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| Number | Title | Issue Date |
| 7660121 | System of facilitating cooling of electronics racks of a data center employing multiple cooling stations A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and ... | 02/09/2010 |
| 7660120 | Power supply unit for an electrical appliance and method for making electrical power available at components of an electrical appliance In order to make a power supply unit available for an electrical appliance, in particular, for a computer, it is suggested that said electrical appliance has a fan device, wherein a radiator for a liquid cooling device is integrated into the power supply unit. ... | 02/09/2010 |
| 7558064 | Cooling apparatus The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attache... | 07/07/2009 |
| 7466548 | Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating component. The heat radiating portion radiates the heat generated by... | 12/16/2008 |
| 7457117 | System for controlling the temperature of electronic devices The system for controlling the temperature of electronic devices under test includes a housing, a seal, a heat-exchanger within the housing, and a Peltier module within the housing. The housing is configured to removably enclose an electronic device coupled to a pla... | 11/25/2008 |
| 7443677 | Heat dissipation device A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat... | 10/28/2008 |
| 7433188 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 10/07/2008 |
| 7430119 | Impeller and aligned cold plate According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle.... | 09/30/2008 |
| 7428150 | Computing platform component cooling with quick disconnect Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat dissipation device thermally coupled to a processor mounted on a printed circui... | 09/23/2008 |
| 7428152 | Localized thermal management system A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a plurality of thermal vias in thermal communication with the thermal manag... | 09/23/2008 |
| 7428151 | Cooling arrangement A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be co... | 09/23/2008 |
| 7417858 | Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced acr... | 08/26/2008 |
| 7414846 | Cooling structure for interface card A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat i... | 08/19/2008 |
| 7404261 | Dry-wet thermal management system A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the cha... | 07/29/2008 |
| 7403392 | Liquid submersion cooling system A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electroni... | 07/22/2008 |
| 7382616 | Cooling system for computer hardware The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is provided. The system is mountable to a first side of a circuit board. The... | 06/03/2008 |
| 7371056 | Fluid pump, cooling system and electrical appliance A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member... | 05/13/2008 |
| 7372698 | Electronics equipment heat exchanger system An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near ... | 05/13/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7369409 | Apparatus, method, and control program for cooling electronic devices A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a... | 05/06/2008 |
| 7369412 | Heat dissipation device A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-... | 05/06/2008 |
| 7365980 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate. ... | 04/29/2008 |
| 7365989 | Heat dissipating device for computer add-on cards A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecti... | 04/29/2008 |
| 7362582 | Cooling structure using rigid movable elements A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for ... | 04/22/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
| 7359198 | System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and... | 04/15/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7358440 | Rain shielded box for exiting through siding A mounting box for installation on an exterior wall of a building. The mounting box has a box-shaped structure having a substantially horizontally disposed top surface when in situ, a nailing flange around a perimeter of the box-shaped structure, a downwardly and ou... | 04/15/2008 |
| 7352577 | Liquid-cooled heat dissipation module A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump;... | 04/01/2008 |
| 7342789 | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few... | 03/11/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339792 | Graphics card apparatus with improved heat dissipating assemblies A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewith... | 03/04/2008 |
| 7339540 | Sparse and virtual array processing for rolling axle array system A radar signal processing system comprises a processor that determines a respective position of each of a plurality of radiating elements included in a radar array. Each radiating element has a respectively different motion vector from every other one of the plurali... | 03/04/2008 |
| 7333332 | Heatsink thermal module with noise improvement The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multipl... | 02/19/2008 |
| 7331185 | Heat radiator having a thermo-electric cooler A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected ... | 02/19/2008 |
| 7333331 | Power unit device and power converter device A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having... | 02/19/2008 |
| 7327574 | Heatsink module for electronic device A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The re... | 02/05/2008 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable ... | 01/29/2008 |
| 7321494 | Graphics card apparatus with improved heat dissipating mechanisms A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewith... | 01/22/2008 |
| 7320593 | Light emitting diode light source for curing dental composites Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed. ... | 01/22/2008 |