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"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 8179660 | Electronic device and method for manufacturing the same A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a ... | 05/15/2012 |
| 8154848 | Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connect... | 04/10/2012 |
| 8125761 | Capacitor devices with co-coupling electrode planes A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the f... | 02/28/2012 |
| 8027146 | Electric circuit device enabling impedance reduction An electric circuit device (101) comprises an electric element (100) and a substrate (200). The electric element (100) comprises a conductive plate (11, 12), a conductive plate (21 to 23), a side anode electrode (1... | 09/27/2011 |
| 7907385 | Low inductance interconnect device for a power capacitor component Systems and apparatus are provided for capacitor segments for use in a vehicle. A capacitor segment comprises an inner conductor configured to receive a first potential and having a generally L-shaped longitudinal cross-section. An outer conductor is configured to r... | 03/15/2011 |
| 7881041 | Multi-segment capacitor A multi-segment capacitor fabricated on a semiconductor substrate includes M×N capacitor segments arranged in a matrix of M rows and N columns. Each capacitor segment includes two groups of conductive fingers preferably made of metal wires. The metal wire fingers a... | 02/01/2011 |
| 7839621 | Electronic component, mounted structure, and inverter device therewith A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the ... | 11/23/2010 |
| 7787233 | Multi-segment capacitor A multi-segment capacitor fabricated on a semiconductor substrate includes M×N capacitor segments arranged in a matrix of M rows and N columns. Each capacitor segment includes two groups of conductive fingers preferably made of metal wires. The metal wire fingers a... | 08/31/2010 |
| 7778009 | Thin-film capacitor and method of manufacturing the same A thin-film capacitor element having two conductive films and a dielectric film sandwiched therebetween is provided above a substrate. An inorganic protective film covering the thin-film capacitor element and having a second opening exposing at least a part of the c... | 08/17/2010 |
| 7768768 | Semiconductor device including power switch and power reinforcement cell A semiconductor device according to one embodiment includes a cell disposition region in which plural basic cells are disposed and a basic power supply wiring. In the cell disposition region are disposed a primitive cell connected to the basic power supply wiring an... | 08/03/2010 |
| 7764484 | Multilayer electronic component and method for manufacturing the same A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in whi... | 07/27/2010 |
| 7697262 | Multilayer ceramic capacitor with internal current cancellation and bottom terminals Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where terminatio... | 04/13/2010 |
| 7646585 | Multilayer capacitor A first internal electrode includes a first lead portion and a second lead portion. A second internal electrode includes a third lead portion and a fourth lead portion. A third internal electrode includes a main electrode portion and a fifth lead portion. A fourth i... | 01/12/2010 |
| 7639474 | Multi-segment parallel wire capacitor A multi-segment parallel wire capacitor includes substantially identical multiple capacitor segments fabricated on a semiconductor substrate. Each segment comprises at least first and second interleaved metal finger formed in a first metal layer above the substrate ... | 12/29/2009 |
| 7599165 | Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom Provided are palladium-containing powders and a method and apparatus for manufacturing the palladium-containing particles of high quality, of a small size and narrow size distribution. An aerosol is generated from liquid feed and sent to a furnace, where liquid in d... | 10/06/2009 |
| 7573697 | Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed ... | 08/11/2009 |
| 7561407 | Multi-segment capacitor A multi-segment capacitor fabricated on a semiconductor substrate includes M×N capacitor segments arranged in a matrix of M rows and N columns. Each capacitor segment includes two groups of conductive fingers preferably made of metal wires. The metal wire fingers a... | 07/14/2009 |
| 7551421 | Capacitor having electrode terminals at same end of capacitor to reduce parasitic inductance A capacitor is disclosed having reduced impedance. In one embodiment, the capacitor includes a cathode including a first terminal and a first set of electrodes extending from the first terminal in a first layer, each electrode in the first set coupled to one corresp... | 06/23/2009 |
| 7535694 | Feedthrough multilayer capacitor A first signal internal electrode is connected to a first signal terminal electrode and a second signal internal electrode is connected to a second signal terminal electrode. A first ground internal electrode is connected to a first ground terminal electrode and a s... | 05/19/2009 |
| 7471500 | Multi-segment parallel wire capacitor A multi-segment parallel wire capacitor includes substantially identical multiple capacitor segments fabricated on a semiconductor substrate. Each segment comprises at least first and second interleaved metal finger formed in a first metal layer above the substrate ... | 12/30/2008 |
