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| Number | Title | Issue Date |
| 7505248 | Controlled-resistance capacitors, and methods of assembling same A parallel-plate capacitor structure includes a capacitor electrode including a first resistance and an electrode tab appended to the capacitor electrode and including a second resistance. The second equivalent series resistance is greater than the first equivalent ... | 03/17/2009 |
| 7440256 | Laminated ceramic substrate and manufacturing method therefor A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly ab... | 10/21/2008 |
| 7420796 | Multilayer capacitor A multi-terminal multilayer capacitor reducing an equivalent series inductance (ESL), whose design flexibility is high, in which cost of electrode material is low, and in which a structural defect hardly occurs includes lead portions of first and second internal ele... | 09/02/2008 |
| 7420795 | Multilayer capacitor A multilayer capacitor comprises a capacitor body, a first connecting conductor arranged on a first side face of the capacitor body, first and second terminal electrodes, and a first insulator arranged between the first connecting conductor and first terminal electr... | 09/02/2008 |
| 7411776 | Multilayer capacitor array A multilayer capacitor array comprises a multilayer body, and first to fourth terminal conductors and first and second outer connecting conductors formed on the multilayer body. The multilayer body includes a first electrode group having a plurality of first and sec... | 08/12/2008 |
| 7397118 | Ceramic chip-type electronic component and method of making the same A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. Th... | 07/08/2008 |
| 7394647 | Multilayer capacitor A multilayer capacitor 10 of the present invention including: a dielectric body 12 formed by stacking a plurality of dielectric layers 12a; an internal layer portion 17 in which a first and second internal conductor layers 21 | 07/01/2008 |
| 7391600 | Feedthrough capacitor and magnetron In the capacitor, an insulating structural member 28 is arranged on an earth metal fitting 27. In the earth metal fitting 27, two sets of cylindrical-shaped portions 26 are separately arranged in an interval, and a floating portion 27 | 06/24/2008 |
| 7365957 | Ceramic capacitor mounting structure and ceramic capacitor A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal termin... | 04/29/2008 |
| 7362559 | Ceramic chip-type electronic component with electrode covering resin and method of making the same A chip-type electronic component includes a ceramic chip body incorporating an element, an external electrode formed on a side surface of the chip body, a conductive elastic resin film which is larger in width than the external electrode and formed to cover the exte... | 04/22/2008 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7355835 | Stacked capacitor and method of fabricating the same A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band,... | 04/08/2008 |
| 7331799 | Stacked electronic component and fastening device thereof A stacked electronic component includes multiple energy storage units and a fastening device. Each energy storage unit has a first electrode and a second electrode. The fastening device includes first and second fastening member disposed on opposite sides of the ene... | 02/19/2008 |
| 7327553 | Feedthrough capacitor filter assemblies with laminar flow delaminations for helium leak detection A feedthrough filter capacitor assembly includes a capacitor having first and second sets of conductive electrode plates embedded within a dielectric body and mounted to the hermetic terminal of an implantable medical device. A laminar delamination gap is provided b... | 02/05/2008 |
| 7324324 | Multilayer electronic component and manufacturing method thereof A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one end face of the ceramic body, thereby contributing to the formation ... | 01/29/2008 |
| 7295421 | Multilayer ceramic electronic components and method for manufacturing the same A multilayer ceramic electronic component includes a skittered laminated body including internal electrodes that have a strength that is greater than that of ceramic layers provided therein. End portions of the internal electrodes protrude from end surfaces of the l... | 11/13/2007 |
| 7283348 | Multilayer capacitor A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers and a plurality of first and second inner electrodes are alternately laminated, and a plurality of outer conductors (first and second terminal conductors, and first and seco... | 10/16/2007 |
| 7265995 | Array capacitors with voids to enable a full-grid socket An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adja... | 09/04/2007 |
| 7262952 | Multilayer chip capacitor The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal electrodes are separated from one another by the dielectric layers wit... | 08/28/2007 |
| 7233480 | Capacitor and method for manufacturing the same A laminated ceramic capacitor (10) divided into a first laminate (11), a second laminate (12), a third laminate (13), and a fourth laminate (14). The first laminate (11) includes a ceramic layer (15) serving as a diel... | 06/19/2007 |
