The ice cream cone was invented at the St. Louis Worlds Fair by Ernest Hamwi in 1904. His waffle booth was next to an ice cream vendor who ran short of dishes. Hamwi rolled a waffle to hold ice cream and the cone was born.
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| Number | Title | Issue Date |
| 8134824 | Decoupling capacitors A decoupling capacitor is disclosed that has an n-type portion and a p-type portion in a semiconductor. The decoupling capacitor is formed of an NFET transistor and a PFET transistor, the PFET transistor being substantially formed in the n-type portion and the NFET ... | 03/13/2012 |
| 8085524 | Integrated capacitor arrangement for ultrahigh capacitance values An electronic device includes at least one trench capacitor that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence of at least two dielectric layers and at least two electrically conductive layers is provided in the tr... | 12/27/2011 |
| 8068328 | Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate (110, 210, 310), nanolithographically forming a first section (121, 221, 321) of the embedded passive device over the substr... | 11/29/2011 |
| 7983020 | Carbon nanotube coated capacitor electrodes Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacito... | 07/19/2011 |
| 7978456 | Scalable integrated circuit high density capacitors The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The... | 07/12/2011 |
| 7889479 | Integrated multilayer chip capacitor module and integrated circuit apparatus having the same An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip ... | 02/15/2011 |
| 7869189 | Methods of fabricating integrated circuit devices including capacitors having high-aspect ratio support patterns and related devices A method of fabricating an integrated circuit device includes forming a plurality of lower capacitor electrodes vertically extending from a substrate. The plurality of lower capacitor electrodes respectively include an inner sidewall and an outer sidewall. At least ... | 01/11/2011 |
| 7742276 | Wiring structure of laminated capacitors The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capa... | 06/22/2010 |
| 7733627 | Structure of embedded capacitor The embedded capacitor of the present invention contains a power plate, a ground plate, and a dielectric layer vertically sandwiched between the power and ground plates. Both the power and ground plates are divided laterally into a number of smaller plates with appr... | 06/08/2010 |
| 7710709 | Carbon nanotube coated capacitor electrodes Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacito... | 05/04/2010 |
| 7672112 | Component-embedded substrate and component package using component-embedded substrate A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the p... | 03/02/2010 |
| 7663861 | Semiconductor device and method of manufacturing the semiconductor device An MIM capacitance element (capacitance lower electrode, capacitance insulation film and capacitance upper electrode) is provided on a first insulation film on a semiconductor substrate. An interlayer insulation film is provided so as to cover the MIM capacitance el... | 02/16/2010 |
| 7656643 | Scalable integrated circuit high density capacitors The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to form the capacitors. The... | 02/02/2010 |
| 7656644 | iTFC with optimized C(T) A method including depositing a suspension of a colloid having an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic mater... | 02/02/2010 |
| 7643268 | High capacitance density vertical natural capacitors Disclosed are embodiments of a capacitor with inter-digitated vertical plates and a method of forming the capacitor such that the effective gap distance between plates is reduced. This gap width reduction significantly increases the capacitance density of the capaci... | 01/05/2010 |
| 7619872 | Embedded electrolytic capacitor Apparatuses, methods, and systems associated with and/or having capacitors are disclosed herein. In various embodiments, a capacitor may be formed within a substrate having an interwoven-fiber material. In various ones of these embodiments, a capacitor may have a fi... | 11/17/2009 |
| 7545623 | Interposer decoupling array having reduced electrical shorts A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alt... | 06/09/2009 |
| 7532453 | Built-in capacitor type wiring board and method for manufacturing the same In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and f... | 05/12/2009 |
| 7511939 | Layered capacitor architecture and fabrication method A layered capacitor structure comprises two or more semiconductor/dielectric plates formed above an insulating surface which provides mechanical support, with the plates arranged in a vertical stack on the insulating surface. An insulating layer is on each plate, pa... | 03/31/2009 |
| 7492570 | Systems and methods for reducing simultaneous switching noise in an integrated circuit Systems and methods for reducing switching noise in an integrated circuit. In one embodiment, decoupling capacitors are connected to the integrated circuit from the underside of the substrate on which the integrated circuit die is manufactured. The decoupling capaci... | 02/17/2009 |
| 7466534 | High capacitance density vertical natural capacitors Disclosed are embodiments of a capacitor with inter-digitated vertical plates and a method of forming the capacitor such that the effective gap distance between plates is reduced. This gap width reduction significantly increases the capacitance density of the capaci... | 12/16/2008 |
