Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 8149565 | Circuit board device and integrated circuit device A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second po... | 04/03/2012 |
| 8040657 | Ceramic multilayer substrate It is provided a ceramic multilayer substrate obtained by co-sintering a low dielectric constant layer made of an insulating material of a low dielectric constant and a high dielectric constant layer of a dielectric material of a high dielectric constant. The low di... | 10/18/2011 |
| 7986508 | Niobium monoxide powder, niobium monoxide sintered body and capacitor using the sintered body (1) A niobium monoxide powder for a capacitor represented by formula: NbOx (x=0.8 to 1.2) and optionally containing other elements in an amount of 50 to 200,000 ppm, having a tapping density of 0.5 to 2.5 g/ml, an average particle size of 10 to 1000 μm, ... | 07/26/2011 |
| 7423861 | Capacitor with multiple elements for multiple replacement applications A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements.... | 09/09/2008 |
| 7365962 | Capacitor and method of connecting the same A capacitor includes a hollow capacitor element formed by rolling a pair of flat sheet-like electrodes and, with separators interposed therebetween, a bottom-closed metallic casing receiving the capacitor element and a drive electrolyte therein, and an opening-seali... | 04/29/2008 |
| 7365291 | High voltage input apparatus for magnetron A high voltage input apparatus for a magnetron, in which first protrusions formed on lead conductors are caught by insulators and an insulating case, a ground metal is bonded to the insulating case, and expanded portions formed on the insulators are caught by the in... | 04/29/2008 |
| 7365959 | Multi value capacitor A multi value capacitor is constructed in a single can having a core with three capacitor elements. The capacitor elements are chosen to provide a selectable range of discrete capacitance values when connected in various combinations. The capacitor elements are each... | 04/29/2008 |
| 7355835 | Stacked capacitor and method of fabricating the same A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band,... | 04/08/2008 |
| 7284307 | Method for manufacturing wiring board A method for manufacturing a wiring board, comprising the steps of: forming a first electrode layer having first and second opening portions, forming a dielectric layer formed on the first electrode layer and having third and fourth opening portions, forming a secon... | 10/23/2007 |
| 7259956 | Scalable integrated circuit high density capacitors The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The... | 08/21/2007 |
| 7209362 | Multilayer ceramic substrate with a cavity A multilayer ceramic substrate with a cavity includes a multilayer composite member including a plurality of ceramic layers disposed one on another. A cavity is formed in the multilayer composite member such that an opening of the cavity is located in one principal ... | 04/24/2007 |
| 7203053 | Capacitor for multiple replacement applications A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal ... | 04/10/2007 |
| 7196898 | Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower... | 03/27/2007 |
| 7193838 | Printed circuit dielectric foil and embedded capacitors A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (... | 03/20/2007 |
| 7193840 | Solid electrolytic capacitor A solid electrolytic capacitor having a plurality of capacitor elements is provided that is small in size and has good electrical characteristics. The solid electrolytic capacitor includes a plurality of capacitor elements each having a dielectric film, a cathode la... | 03/20/2007 |
| 7181966 | Physical quantity sensor and method for manufacturing the same A capacitance type humidity sensor includes: a detection substrate including a detection portion on a first side of the detection substrate; and a circuit board including a circuit portion. The detection portion detects humidity on the basis of capacitance change of... | 02/27/2007 |
| 7177135 | On-chip bypass capacitor and method of manufacturing the same An on-chip bypass capacitor and method of manufacturing the same, the on-chip bypass capacitor including at least two capacitor arrays, each capacitor array including a first layer connecting the at least two capacitor arrays in series, each capacitor array includin... | 02/13/2007 |
| 7177138 | Chip-type electronic component A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the... | 02/13/2007 |
| 7110241 | Substrate A substrate has a base, an intermediate layer, a conductive layer, and conductive films. The base is a ceramic insulator. The intermediate layer is on a main surface of the base. The conductive layer is on the intermediate layer. The conductive films are on the cond... | 09/19/2006 |
| 7106598 | Passive component assembly for multi-layer modular electrical circuit A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured component... | 09/12/2006 |
| 7056800 | Printed circuit embedded capacitors One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first ... | 06/06/2006 |
| 7057875 | Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion... | 06/06/2006 |