| 7224572 | Multilayer capacitor A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of ... | 05/29/2007 |
| 7196897 | Multilayer capacitor A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of ... | 03/27/2007 |
| 7177137 | Plated terminations A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphe... | 02/13/2007 |
| 7177138 | Chip-type electronic component A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the... | 02/13/2007 |
| 7173803 | Low impedance inter-digital capacitor and method of using An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The capacitor plates are alternatively coupled to the power and ground termin... | 02/06/2007 |
| 7164573 | High ESR or fused ceramic chip capacitor A fused or high ESR ceramic capacitor for power applications has a fuse or resistor inserted between an end termination and a terminal for one set of alternating conductive plates in the capacitor. The length and thickness of the fuse allows adjustment of the curren... | 01/16/2007 |
| 7161794 | Component formation via plating technology Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typica... | 01/09/2007 |
| 7151661 | Capacitor module and semiconductor device using the same A capacitor module incorporating a ceramic capacitor having terminal members for reducing stress caused by thermal stress or electrostriction in the ceramic capacitor itself, and a semiconductor device using the capacitor module. The capacitor module and the semicon... | 12/19/2006 |
| 7139160 | Electronic component An electronic component includes plural elements, a pair of terminal sections provided to each one of the elements, and a packaging material covering the elements and parts of the terminal sections. A non-conductive shielding section is provided between the terminal... | 11/21/2006 |
| 7126810 | Cryogenic capacitors This invention describes a means by which performance characteristics of capacitors can be improved. This is achieved by reducing the temperature, preferably but not exclusively to cryogenic temperatures below 100 K. This is based on the observation that the dielect... | 10/24/2006 |
| 7120008 | Method and apparatus for capacitor interconnection using a metal spray The present subject matter includes a capacitor stack having a first element having at least one first anode and at least one first cathode and a second element having at least one second anode and at least one second cathode. The capacitor stack is formed by the pr... | 10/10/2006 |
| 7113389 | Surface mounted electronic component A multilayer inductor has a rectangular parallelepiped element body and its length in the lengthwise direction (L), length in the direction of height (H), and length in the direction of width (W) are L≦0.6 mm, H≦0.3 mm, and W≦0.3 mm, respectively. Terminal ele... | 09/26/2006 |
| 7105915 | Chip carrier a chip module and method of manufacturing the chip module A chip carrier for manufacturing a chip module (18), with a substrate and connection leads arranged on the substrate has connection leads designed like stripes and extending parallel over the substrate. The connection leads are electrically conductive connect... | 09/12/2006 |
| 7072169 | Capacitor and method for manufacturing the same A laminated ceramic capacitor 10 divided into a first laminate 11, a second laminate 12, a third laminate 13, and a fourth laminate 14. The first laminate 11 includes a ceramic layer 15 serving as a dielectric layer. ... | 07/04/2006 |
| 7067172 | Component formation via plating technology Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typica... | 06/27/2006 |
| 7057873 | Capacitor structure A capacitor structure including a conductive layer and a dielectric layer is provided. The conductive layer includes a first pattern and a second pattern arranged alternatively with respect to each other. In addition, the dielectric layer is disposed between the fir... | 06/06/2006 |
| 7054134 | Stacked capacitor A stacked capacitor includes a dielectric member, a plurality of internal electrodes, and a plurality of extraction electrodes. The dielectric member is a stacked member formed of a plurality of sheet-like stacked dielectric layers and has at least one side surface.... | 05/30/2006 |
| 7050289 | Multilayer capacitor A multilayer capacitor includes: a dielectric element; a pair of first internal conductors with same polarity disposed in the dielectric element to be adjacent to each other while being separated from each other by the dielectric layer; first leadout portions led ou... | 05/23/2006 |
| 7046498 | C-shaped combination capacitor assembly A C-shaped combination capacitor assembly has a C-shaped shell, multiple capacitors, two conducting wires, two lead wires and encapsulant. The capacitors are mounted in the C-shaped shell. The conducting wires connect the capacitors in parallel. The two lead wires c... | 05/16/2006 |
| 7038900 | EMI filter terminal assembly with wire bond pads for human implant applications An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical devi... | 05/02/2006 |
