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| Number | Title | Issue Date |
| 7348624 | Semiconductor device including a capacitor element A semiconductor device having a capacitor including a first electrode, a second electrode and an insulator. The semiconductor device includes first layers and second layers laminated alternately. The first layers each includes lines of the first electrode and lines ... | 03/25/2008 |
| 7348234 | Methods of forming capacitor constructions The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 03/25/2008 |
| 7326507 | Preparation of a toner for reproducing a metallic hue and the toner The present invention relates to a toner and process for preparing a toner for reproduction of a metallic, preferably golden or silvery, hue by a printing process, especially for electrophotography. A congeneric process and/or a congeneric toner is preserved with re... | 02/05/2008 |
| 7326367 | Thick film conductor paste compositions for LTCC tape in microwave applications This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-... | 02/05/2008 |
| 7316725 | Copper powders methods for producing powders and devices fabricated from same Copper metal powders, methods for producing copper metal powders and products incorporating the powders. The copper metal powders have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the metal particles in a co... | 01/08/2008 |
| 7301752 | Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask Disclosed is a method of fabricating a metal-insulator-metal (MIM) capacitor. In this method, a dielectric layer is formed above a lower conductor layer and an upper conductor layer is formed above the dielectric layer. The invention then forms an etch stop layer ab... | 11/27/2007 |
| 7289311 | Power ring pulse capacitor A wound, metallized dielectric film capacitor for pulsed power applications is disclosed. The capacitor forms a wound metallized polymer film in the shape of a closed path ring. The electrical load is placed within the inner opening of the capacitor. The capacitor h... | 10/30/2007 |
| 7199996 | Laminated capacitor A laminated capacitor includes a capacitor body and first, second, third and fourth external electrodes disposed on an external surface of the capacitor body. The capacitor body has first and second electrode patterns that are alternately laminated with dielectric l... | 04/03/2007 |
| 7197981 | Projectile A projectile, having a casing, a projectile base, which closes off the casing at the rear, a receiver coil for receiving electromagnetic signals, an energy source, brought into contact with the receiver coil, and a logic module. The casing is made of a plastic mater... | 04/03/2007 |
| 7180155 | Method for manufacturing thin-film multilayer electronic component and thin-film multilayer electronic component In a method for manufacturing a thin-film multilayer electronic component, dielectric thin films and thin-film internal electrodes are alternately layered on each other to form a laminate. The thin-film internal electrodes are alternately displaced in a predetermine... | 02/20/2007 |
| 7172663 | Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom Provided are palladium-containing powders and a method and apparatus for manufacturing the palladium-containing particles of high quality, of a small size and narrow size distribution. An aerosol is generated from liquid feed and sent to a furnace, where liquid in d... | 02/06/2007 |
| 7157671 | Flat capacitor for an implantable medical device One aspect provides a capacitor having a first stack of capacitive elements a second stack of capacitive elements, wherein the first and second stacks are enclosed in separate compartments of a capacitor case that electrically isolate the electrolytes of each stack ... | 01/02/2007 |
| 7155197 | High-frequency module and communication apparatus In a high-frequency module, intermediate ground electrodes are provided between a common ground electrode and upper-surface ground electrodes for mounting high-frequency components on an upper surface of a multilayer substrate. With regard to the number of via-hole ... | 12/26/2006 |
| 7154739 | Flat capacitor having an active case A capacitor comprising an aluminum case; a capacitor stack mounted within the aluminum case, the capacitor stack comprising one or more anodes and one or more cathodes, one of the one or more anodes and one or more anodes attached to the aluminum case; wherein the c... | 12/26/2006 |
| 7128852 | Aerosol method and apparatus, particulate products, and electronic devices made therefrom Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator (106) including a plurality of ultrasonic transducers (120) underlying and ultraso... | 10/31/2006 |
| 7097686 | Nickel powders, methods for producing powders and devices fabricated from same Nickel powder batches and methods for producing nickel powder batches. The powder batches include particles having a small particle size, narrow size distribution and a spherical morphology. The present invention is also directed to devices incorporating the nickel ... | 08/29/2006 |
| 7077882 | Gold powders, methods for producing powders and devices fabricated from same Gold powders and methods for producing gold powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes novel d... | 07/18/2006 |
| 7072713 | Flat capacitor for an implantable medical device One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough. ... | 07/04/2006 |
| 7042701 | High-voltage CMOS-compatible capacitors A high-voltage stacked capacitor includes a first capacitor and a second capacitor. Each capacitor includes a first plate having a first semiconductive body and a second plate having a floating electrode. The first and second semiconductive bodies are electrically i... | 05/09/2006 |
| 7027286 | Metallized film capacitor A metallized-film capacitor includes a slit (5a) at approx. center of the width (W) of an effective electrode which actually forms a capacitance of a pair of deposited electrodes (110, 210). Divisional electrodes (2a, 2b | 04/11/2006 |
