Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7349196 | Composite distributed dielectric structure A composite distributed dielectric structure includes one or more conductor layers, one or more dielectric layers distributed on the conductor layers, and one or more conductor traces distributed on the dielectric layers. One or more dielectric plates can be further... | 03/25/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7324324 | Multilayer electronic component and manufacturing method thereof A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one end face of the ceramic body, thereby contributing to the formation ... | 01/29/2008 |
| 7316755 | Method of producing multi-terminal type laminated ceramic electronic component In a method of producing a multi-terminal type laminated ceramic electronic component in which internal electrodes are embedded in a sintered ceramic member, and the internal electrodes have plural first lead-out electrodes led out to a first side surface and plural... | 01/08/2008 |
| 7292429 | Low inductance capacitor A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is el... | 11/06/2007 |
| 7291235 | Thermal dissipating capacitor and electrical component comprising same An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circui... | 11/06/2007 |
| 7281321 | Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric... | 10/16/2007 |
| 7277269 | Refractory metal nickel electrodes for capacitors A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed or add mixed with a refractory metal in an amount sufficient to raise the melting temperature of said conductive layer at least 1° C. above the melting t... | 10/02/2007 |
| 7275316 | Method of embedding passive component within via A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. ... | 10/02/2007 |
| 7273502 | Method for manufacturing capacitor A capacitor and a method for manufacturing the same provide a branched capacitor with a large capacitance and a super-slim structure. The method includes sintering a ceramic substrate; forming a plurality of troughs in the sintered ceramic substrate, the plurality o... | 09/25/2007 |
| 7263766 | Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers... | 09/04/2007 |
| 7215530 | High ESR low ESL capacitor In some embodiments, a capacitor includes a first conductive layer electrically coupled to a first terminal, a second conductive layer electrically coupled to a second terminal, a floated conductive layer disposed between the first and second conductive layers, and ... | 05/08/2007 |
| 7203055 | Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin ... | 04/10/2007 |
| 7188410 | Insertion of electrical component within a via of a printed circuit board A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed ... | 03/13/2007 |
| 7170737 | Window via capacitor A window via capacitor comprises a stacked multilayer configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. An alternative window via capacitor comprises a stacked configuration of a bottom window l... | 01/30/2007 |
| 7163844 | Monolithic common carrier A common carrier for forming multiple printheads thereon and method of forming thereof is described. The common carrier includes a carrier substrate for adhering a plurality of unprocessed, integrateable semiconductor chips. Once adhered, the carrier substrate is li... | 01/16/2007 |
| 7154374 | Plated terminations Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology... | 12/26/2006 |
| 7152291 | Method for forming plated terminations Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technolo... | 12/26/2006 |
| 7154736 | Ceramic multi-layer element and a method for the production thereof A method of manufacturing a ceramic component having multiple layers includes producing ceramic green foil comprised of PTC ceramic material, applying electrode paste containing tungsten onto areas of the ceramic green foil designated to be electrodes, alternately s... | 12/26/2006 |
| 7147835 | Oxide powder for dielectrics, method of manufacturing oxide powder for dielectrics, and multi-layer ceramic capacitor using the same Disclosed herein is a small particle oxide powder for dielectrics. The oxide powder has a perovskite structure, an average particle diameter [D50(μm)] of 0.3 μm or less, a particle size distribution of the average particle diameter within 3%, a particle size distr... | 12/12/2006 |
| 7141129 | Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the... | 11/28/2006 |
| 7142832 | High-frequency device A high-frequency device includes an antenna terminal, a signal line connected to the antenna terminal, a high-frequency signal processing circuit connected to the signal line, a capacitance element having one end connected to the signal line and other end grounded, ... | 11/28/2006 |
| 7139161 | Semiconductor device and method of manufacturing the same There are provides the steps of forming sequentially a first conductive film, a dielectric film, and a second conductive film on an insulating film, forming a first film on the second conductive film, forming a second film made of insulating material on the first fi... | 11/21/2006 |
