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| Number | Title | Issue Date |
| 8064187 | Monolithic ceramic electronic component A monolithic ceramic electronic component includes a dummy electrode having a dummy body portion and an internal electrode having an extended portion, in which the conductor density of the dummy body portion is less than the conductor density of the extended portion... | 11/22/2011 |
| 8027144 | Capacitor structure A capacitor structure is provided. The capacitor structure comprises a plurality of parallel conductive line levels and a plurality of vias. Each conductive line level comprises first conductive lines parallel to each other and second conductive lines parallel to ea... | 09/27/2011 |
| 7881039 | Multi-layer ceramic capacitor having improved component capacity and production method thereof A multi-layer ceramic capacitor comprises dielectric sheets including a first external electrode, a first internal electrode joined to the first external electrode via an interposed dielectric portion, a second external electrode joined to the first internal electro... | 02/01/2011 |
| 7826195 | Metal capacitor and manufacturing method thereof A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming po... | 11/02/2010 |
| 7821769 | Metal capacitor and manufacturing method thereof A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming po... | 10/26/2010 |
| 7813104 | Ceramic element A ceramic element, including: a ceramic body having an internal electrode layer and a ceramic layer; an external electrode having a base electrode which is provided on the outside of the ceramic body so as to be electrically connected with the internal electrode lay... | 10/12/2010 |
| 7626802 | Metal capacitor and manufacturing method thereof A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming po... | 12/01/2009 |
| 7593214 | Array type multi-layer ceramic capacitor and production method thereof A method of producing an array type multi-layer ceramic capacitor is disclosed, comprising: forming dielectric films, forming dielectric sheets on which internal electrodes and interelectrode dielectrics formed on the same plane as the internal electrodes are printe... | 09/22/2009 |
| 7417844 | Stacked solid electrolytic capacitor A stacked solid electrolytic capacitor has an anode foil composed of a valve metal, a cathode foil having carbon grains that are evaporated or physically adhered to a surface thereof, a separator and a solid electrolytic layer composed of a conducting polymer. The a... | 08/26/2008 |
| 7416938 | Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same An integrated thin-film capacitor includes a dielectric disposed between a first electrode and a second electrode. The thin-film capacitor includes a dielectric disposed upon the first electrode, and the dielectric exhibits a substantially uniform heat-altered morph... | 08/26/2008 |
| 7408764 | Cryogenic capacitors This invention describes a means by which performance characteristics of capacitors can be improved. This is achieved by reducing the temperature, preferably but not exclusively to cryogenic temperatures below 100 K. The dielectric strength, dielectric losses, equiv... | 08/05/2008 |
| 7403083 | Multiple resonance filter A multiple resonance filter includes at least three multilayer capacitors having at least two different capacitances. The at least three multilayer capacitors are adjacent each other. Two of the at least three multilayer capacitors have a same capacitance. The two c... | 07/22/2008 |
| 7362560 | Multilayer electronic component and method for producing the same A multilayer electronic component including a multilayer ceramic capacitor is disclosed, which includes a laminate of dielectric layers and internal electrodes disposed on the dielectric layers; at least one via-conductor penetrating the dielectric layers and connec... | 04/22/2008 |
| 7355835 | Stacked capacitor and method of fabricating the same A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band,... | 04/08/2008 |
| 7349195 | Thin film capacitor and method for manufacturing the same The present invention provides the steps of (a) forming a first electrode on a substrate via an adhesion enhancing layer, (b) forming a capacitor insulating film containing a laminated film, in which an amorphous dielectric film and a polycrystalline dielectric film... | 03/25/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7342300 | Integrated circuit incorporating wire bond inductance The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style module. The present invention takes the normally undesirable wire bond ... | 03/11/2008 |
| 7342308 | Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon... | 03/11/2008 |
| 7331799 | Stacked electronic component and fastening device thereof A stacked electronic component includes multiple energy storage units and a fastening device. Each energy storage unit has a first electrode and a second electrode. The fastening device includes first and second fastening member disposed on opposite sides of the ene... | 02/19/2008 |
| 7327552 | Method and apparatus for electrically connecting capacitor electrodes using a spray One embodiment of the present subject matter includes a capacitor stack, including at least a first substantially planar anode layer and at least a second substantially planar anode layer. In the embodiment, the capacitor stack formed by the process comprising align... | 02/05/2008 |
