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| Number | Title | Issue Date |
| 7310216 | EMI filter terminal assembly with wire bond pads for human implant applications An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical devi... | 12/18/2007 |
| 7251120 | Monolithic ceramic electronic component and method for making the same A monolithic ceramic electronic component includes a low-permeability coil portion formed by stacking low-permeability ceramic green sheets, a first coil and a relatively large number of pores, and a high-permeability coil portion formed by stacking high-permeabilit... | 07/31/2007 |
| 7190568 | Electrically conductive fuel cell contact materials A multilayer contact approach for use in a planar solid oxide fuel cell stack includes at least 3 layers of an electrically conductive perovskite which has a coefficient of thermal expansion closely matching the fuel cell material. The perovskite material may compri... | 03/13/2007 |
| 7138901 | Temperature measuring device and system and method incorporating the same A system having a heat source, a component coupled to the heat source, and at least one thermistor coupled to the component and adapted to monitor temperature of the component, wherein the thermistor has a core-shell microstructure having a shell disposed about a co... | 11/21/2006 |
| 7123464 | High voltage input apparatus for magnetron A high pressure condenser for a magnetron, in which a pair of dielectric ceramics having an arch shape are separated from each other, central conductors are connected to internal peripheries of the dielectric ceramics, and a ground metal is connected to external per... | 10/17/2006 |
| 7115936 | Ferroelectric thin film element and its manufacturing method, thin film capacitor and piezoelectric actuator using same In a manufacturing method for a piezoelectric actuator a first electrode layer is formed on substrate, a ferroelectric thin film is formed on the first electrode layer, and an inorganic protective layer 4 is formed on the ferroelectric thin film. Then, the in... | 10/03/2006 |
| 7053481 | High capacitance package substrate A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The subst... | 05/30/2006 |
| 7048993 | Process for the constrained sintering of asymmetrically configured dielectric layers A method to produce a distortion-free asymmetrical low-temperature co-fired ceramic structure comprising at least one layer of glass-containing internal constraining tape and at least one layer of glass-containing primary tape wherein the internal constraining tape ... | 05/23/2006 |
| 7035079 | Multilayered chip capacitor and multilayer chip capacitor array The present invention provides an MLCC and an MLCC array. The MLCC has desirably low ESL properties by forming the first and second internal electrodes to be spaced apart from each other on the same dielectric layer while overlapping with other first and second inte... | 04/25/2006 |
| 7029962 | Methods for forming a high performance capacitor Embodiments of methods of forming capacitors are generally described herein. Other embodiments may be described and claimed. ... | 04/18/2006 |
| 6985349 | Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the... | 01/10/2006 |
| 6975502 | Multilayer ceramic capacitor A multilayer ceramic capacitor including an internal electrode layer, an internal dielectric layer having a thickness of less than 2 μm, and an external dielectric layer is provided, wherein the internal dielectric layer and external dielectric layer contain a plur... | 12/13/2005 |
| 6972154 | Anodically bonded device structure We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bon... | 12/06/2005 |
| 6969647 | Method of making single layer capacitor A method of making a monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips... | 11/29/2005 |
| 6961231 | Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traver... | 11/01/2005 |
| 6935002 | Method of manufacturing a nonreciprocal circuit device A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate wit... | 08/30/2005 |
| 6917509 | Single layer capacitor with dissimilar metallizations A single layer ceramic capacitor for wire bonding or solder or epoxy attachment wherein a bottom metallization is of a lesser purity than a top metallization whereby the bottom metallization may be effectively soldered without leaching of the metal and the top metal... | 07/12/2005 |
| 6911960 | Active-type electroluminescent display In an active-type electroluminescent (EL) display, a conductor interconnecting a cathode (55) of an EL panel (30, 40) and a connection terminal of a signal input substrate (35) has a multilayer structure formed of a cathode material and a conduc... | 06/28/2005 |
| 6898068 | Dual mask capacitor for integrated circuits An embodiment of the invention is a capacitor comprising a bottom electrode 70 coupled to a first interconnect 30a of the top metal level 10, a capacitor dielectric 90, sidewalls 105, and a top electrode 110 coupled t... | 05/24/2005 |
| 6885543 | Fringing capacitor structure The present invention provides a circuit and method for a fringing capacitor. The fringing capacitor includes at least two conductor layers spaced apart from each other. Each conductor layer includes at least two portions. The portions include odd ones alternating w... | 04/26/2005 |
| 6885541 | Capacitor, and capacitor manufacturing process A capacitor comprising: a thin film laminate including a plurality of dielectric thin films and a plurality of electrode conductor thin films laminated alternately; and first kind terminals and second kind terminals formed over a first main surface of said thin film... | 04/26/2005 |
| 6856501 | Capacitor having copper electrodes and diffusion barrier layers A capacitor has a couple of electrodes with a dielectric placed therebetween. At least one of the electrodes is made of copper, and barriers for preventing the diffusion of copper into the dielectric are provided between the dielectric and the copper electrode, resp... | 02/15/2005 |
