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| Number | Title | Issue Date |
| 8169768 | Electrostatic chuck An electrostatic chuck for retaining a substrate. The chuck has a clamping surface for receiving the substrate, where the clamping surface is formed of a hard polymeric material filled with carbon nanotubes. Electrodes are disposed beneath the clamping surface, for ... | 05/01/2012 |
| 8169769 | Electrostatic chuck power supply A detection circuit is provided for a power supply for an electrostatic chuck generating a trapezoidal waveform with approximately flat tops and minimal dead-time between phase reversals. The detection circuit includes an amplifying circuit which receives inputs fro... | 05/01/2012 |
| 8164879 | Step down dechucking A method and an apparatus for dechucking an electrostatic chuck are disclosed. The gas escapes through an opening between a wafer and a chuck in each stage of a multi-stages process. In each stage, during at least a portion of the stage, the chucking voltage is redu... | 04/24/2012 |
| 8149562 | System for decharging a wafer or substrate after dechucking from an electrostatic chuck A system for decharging a wafer or substrate disposed on an electrostatic chuck, includes a capacitance detector for measuring a capacitance between the electrostatic chuck and the wafer or substrate, and a decharging voltage calculator for calculating a decharging ... | 04/03/2012 |
| 8139340 | Conductive seal ring electrostatic chuck The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealin... | 03/20/2012 |
| 8125757 | Wafer support device and component used for the same A wafer support device 20 includes an electrostatic chuck 22 provided to attract a silicon wafer W as an object of plasma processing, a protection ring 30 mounted on a step 26 of the electrostatic chuck 22, a cooling plate 40 | 02/28/2012 |
| 8125756 | Electrostatic holding apparatus, vacuum environmental apparatus using it and joining apparatus An electrostatic holding apparatus is configured to electrostatically hold objects (W1, W2) to be held by applying a predetermined high voltage to a plurality of electrode groups (112a, 112b) as a holding part. A high-voltag... | 02/28/2012 |
| 8125758 | Electroadhesive devices Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion voltage, which is applied using electrodes in an electroadhesive dev... | 02/28/2012 |
| 8111499 | System and method of sensing and removing residual charge from a processed wafer Systems and methods for removing residual charge from a processed wafer are described. Removal of residual charge eliminates de-chucking failure that may break or damage the wafer. Residual charge is removed by applying a reverse polarity discharging DC voltage to a... | 02/07/2012 |
| 8111500 | Wall crawling robots Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion voltage, which is applied using electrodes in an electroadhesive dev... | 02/07/2012 |
| 8098475 | Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp An electrostatic clamp for use in a lithographic apparatus includes a layer of material provided with burls, wherein an electrode surrounded by an insulator and or a dielectric material is provided in between the burls. The electrostatic clamp may be used to clamp a... | 01/17/2012 |
| 8094428 | Wafer grounding methodology An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on th... | 01/10/2012 |
| 8068326 | Electrostatic chuck and substrate temperature control fixing apparatus There is provided an apparatus including: an electrostatic chuck for holding an object; and a base plate which supports the electrostatic chuck and controls a temperature of the electrostatic chuck. The electrostatic chuck is fixed onto the base plate via an adhesiv... | 11/29/2011 |
| 8064185 | Electrostatic chuck electrical balancing circuit repair The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of t... | 11/22/2011 |
| 8040655 | Substrate hold apparatus and method for judging substrate push-up state A substrate hold apparatus is provided an electrostatic chuck for electrostatically attracting and holding a substrate thereon, a push-up member contactable with a position of vicinity of an edge of the substrate on the electrostatic chuck from below for pushing up ... | 10/18/2011 |
| 8023247 | Electrostatic chuck with compliant coat The present invention is directed to an electrostatic chuck (ESC) with a compliant layer formed from TT-Kote® and a method of forming a clamping plate for an ESC. The ESC comprises a compliant layer having a low friction surface for reducing or eliminating particul... | 09/20/2011 |
| 8023248 | Electrostatic chuck An electrostatic chuck includes a dielectric layer 30 formed with an attraction and fix face onto which a plate member 10 is attracted and fixed, wherein the attraction and fix face of the dielectric layer 30 is formed with a plurality of projec... | 09/20/2011 |
| 8023246 | Electrostatic chuck and method of manufacturing the same In a method of manufacturing an electrostatic chuck, the method includes: a step of providing an electrostatic chucking portion including an electrode to which a voltage is applied and a film-like insulating layer covering the electrode; a step of bonding an elastom... | 09/20/2011 |
| 8004817 | Method of platen fabrication to allow electrode pattern and gas cooling optimization An electrode pattern and layered assembly is disclosed. This assembly utilizes multiple-piece construction, including at least two electrically conductive layers and at least three electrically insulating layers. By incorporating a second electrically conductive lay... | 08/23/2011 |
