating cooling of an electronics system Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level mani... | 12/29/2009 |
| 7639498 | Conductive heat transport cooling system and method for a multi-component electronics system A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate phy... | 12/29/2009 |
| 7619889 | Controllable heat transfer medium system and method for use with a circuit board A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the com... | 11/17/2009 |
| 7616443 | Cooling device for electrical power units of electrically operated vehicles A cooling device for an electrical power unit of electrically operated vehicles, comprising at least one power section and at least one control section. A first cooling circuit containing a heat exchanger with a low coolant temperature is provided mainly for cooling... | 11/10/2009 |
| 7609518 | Cooling computer components A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided betwee... | 10/27/2009 |
| 7609519 | Coolant control unit and cooled electronics system employing the same A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and secon... | 10/27/2009 |
| 7602608 | Narrow gap spray cooling in a globally cooled enclosure Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality o... | 10/13/2009 |
| 7599184 | Liquid cooling loops for server applications Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is... | 10/06/2009 |
| 7595987 | Heat dissipation assembly for computing devices Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing spe... | 09/29/2009 |
| 7593227 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of ... | 09/22/2009 |
| 7586747 | Scalable subsystem architecture having integrated cooling channels A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided be... | 09/08/2009 |
| 7580261 | Semiconductor cooling system for use in electric or hybrid vehicle A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling syste... | 08/25/2009 |
| 7564685 | Motherboards with integrated cooling A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that... | 07/21/2009 |
| 7561424 | Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method A device for cooling electronic components of a control unit in an unmanned flying vehicle. A container contains a liquid cooling medium. A temperature sensor is adapted to sense the temperature of the electronic components during the flight of the vehicle. A spraye... | 07/14/2009 |
| 7551441 | Heat dissipation assembly for computing devices An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor... | 06/23/2009 |
| 7551440 | System and method for cooling an electronic component A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one he... | 06/23/2009 |
| 7551438 | Information processing blade and information processing apparatus using the same An information processing blade computer includes a board having a blade structure such that the board is stored in a main body of an information processing apparatus; a part contained in a circuit which is mounted on the board to execute an process, wherein heat is... | 06/23/2009 |
| 7551439 | Fluid cooled electronic assembly An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the... | 06/23/2009 |
| 7548424 | Distributed transmit/receive integrated microwave module chip level cooling system A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive module... | 06/16/2009 |
| 7548425 | Heat-Receiving apparatus and electronic equipment A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body. ... | 06/16/2009 |
| 7545644 | Nano-patch thermal management devices, methods, & systems Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a hea... | 06/09/2009 |
| 7542292 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 06/02/2009 |
| 7542291 | Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct. | 06/02/2009 |
| 7539016 | Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to perm... | 05/26/2009 |
| 7529089 | Heat-dissipating device connected in series to water-cooling circulation system A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the no... | 05/05/2009 |
| 7522417 | Multi-mode fluid cooling system and method A cooling system and method that significantly improves spray evaporative cooling by using a mixture of cooling fluids having different boiling points. The cooling fluid mixture is sprayed onto a surface to be cooled. Efficient cooling with reduced cooling fluid vol... | 04/21/2009 |
| 7522418 | Electronic equipment and rack apparatus An electronic equipment has a heat-generating part therein. A housing accommodates component parts including the heat-generating part. A cooling-medium circulation system circulates a liquid internal cooling-medium between a heat-absorbing part and a heat-radiating ... | 04/21/2009 |
| 7518867 | Electronic device cooling device and electronic device cooling method An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device... | 04/14/2009 |
| 7515416 | Structures for holding cards incorporating electronic and/or micromachined components This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented parallel to one another. Each bay comprises a fin front-plate fabric... | 04/07/2009 |
| 7515415 | Embedded microchannel cooling package for a central processor unit An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU h... | 04/07/2009 |
| 7511957 | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orif... | 03/31/2009 |
| 7508670 | Thermally conductive shelf Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a ... | 03/24/2009 |