| 7057878 | Discrete component array Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion... | 06/06/2006 |
| 6985348 | Laminated electronic part A laminated electronic actuator includes a pole-like laminate obtained by alternately laminating a plurality of dielectric layers and a plurality of internal electrode layers one upon the other, and two external electrode plates provided on the opposing side surface... | 01/10/2006 |
| 6978745 | System for controlling electromechanical valves in an engine A system for electronically actuating valves in an engine. The system includes first and second voltage sources, and a plurality of valve actuator subsystems coupled therebetween. Each valve actuator subsystem has a valve actuator and a switch configured to selectiv... | 12/27/2005 |
| 6977806 | Multi-layered unit including electrode and dielectric layer A multi-layered unit according to the present invention includes a support substrate formed of platinum (Pt), a buffer layer formed on the support substrate and formed of a dielectric material containing a bismuth layer structured compound having an excellent orient... | 12/20/2005 |
| 6961231 | Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traver... | 11/01/2005 |
| 6940705 | Capacitor with enhanced performance and method of manufacture A decoupling capacitor is formed in a semiconductor substrate that includes a strained silicon layer. A substantially flat bottom electrode is formed in a portion of the strained silicon layer and a capacitor dielectric overlying the bottom electrode. A substantiall... | 09/06/2005 |
| 6918165 | Method for manufacturing a multi-layer capacitor A multi-layer capacitor is highly downsized and increased in capacity. A method for manufacturing the multi-layer capacitor includes, in the same vacuum chamber, forming a dielectric layer, treating a surface of the dielectric layer, forming a pattern in a metal ele... | 07/19/2005 |
| 6920311 | Adaptive radio transceiver with floating MOSFET capacitors An exemplary embodiment of the present invention described and shown in the specification and drawings is a transceiver with a receiver, a transmitter, a local oscillator (LO) generator, a controller, and a self-testing unit. All of these components can be packaged ... | 07/19/2005 |
| 6912113 | Thin film capacitor using conductive polymers The invention relates to a thin film capacitor containing (a) a substrate, (b) a first polymeric film comprising an electrically conductive polymer located on the substrate, (c) a pentoxide layer selected from the group consisting of tantalum pentoxide, or niobium p... | 06/28/2005 |
| 6903919 | Multilayer ceramic electronic component and mounting structure and method for the same A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer... | 06/07/2005 |
| 6903916 | Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection The present invention provides a technique which permits the withstand voltage measurement of a laminate web for capacitor layer manufactured by a continuous laminating method in a roll state wound around a core tube. The invention provides a roll of laminate for ca... | 06/07/2005 |
| 6815045 | Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same Provided is a method for manufacturing a metal powder by providing a reducing solution by dispersing caustic alkali, and hydrazine and/or hydrazine hydrate into a solvent; providing a metal salt solution comprising a salt of electroconductive metal, a rare earth met... | 11/09/2004 |
| 6794706 | Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others A capacitor structure having a re-oxide layer on a nitride layer, wherein an interface between the nitride layer and the re-oxide layer includes electron traps. Characteristics of the carrier traps control a voltage output of the device. The thickness of the nitride... | 09/21/2004 |
| 6781816 | Electronic component An electronic component includes: a dielectric element formed by layering dielectric layers; two types of internal conductors, which have a plurality of extended portions, respectively, that are extended toward a plurality of side surfaces of the dielectric element,... | 08/24/2004 |
| 6750624 | Non-contact obstacle detection system utilizing ultra sensitive capacitive sensing A non-contact obstacle detection system utilizing ultra sensitive capacitive techniques. In an exemplary embodiment, the system includes a sensing element disposed in proximity to a moveable panel and a proximity detection circuit in communication with the sensing e... | 06/15/2004 |
| 6739027 | Method for producing printed circuit board with embedded decoupling capacitance A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil... | 05/25/2004 |
| 6738601 | Adaptive radio transceiver with floating MOSFET capacitors An exemplary embodiment of the present invention described and shown in the specification and drawings is a transceiver with a receiver, a transmitter, a local oscillator (LO) generator, a controller, and a self-testing unit. All of these components can be packaged ... | 05/18/2004 |
| 6683781 | Packaging structure with low switching noises A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. There... | 01/27/2004 |
