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| Number | Title | Issue Date |
| 7667948 | Digitally controlled oscillator and associated method A digitally controlled capacitor includes a first set of N capacitors, wherein the first set has a first capacitance value and each of the M capacitors has a second capacitance value, and at least one second set of N capacitors. The second set has the first capacita... | 02/23/2010 |
| 7593213 | Capacitor arrangement support system, capacitor arrangement method and program According to one embodiment, a capacitor arrangement support system includes a resonance analysis module configured to perform a resonance analysis based on data of a component producing electromagnetic radiation, a resonance point extraction module configured to ex... | 09/22/2009 |
| 7423863 | Sintered body electrode and solid electrolytic capacitor using the electrode A sintered body electrode for a sintered body electrode capacitor, which enables production of a solid electrolytic capacitor having a good capacitance appearance factor, including at least one member selected from an earth-acid metal, an alloy mainly comprising an ... | 09/09/2008 |
| 7405920 | Flat type capacitor-use polypropylene film and flat type capacitor using it A flat type capacitor-use polypropylene film having a Ad(thickness determined by micrometer method—thickness determined by weighing method) of 0.05-0.2 μm and a lengthwise shrinkage dimensional change rate of 3% or less, or a flat type capacitor-use polypropylene... | 07/29/2008 |
| 7368825 | Power semiconductor device The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a back surface; a capacitor disposed on the front surface side of the se... | 05/06/2008 |
| 7365962 | Capacitor and method of connecting the same A capacitor includes a hollow capacitor element formed by rolling a pair of flat sheet-like electrodes and, with separators interposed therebetween, a bottom-closed metallic casing receiving the capacitor element and a drive electrolyte therein, and an opening-seali... | 04/29/2008 |
| 7365959 | Multi value capacitor A multi value capacitor is constructed in a single can having a core with three capacitor elements. The capacitor elements are chosen to provide a selectable range of discrete capacitance values when connected in various combinations. The capacitor elements are each... | 04/29/2008 |
| 7359677 | Device and methods for high isolation and interference suppression switch-filter Systems and methods are provided for a stacked die configuration of a high isolation switch and a rejection filter where transmit and receive signals are desired to have a high out-of-band rejection and a low loss band-pass region. In some aspects of the invention t... | 04/15/2008 |
| 7352001 | Method of editing a semiconductor die Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal trac... | 04/01/2008 |
| 7329551 | Manufacturing and testing of electrostatic discharge protection circuits A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding... | 02/12/2008 |
| 7327551 | Capacitor structure A capacitor structure is provided. The capacitor structure is configured in a substrate. The capacitor structure includes a plurality of electrode sets, at least a first conductive plug and at least a second conductive plug. The electrode sets correspond with each o... | 02/05/2008 |
| 7282803 | Integrated electronic circuit comprising a capacitor and a planar interference inhibiting metallic screen An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed be... | 10/16/2007 |
| 7262951 | De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits A de-coupling capacitor module using dummy conductive elements in an integrated circuit is disclosed. The de-coupling module comprises at least one circuit module having one or more active nodes, and at least one dummy conductive element unconnected to any active no... | 08/28/2007 |
| 7251118 | Method and apparatus for large scale storage of electrical potential An electrical storage device, such as a capacitor, which includes a high surface area material such as zeolite as a substrate, a suitable dielectric layer proximate to the substrate, and necessary electrically conductive layers. The substrate is non-planar and has a... | 07/31/2007 |
| 7245477 | Decoupling capacitor and method A capacitor having a first nickel electrode. A BCTZ dielectric covers a side of the first nickel electrode. A second nickel electrode sandwiches the BCTZ. ... | 07/17/2007 |
| 7239005 | Semiconductor device with bypass capacitor A semiconductor device comprises a semiconductor substrate having first and second active regions of first conductivity type, first and second insulated electrodes crossing the first and second active regions, respectively, a third insulated electrode formed on the ... | 07/03/2007 |
| 7212394 | Apparatus and method for banding the interior substrate of a tubular device and the products formed therefrom Apparatus and method for depositing a banding material on the interior substrate of a tubular device, and the products formed therefrom. The tubular device is, generally, of relatively small diameter and comprises at least one band deposited from a first composition... | 05/01/2007 |
| 7196363 | Multilayer metal structure of supply rings with large parasitic capacitance A multilayer metal supply rings structure of an integrated circuit comprises at least two parallel perimetral metal rails defined in metal layers of different levels, geometrically superposed one to the other. Each rail is constituted by using definition juxtaposed ... | 03/27/2007 |