| 7463475 | Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component A multilayer electronic component having a ceramic substrate and a resin layer mounted on a mounting substrate. Recess portions are formed at an outside-facing major surface side of the resin layer. In the resin layer, columnar conductors are disposed so that axis l... | 12/09/2008 |
| 7463474 | System and method of plating ball grid array and isolation features for electronic components A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of first and second polarity electrode layers. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of t... | 12/09/2008 |
| 7443649 | Ferroelectric capacitor A ferroelectric capacitor including a lower electrode, a ferroelectric layer and an upper electrode. A part of at least any one of the lower and upper electrodes is formed of a material selected from the group consisting of TiOx, TaOx, ReOx, WOx, IrO2, Pt... | 10/28/2008 |
| 7440256 | Laminated ceramic substrate and manufacturing method therefor A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly ab... | 10/21/2008 |
| 7436650 | Laminated ceramic capacitor A laminated ceramic capacitor has a high breakdown voltage and excellent withstand-voltage performance, and prevents cracks generated during firing even when the number of lamination layers constituted by ceramic layers and inner electrode layers is increased. The l... | 10/14/2008 |
| 7433172 | Multilayer capacitor A multilayer capacitor includes a multilayer body with a plurality of dielectric layers, a plurality of first and second inner electrodes alternately laminated, and a plurality of terminal conductors formed on the multilayer body. The plurality of first and second i... | 10/07/2008 |
| 7430107 | Monolithic capacitor, circuit board, and circuit module A monolithic capacitor includes a laminate of ceramic layers, the laminate having first and second surfaces, at least one pair of first and second internal electrodes, first and second external electrodes disposed on the first surface, third and fourth external elec... | 09/30/2008 |
| 7428137 | High performance capacitor with high dielectric constant material A multilayered high performance capacitor formed of two or more conductors with a dielectric layer and one or more a dielectric-conductor interface layer sandwiched in between the conductors. The capacitor may be fabricated using many thin layers, at the nano level,... | 09/23/2008 |
| 7428136 | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit s... | 09/23/2008 |
| 7426102 | High precision capacitor with standoff An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlayin... | 09/16/2008 |
| 7423863 | Sintered body electrode and solid electrolytic capacitor using the electrode A sintered body electrode for a sintered body electrode capacitor, which enables production of a solid electrolytic capacitor having a good capacitance appearance factor, including at least one member selected from an earth-acid metal, an alloy mainly comprising an ... | 09/09/2008 |
| 7420795 | Multilayer capacitor A multilayer capacitor comprises a capacitor body, a first connecting conductor arranged on a first side face of the capacitor body, first and second terminal electrodes, and a first insulator arranged between the first connecting conductor and first terminal electr... | 09/02/2008 |
| 7420796 | Multilayer capacitor A multi-terminal multilayer capacitor reducing an equivalent series inductance (ESL), whose design flexibility is high, in which cost of electrode material is low, and in which a structural defect hardly occurs includes lead portions of first and second internal ele... | 09/02/2008 |
| 7414824 | Storage capacitor having a scattering effect and method of manufacturing the same A storage capacitor having a scattering effect is positioned in a substrate for use in a thin film transistor array loop. The storage capacitor is characterized by having a rough layer overlapped by a medium layer and a passivation layer. The storage capacitor furth... | 08/19/2008 |
| 7411776 | Multilayer capacitor array A multilayer capacitor array comprises a multilayer body, and first to fourth terminal conductors and first and second outer connecting conductors formed on the multilayer body. The multilayer body includes a first electrode group having a plurality of first and sec... | 08/12/2008 |
| 7397118 | Ceramic chip-type electronic component and method of making the same A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. Th... | 07/08/2008 |
| 7394647 | Multilayer capacitor A multilayer capacitor 10 of the present invention including: a dielectric body 12 formed by stacking a plurality of dielectric layers 12a; an internal layer portion 17 in which a first and second internal conductor layers 21 | 07/01/2008 |
| 7394643 | Laminated electronic component The present invention is intended to provide a laminated electronic component having a configuration in which the number of extraction electrodes is reduced to realize a high ESR, the adhesion of a terminal electrode with respect to an ECA is increased and a short-c... | 07/01/2008 |
| 7391110 | Apparatus for providing capacitive decoupling between on-die power and ground conductors One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a sem... | 06/24/2008 |
| 7391602 | Decoupling module for decoupling high-frequency signals from a voltage supply line A decoupling module for decoupling high-frequency signals from a voltage supply line, the module including a plurality of parallel-connected capacitors (K1, K2, . . . ), which each have a capacitance (C1, C2, . . . ), and ... | 06/24/2008 |