| 7327554 | Assembly of semiconductor device, interposer and substrate An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted ... | 02/05/2008 |
| 7301753 | Method and apparatus for a capacitor with flexible bus The present subject matter includes a first capacitor stack including a first plurality of anode layers and a first plurality of cathode layers and a second capacitor stack including a second plurality of anode layers and a second plurality of cathode layers. In var... | 11/27/2007 |
| 7295420 | Multilayer electronic component and manufacturing method thereof Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side portion of the internal electrode layer forms an inclined surface, ... | 11/13/2007 |
| 7291235 | Thermal dissipating capacitor and electrical component comprising same An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circui... | 11/06/2007 |
| 7291896 | Voltage droop suppressing active interposer The invention proposes an interposer assembly architecture for noise suppression circuits on the package of a CPU or high power, high frequency VLSI device. In this architecture, charge is stored on dedicated capacitors at a voltage substantially higher than the ope... | 11/06/2007 |
| 7284307 | Method for manufacturing wiring board A method for manufacturing a wiring board, comprising the steps of: forming a first electrode layer having first and second opening portions, forming a dielectric layer formed on the first electrode layer and having third and fourth opening portions, forming a secon... | 10/23/2007 |
| 7282839 | Multilayer piezoelectric device Provided is a multilayer piezoelectric device high in reliability and easy in formation of a unit when incorporated into various devices. In a multilayer piezoelectric device, each second external electrode is integrally formed including a main body part electricall... | 10/16/2007 |
| 7277268 | Laminated ceramic capacitor A metal alloy powder containing at least two alloying elements selected from the group of Ni, Cu, Cr, Sn, Mn, Co and W containing 1 to 99% by weight Ni, 1 to 99% by weight Cu, 6 to 60% by weight Cr, 6 to 15% by weight Sn, 6 to 15% by weight Mn, 6 to 15% by weight Co... | 10/02/2007 |
| 7262092 | High-voltage CMOS-compatible capacitors A high-voltage stacked capacitor includes a first capacitor and a second capacitor. Each capacitor includes a first plate having a first semiconductive body and a second plate having a floating electrode. The first and second semiconductive bodies are electrically i... | 08/28/2007 |
| 7259956 | Scalable integrated circuit high density capacitors The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The... | 08/21/2007 |
| 7248459 | Integrated multi-capacitor network A novel multi-capacitor divider network in which two capacitors are fabricated in a single package, using a common dielectric material, is disclosed. In a preferred embodiment of the present invention, the multi-capacitor network comprises a high-voltage capacitor a... | 07/24/2007 |
| 7233527 | Nonvolatile memory structure The invention is directed to a layout of nonvolatile memory device. The memory cell has a gate electrode, a first doped electrode, and a second doped electrode. The first doped electrode is coupled to the bit line. The gate electrode is coupled to one separated word... | 06/19/2007 |
| 7215530 | High ESR low ESL capacitor In some embodiments, a capacitor includes a first conductive layer electrically coupled to a first terminal, a second conductive layer electrically coupled to a second terminal, a floated conductive layer disposed between the first and second conductive layers, and ... | 05/08/2007 |
| 7212396 | Method for fabricating a thin film resistor A method of fabricating high resistivity thin film resistors. An isolation region is formed on a substrate to isolate the active regions. A polysilicon layer is formed above the substrate. A diffusion barrier layer is formed above the polysilicon layer. Lightly dope... | 05/01/2007 |
| 7196898 | Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower... | 03/27/2007 |
| 7192827 | Methods of forming capacitor structures The invention includes a method of forming a capacitor structure. A first electrical node is formed, and a layer of metallic aluminum is formed over the first electrical node. Subsequently, an entirety of the metallic aluminum within the layer is transformed into on... | 03/20/2007 |
| 7192654 | Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first el... | 03/20/2007 |
| 7183651 | Power plane decoupling A system and method for improved power plane decoupling. In a preferred embodiment, two dielectric layers with different dielectric constants are separated by a first conducting layer. Second and third conducting layers are positioned outside the two dielectric laye... | 02/27/2007 |
| 7154162 | Integrated circuit capacitor structure Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate t... | 12/26/2006 |
| 7147384 | Small form factor optical connector with thermoplastic adhesive A optical connector for terminating an optical fiber comprises a housing configured to mate with an LC receptacle. The housing comprises a polymer material that does not deform when exposed to temperatures of at least 210° C. The optical connector further includes ... | 12/12/2006 |