| 7014725 | Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer ... | 03/21/2006 |
| 6952044 | Monolithic bridge capacitor According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses “air bridges” or some other dielect... | 10/04/2005 |
| 6935002 | Method of manufacturing a nonreciprocal circuit device A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate wit... | 08/30/2005 |
| 6922328 | Semiconductor device and method for manufacturing the same The invention provides a semiconductor device and a method for manufacturing the same that are capable of contributing to a further chip downsizing in the cross-point FeRAM. More particularly, a first local wiring can be formed on a first interlayer insulating layer... | 07/26/2005 |
| 6917129 | Electromechanical drive device An electro-mechanical drive device for adjustment devices of a motor vehicle, more particularly for a window lifter, has a gearing with a gear housing, an electric motor mechanically connected to the gearing, a control device mounted in the gearing housing and havin... | 07/12/2005 |
| 6917509 | Single layer capacitor with dissimilar metallizations A single layer ceramic capacitor for wire bonding or solder or epoxy attachment wherein a bottom metallization is of a lesser purity than a top metallization whereby the bottom metallization may be effectively soldered without leaching of the metal and the top metal... | 07/12/2005 |
| 6913569 | Packed tapes as well as methods and an assembly for packing said tapes A packed tape (1) comprises a folded tape (2) and a package (3) preferably made of plastic film. The tape (2) is zigzag folded into an oblong stack in such a manner that some (2a) of the bendings of the tape flush with the e... | 07/05/2005 |
| 6903916 | Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection The present invention provides a technique which permits the withstand voltage measurement of a laminate web for capacitor layer manufactured by a continuous laminating method in a roll state wound around a core tube. The invention provides a roll of laminate for ca... | 06/07/2005 |
| 6831529 | Feed-through filter capacitor assembly A feed-through filter capacitor assembly using an electrically conductive adhesive modified with a filler of low coefficient of thermal expansion (CTE) to provide a conductive relation between the conductive pin and the electrode plates of the ceramic capacitor. The... | 12/14/2004 |
| 6819542 | Interdigitated capacitor structure for an integrated circuit A capacitor has at least two layers of substantially parallel interdigitated strips. The strips of each layer are alternately connected to a first and a second bus. The first and second buses of each layer are interconnected to first and second buses of an adjacent ... | 11/16/2004 |
| 6798642 | Polymer coated capacitor films This invention relates to capacitor films that have increased moisture and breakdown resistance. The capacitor films include a polymer coating that helps prevent air entrapment. ... | 09/28/2004 |
| 6594134 | Polymer film capacitor A polymer film capacitor is provided, utilizing a metallized film formed by a first vacuum-formed plasma treated surface, a vacuum-deposited, first radiation polymerized acrylate monomer film having first and second surfaces, the first surface being dispo... | 07/15/2003 |
| 6573584 | Thin film electronic device and circuit board mounting the same The present invention provides a thin film capacitor which comprises: a carrier substrate; a thin film element provided on the carrier substrate and having an insulating layer and a plurality of electrode layers, the thin film element including areas form... | 06/03/2003 |
| 6516504 | Method of making capacitor with extremely wide band low impedance A capacitor having a floating plate-shaped electrode, at least two patterned plate electrodes overlying the floating plate-shaped electrode, and a dielectric layer therebetween. The resulting structure exhibits high two-port insertion loss even at frequen... | 02/11/2003 |
| 6240621 | Method of manufacturing a plurality of electronic components A method of manufacturing a plurality of thin-film, surface-mountable, electronic components, comprising the following successive steps: providing a substantially planar, ceramic substrate having a first and second major surface which are mutually paralle... | 06/05/2001 |
| 6058004 | Unitized discrete electronic component arrays A unitized discrete electronic component array being surface mountable as a unit on a printed circuit board comprising a plurality of discrete electronic components physically secured to one another by an adhesive. The adhesive is a non-conducting high te... | 05/02/2000 |
| 5912796 | Metallized film capacitor and manufacturing process A capacitor is made from a laminated structure having multiple layers of metallized dielectric film and having a solderable metal termination at each of two ends. The metal termination at each of the ends is generally rectangular with a top edge, a bottom... | 06/15/1999 |
| 5894401 | Trimming capacitor A trimming capacitor wherein its trimming direction has no directivity. The trimming capacitor comprises a dielectric ceramic sheet provided with a trimming capacitor electrode on the surface thereof, a dielectric ceramic sheet provided with internal capa... | 04/13/1999 |
| 5841626 | Dielectric ceramic composition and monolithic ceramic capacitor using same A dielectric ceramic composition and a monolithic ceramic capacitor using same are provided. The dielectric ceramic composition includes a main component of barium titanate, scandium oxide, yttrium oxide, manganese oxide and nickel oxide, having the compo... | 11/24/1998 |
| 5625527 | Metallized films and capacitors containing the same A metallized film suited for constituting a capacitor is disclosed. The metallized film according to the present invention includes a polymer base film and a vapor-deposited layer consisting essentially of Al and Zn, which is formed on the polymer base fi... | 04/29/1997 |