| 6822848 | Dynamic random access memory (DRAM) circuitry Capacitors, DRAM circuitry, and methods of forming the same are described. In one embodiment, a capacitor comprises a first container which is joined with a substrate node location and has an opening defining a first interior area. A second container is joined with ... | 11/23/2004 |
| 6808813 | Ceramic electronic device and method of manufacturing the device A ceramic electronic device is protected at the surface from retention of water, thus having improved operation reliability, and a method of manufacturing the device is provided. A protective layer is formed on the ceramic element and external electrodes by dehydrat... | 10/26/2004 |
| 6739027 | Method for producing printed circuit board with embedded decoupling capacitance A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil... | 05/25/2004 |
| 6738251 | Conductive pattern incorporated in a multilayered substrate, multilayered substrate incorporating a conductive pattern, and a method of fabricating a multilayered substrate The present invention provides a conductive pattern that has low electric resistivity, is superior in adhesion to a substrate and does not cause substrate cracking during plating, a multilayered substrate incorporating such a conductive pattern, and a fabricating me... | 05/18/2004 |
| 6731494 | Capacitor and method for fabricating the same and semiconductor device A capacitor 19 comprises a lower electrode 14 formed on a substrate 10, an upper electrode 18 opposed to the lower electrode, and a capacitor dielectric film 16 formed between the lower electrode and the upper electrode, in which a... | 05/04/2004 |
| 6673461 | Multilayer ceramic capacitor and method for manufacturing same A multilayer ceramic capacitor is formed by alternately stacking a plurality of dielectric layers and a multiplicity of internal electrodes, which are connected to a pair of external electrodes. Each of the dielectric layers is obtained from a dielectric ... | 01/06/2004 |
| 6625006 | Fringing capacitor structure The present invention provides a circuit and method for a fringing capacitor. The fringing capacitor includes at least two conductor layers spaced apart from each other. Each conductor layer includes at least two portions. The portions include odd ones al... | 09/23/2003 |
| 6611421 | Non-polarized tantalum capacitor and capacitor array Non-polar tantalum capacitors and non-polar tantalum capacitor arrays with compact designs are provided. The reduced volume and footprint of the capacitors and arrays in turn reduces the amount of space required in any device in which they are used. In ad... | 08/26/2003 |
| 6556422 | Dielectric ceramic composition, multi-layer ceramic capacitor using the same, and manufacturing method therefor A dielectric ceramic composition, a multi-layer ceramic capacitor and a manufacturing method characterized by superior dielectric properties. The ceramic capacitor includes a chip having a plurality of dielectric layers, a plurality of internal electrodes... | 04/29/2003 |
| 6470545 | Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate Embedded green multi-layer ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates are provided. A first set of electrodes is printed on a ceramic tape. A first dielectric layer is placed over the first set of electrodes and the ceramic t... | 10/29/2002 |
| 6452780 | Capacitor A capacitor including a ceramic body, a glass layer formed on each of opposite surfaces of the ceramic body, and a first metallic layer formed on the glass layer. Preferably, a lead terminal is connected to the first metallic layer or to a second metallic... | 09/17/2002 |
| 6430030 | High k dielectric material with low k dielectric sheathed signal vias A multi-layer ceramic capacitor and method of manufacturing the capacitor, the capacitor having signal vias surrounded by an area containing a material having a low dielectric constant, the via and surrounding area of low dielectric constant material inse... | 08/06/2002 |
| 6407905 | Electronic components A capacitor electrode includes a film base member having connection means located thereon so that the capacitor electrode may be connected to an external component, and a segmented metallized layer connected to the connection means, the metallized layer b... | 06/18/2002 |
| 6396681 | Nonreducing dielectric ceramic and monolithic ceramic capacitor using the same A nonreducing dielectric contains a main-component having a perovskite crystal phase and satisfying the formula (Ca1-a-b-c Sra Bab Mgc)m (Zr1-w-x-y-z Tiw Mnx Niy... | 05/28/2002 |
| 6396680 | Monolithic capacitor and process for producing the capacitor A monolithic capacitor including a sintered body formed from a TiO2 -containing reduction-resistant dielectric ceramic material; a plurality of internal electrodes which are formed inside the sintered body, the electrodes being formed of a base... | 05/28/2002 |
| 6381117 | Ceramic electronic component A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from ea... | 04/30/2002 |
| 6362949 | Laminated ceramic electronic component A laminated ceramic electronic component using a ceramic sintered body mainly comprising CaZrO3, which can be fired in a neutral or reducing atmosphere at a low temperature and in which inner electrodes are formed using cheap base metals. The i... | 03/26/2002 |
| 6356037 | Dielectric ceramic and a capacitor using the same An inexpensive capacitor for pulse generation whose characteristics do not deteriorate even when the capacitor is used in a high temperature, high vacuum, reducing atmosphere, and which enables generation of high-voltage pulses over a wide temperature ran... | 03/12/2002 |