| 7428136 | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit s... | 09/23/2008 |
| 7414824 | Storage capacitor having a scattering effect and method of manufacturing the same A storage capacitor having a scattering effect is positioned in a substrate for use in a thin film transistor array loop. The storage capacitor is characterized by having a rough layer overlapped by a medium layer and a passivation layer. The storage capacitor furth... | 08/19/2008 |
| 7403370 | Capacitor parts A capacitor parts of the present invention, includes a substrate, a plurality of capacitor elements arranged on the substrate and composed of a lower electrode, a dielectric layer, and an upper electrode respectively, a lower electrode rewiring layer formed over the... | 07/22/2008 |
| 7397118 | Ceramic chip-type electronic component and method of making the same A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. Th... | 07/08/2008 |
| 7391602 | Decoupling module for decoupling high-frequency signals from a voltage supply line A decoupling module for decoupling high-frequency signals from a voltage supply line, the module including a plurality of parallel-connected capacitors (K1, K2, . . . ), which each have a capacitance (C1, C2, . . . ), and ... | 06/24/2008 |
| 7385286 | Semiconductor module At least four terminal electrodes are provided on a surface of multi-layer substrate main body. An electric functional layer is selectively provided at an internal area of said multi-layer substrate placed at a downward position of all terminal electrodes in a subst... | 06/10/2008 |
| 7375948 | Variable charge packet integrated circuit capacitor A variable IC capacitor includes a semiconductor layer doped to contain mobile charge carriers. Capacitor electrodes C1 and C2 are disposed adjacent to each other on the layer's surface, gate electrodes G1 and G2 are disposed on opposite ... | 05/20/2008 |
| 7369396 | Composite electroactive material for electromechanical actuators A composite electroactive material having a plurality of particle cores, each particle core surrounded by a polymer covering having one or more strands of an electroactive polymer. In one embodiment, the particle cores have a relatively small size, e.g., between abo... | 05/06/2008 |
| 7366212 | Alterable frequency coherent light generator An alterable frequency coherent light generator for the generation of highly energy efficient coherent light, by means of a power supply connected to a four-lead capacitor, which is connected to a variable resistive device in series with a vacuumed bulb. The direct ... | 04/29/2008 |
| 7362560 | Multilayer electronic component and method for producing the same A multilayer electronic component including a multilayer ceramic capacitor is disclosed, which includes a laminate of dielectric layers and internal electrodes disposed on the dielectric layers; at least one via-conductor penetrating the dielectric layers and connec... | 04/22/2008 |
| 7355836 | Array capacitor for decoupling multiple voltage rails An array capacitor is provided. The array capacitor includes a plurality of ground planes inside a dielectric substrate, and a plurality of ground vias. The ground vias electrically connect the ground planes together. Further, the ground vias are connected to ground... | 04/08/2008 |
| 7355290 | Interposer and method for fabricating the same The interposer comprises a base 8 formed of a plurality of resin layers 68, 20, 32, 48; thin-film capacitors 18a, 18b buried between a first resin layer 68 of said plurality of resin layers and a second resin layer | 04/08/2008 |
| 7352022 | Capacitor having a dielectric layer that reduces leakage current and a method of manufacturing the same A capacitor having a dielectric layer including a composite oxide, the composite oxide including a transition metal and including a lanthanide group element, a memory device including the same and a method of manufacturing the capacitor are provided. The transition ... | 04/01/2008 |
| 7349195 | Thin film capacitor and method for manufacturing the same The present invention provides the steps of (a) forming a first electrode on a substrate via an adhesion enhancing layer, (b) forming a capacitor insulating film containing a laminated film, in which an amorphous dielectric film and a polycrystalline dielectric film... | 03/25/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7342771 | Solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor A solid electrolytic capacitor is provided, which can reduce impedance, particularly, the ESL and the ESR. In one embodiment, such a solid electrolytic capacitor comprises a foil-like valve metal substrate formed with an insulating oxide film on the surface thereof,... | 03/11/2008 |
| 7339277 | Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate A capacitor comprises a first conducting film 12 formed on a substrate 10, a first dielectric film 14 formed on the first conducting film, a second conducting film 18 formed on the first dielectric film, a second dielectric film 22... | 03/04/2008 |
| 7335972 | Heterogeneously integrated microsystem-on-a-chip A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect struct... | 02/26/2008 |
| 7327551 | Capacitor structure A capacitor structure is provided. The capacitor structure is configured in a substrate. The capacitor structure includes a plurality of electrode sets, at least a first conductive plug and at least a second conductive plug. The electrode sets correspond with each o... | 02/05/2008 |