| 7085872 | High frequency bus system A high frequency bus system which insures uniform arrival times of high-fidelity signals to the devices on the high frequency bus, despite the use of the bus on modules and connectors. A high frequency bus system includes a first bus segment having one or more devic... | 08/01/2006 |
| 7060144 | Ceramic capacitor and method for the manufacture thereof A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of... | 06/13/2006 |
| 7054136 | Controlled ESR low inductance multilayer ceramic capacitor A multilayer ceramic capacitor assembly capable of exhibiting low high-frequency inductance and a controlled equivalent series resistance (ESR) while maintaining a useful capacitance value includes respective pluralities of first and second electrode elements interl... | 05/30/2006 |
| 7054137 | Refractory metal nickel electrodes for capacitors A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed with a refractory metal in an amount sufficient to raise the melting temperature of said conductive layer at least 1° C. above the melting temperature of... | 05/30/2006 |
| 7014725 | Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer ... | 03/21/2006 |
| 6976238 | Circular vias and interconnect-line ends Some embodiments of the invention provide vias that are not in shape of quadrilaterals. In some embodiments, some or all vias are in shape of non-quadrilateral polygons, such as octagons and hexagons. In some embodiments, some or all vias have a circular shape. Some... | 12/13/2005 |
| 6964087 | Method for manufacturing dielectric ceramic layer and internal polar layer of multiple layer ceramic capacitors (MLCC) by vacuum sputtering A method for manufacturing the dielectric ceramic layer and the internal polar layer of the multiple layer ceramic capacitor by the vacuum sputtering process in which the dielectric ceramic layer and the internal polar layer of the MLCC has a finest thinness of 1˜5... | 11/15/2005 |
| 6960271 | Laminate-type dielectric device, a production method and an electrode paste material A laminate type dielectric device is formed by alternately laminating dielectric ceramic layers and electrode layers and integrally baking the laminate product. The electode layers are mainly made of an electrically conductive base metal material having greater stan... | 11/01/2005 |
| 6954350 | Ceramic layered product and method for manufacturing the same A ceramic layered product 10 includes a plurality of ceramic layers 12 including a metallic element and a plurality of metal layers 14a, 14b, each of which is arranged between the ceramic layers 12. The metallic layer... | 10/11/2005 |
| 6951139 | Tire sensor and method of assembly A stress sensor includes two capacitor plates held in a spaced-apart relationship by a connector block situated therebetween. The connector block includes a plurality of rods protruding from opposite connector block sides and extending into a respective capacitor pl... | 10/04/2005 |
| 6937458 | Selectable decoupling capacitors for integrated circuit and methods of use Selectable capacitors are used to modify performance characteristics of functional circuit elements of an integrated circuit (IC). In one embodiment, the decoupling capacitors are implemented as additional or alternative mounting pads on a surface of the IC. At leas... | 08/30/2005 |
| 6933256 | Dielectric ceramic composition, electronic device, and method for producing same A dielectric ceramic composition comprising at least a main component containing a dielectric oxide of a composition expressed by {(Sr1−xCax)O}m.(Ti1−yZry)O2 and a first subcomponent containing at... | 08/23/2005 |
| 6927966 | Conductive paste and laminated ceramic electronic component A laminated ceramic electronic component, for example, monolithic ceramic capacitor, in which the delamination does not occur during baking and having superior thermal shock and moisture load resistance characteristics is provided. A conductive paste, used with adva... | 08/09/2005 |
| 6916754 | Dielectric ceramic material and method for producing the same A PZT dielectric ceramic material is sintered at a desired low temperature to prevent deterioration of the performance of the base material. An auxiliary oxide is used that is made by adding the oxide of at least one of tungsten and molybdenum to lead oxide i... | 07/12/2005 |
| 6912115 | Multilayer capacitor A multilayer capacitor includes a multilayer body as a main body of the multilayer capacitor, in which a plurality of internal electrodes and stacked dielectric layers each interposed between the internal electrodes are disposed, being stacked in a stack direction, ... | 06/28/2005 |
| 6908809 | Embedded capacitors using conductor filled vias Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form t... | 06/21/2005 |
| 6898071 | Electrical multilayer component and method for the production thereof An electrical component includes a stack of layers. The layers include dielectric layers and electrode layers. The dielectric layers have a resistance with a positive temperature coefficient. The electrode layers are electrically conductive and are interspersed amon... | 05/24/2005 |