| 7177135 | On-chip bypass capacitor and method of manufacturing the same An on-chip bypass capacitor and method of manufacturing the same, the on-chip bypass capacitor including at least two capacitor arrays, each capacitor array including a first layer connecting the at least two capacitor arrays in series, each capacitor array includin... | 02/13/2007 |
| 7146596 | Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid An integrated circuit chip having a contact layer that includes a plurality of Vdd, Vddx, ground and I/O contacts arranged in a generally radial pattern having diagonal and major axis symmetry and generally defining four quadrants. A multilayer X-Y power grid is loc... | 12/05/2006 |
| 7124384 | Capacitor layout technique for reduction of fixed pattern noise in a CMOS sensor A new capacitor architecture includes a front plate of the capacitor formed form a first polysilicon layer. The front plate is surround by a first dielectric layer and a second dielectric layer. The back plate of the capacitor is formed from one layer of a first two... | 10/17/2006 |
| 7120031 | Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate incl... | 10/10/2006 |
| 7102874 | Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error com... | 09/05/2006 |
| 7098501 | Thin capacitive structure A capacitor structure in a semiconductor device is provided. The capacitor structure includes a first power rail on a topmost level of the semiconductor device, and a second power rail on the topmost level of the semiconductor device. The capacitor structure also in... | 08/29/2006 |
| 7087927 | Semiconductor die with an editing structure Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal trac... | 08/08/2006 |
| 7085123 | Power supply apparatus and power supply method A power supply apparatus and a power supply method are described, wherein the non-polar characteristics of the electrodes of a capacitor is utilized to improve the energy utilization efficiency of a battery through reciprocating switches of polarity connection betwe... | 08/01/2006 |
| 7061747 | Stacked capacitor A stacked capacitor includes a dielectric member, a plurality of internal electrodes, and a plurality of extraction electrodes. The dielectric member is a stacked member formed of stacked dielectric layers and having at least one side surface. The internal electrode... | 06/13/2006 |
| 7046498 | C-shaped combination capacitor assembly A C-shaped combination capacitor assembly has a C-shaped shell, multiple capacitors, two conducting wires, two lead wires and encapsulant. The capacitors are mounted in the C-shaped shell. The conducting wires connect the capacitors in parallel. The two lead wires c... | 05/16/2006 |
| 7042703 | Energy conditioning structure An energy conditioning structure comprised of any combination of multilayer or monolithic energy conditioners with operable conductors, all selectively arranged and shielded for attachment to at least a conductive substrate. ... | 05/09/2006 |
| 7038904 | Capacitor and method of producing same A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed. ... | 05/02/2006 |
| 7035083 | Interdigitated capacitor and method for fabrication thereof A capacitor for use within a microelectronic product employs a first capacitor plate layer that includes a first series of horizontally separated and interconnected tines. A capacitor dielectric layer separates the first capacitor plate layer from a second capacitor... | 04/25/2006 |
| 7030443 | MIM capacitor A MIM (metal-insulator-metal) capacitor is provided with a substrate; a first metal area; a second metal area formed between the substrate and the first metal area; and a first insulating layer formed between the first metal area and the second metal area; wherein a... | 04/18/2006 |
| 6992878 | Tunable capacitor and method of fabricating the same A tunable capacitor includes a substrate, a stationary electrode and a movable electrode supported by the substrate, piezoelectric actuators that are supported by the substrate and drive the movable electrode, and a dielectric layer interposed between the stationary... | 01/31/2006 |
| 6974547 | Flexible thin film capacitor and method for producing the same According to a flexible thin film capacitor of the present invention, an adhesive film is formed on a substrate composed of at least one selected from the group consisting of an organic polymer and a metal foil, and an inorganic high dielectric film and metal electr... | 12/13/2005 |
| 6970362 | Electronic assemblies and systems comprising interposer with embedded capacitors To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer... | 11/29/2005 |
| 6961229 | Electronic circuit device An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor substrate. Power-supply/ground pair transmission lines which provide the... | 11/01/2005 |
| 6919621 | Bonding pad design for impedance matching improvement The present invention is a bonding pad structure for improving impedance matching that can optimize the impedance matching of the loop between the chip and the substrate inside the package so as to improve the electrical characteristics of the package structure by i... | 07/19/2005 |
| 6888248 | Extended length metal line for improved ESD performance A multi-level metal interconnect structure and method for forming the same for improving a resistance of CMOS transistors to electrostatic discharge (ESD) transient events is disclosed. A semiconductor device including at least one NMOS transistor electrically conne... | 05/03/2005 |
| 6888714 | Tuneable ferroelectric decoupling capacitor A voltage supply bypass capacitor for use with a semiconductor integrated circuit chip or module comprising a ferroelectric dielectric having electromechanical properties designed to provide maximum losses at selected frequencies. ... | 05/03/2005 |
| 6885544 | Vertical capacitor apparatus, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates. | 04/26/2005 |