| 8000082 | Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same An electrostatic chuck assembly having a dielectric material and/or having a cavity with varying thickness, profile and/or shape is disclosed. The electrostatic chuck assembly includes a conductive support and an electrostatic chuck ceramic layer. A dielectric layer... | 08/16/2011 |
| 8000081 | Method and apparatus for safely dechucking wafers A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support ... | 08/16/2011 |
| 7995323 | Method and apparatus for securely dechucking wafers A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support ... | 08/09/2011 |
| 7995324 | Electrostatic attraction apparatus for glass substrate and method of attracting and releasing the same An object is providing an electrostatic attraction apparatus and an attracting/releasing method capable of reliably attracting and quickly releasing a glass substrate. An attraction force for attracting a glass substrate is obtained according to the physical propert... | 08/09/2011 |
| 7983017 | Electrostatic chuck and method of forming A Coulombic electrostatic chuck is disclosed which includes a substrate, a conductive layer overlying the substrate, and an arc elimination layer overlying the conductive layer. The electrostatic chuck further includes a high-k dielectric layer overlying the arc eli... | 07/19/2011 |
| 7983018 | Plasma processing system ESC high voltage control and methods thereof An arrangement for securing a wafer during substrate processing is provided. The arrangement includes a power supply and an electrostatic chuck (ESC). The ESC supports the wafer and includes a positive and a negative terminal. A positive high voltage is provided to ... | 07/19/2011 |
| 7974067 | Plasma processing apparatus and method of suppressing abnormal discharge therein In a plasma processing apparatus having an electrostatic chuck for holding a semiconductor wafer by an electrostatic adsorption force and a DC power supply for applying an electrostatic adsorption voltage to the electrostatic chuck, abnormal discharge in plasma is s... | 07/05/2011 |
| 7965489 | Using coulomb forces to form 3-D reconfigurable antenna structures Coulomb forces are used to create various metallic shapes within substrates. These shapes are formed by coupling a plurality of substrates together where each substrate contains a metallic pattern. The substrates are assembled together on a mother substrate and the ... | 06/21/2011 |
| 7957118 | Multi-zone electrostatic chuck and chucking method A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by... | 06/07/2011 |
| 7952851 | Wafer grounding method for electrostatic clamps An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workp... | 05/31/2011 |
| 7948734 | Electrostatic chuck power supply A power supply is provided for an electrostatic chuck. A signal generating circuit of the power supply is configured to generate a square wave signal. An amplifying circuit is electrically connected to the square wave circuit and configured to amplify the square wav... | 05/24/2011 |
| 7948735 | Electrostatic chuck and method for manufacturing the same The electrostatic chuck includes a base including an aluminum nitride-containing member; a dielectric layer formed on the base including a member having a volume resistivity of at least 1×1015 Ω·cm at a temperature range of about 25° C. to about 300°... | 05/24/2011 |
| 7944677 | Electrostatic chuck An electrostatic chuck includes a dielectric board having an upper surface on which a plurality of projections for supporting a substrate on top surfaces and recesses surrounding the projections are formed, an electrode formed inside the dielectric board, and an ext... | 05/17/2011 |
| 7940512 | Electrostatic chuck This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised o... | 05/10/2011 |
| 7940511 | Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp An electrostatic clamp for use in a lithographic apparatus includes a layer of material provided with burls, wherein an electrode surrounded by an insulator and or a dielectric material is provided in between the burls. The electrostatic clamp may be used to clamp a... | 05/10/2011 |
| 7929269 | Wafer processing apparatus having a tunable electrical resistivity An article with an etch resistant coating is disclosed. The article is a heating element, wafer carrier, or electrostatic chuck. The article has a base substrate made of a ceramic or other material, and further has one or more electrodes for resistance heating or el... | 04/19/2011 |
| 7916447 | Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode An electrostatic chuck is provided for a substrate stage that can be used in plasma treatment of various substrates such as a large-sized glass substrate for a flat panel display (FPD), a semiconductor wafer or the like. The electrostatic chuck is divided into a plu... | 03/29/2011 |
| 7907383 | Electrostatic chuck The present invention provides an electrostatic chuck in which the surface can be kept smooth after being exposed to plasma, so as to protect a material to be clamped such as a silicon wafer from being contaminated with particles, and which is excellent in clamping ... | 03/15/2011 |
| 7907384 | Detachable electrostatic chuck for supporting a substrate in a process chamber A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular fl... | 03/15/2011 |
| 7881036 | Electrode sheet for electrostatic chuck, and electrostatic chuck An electrostatic chuck electrode sheet which allows the difference in capacitance between electrodes due to the presence or absence of a substrate to be increased to a level which can be accurately detected using a known substrate detection device, and allows an ele... | 02/01/2011 |
| 7872850 | Wall crawling robots Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion voltage, which is applied using electrodes in an electroadhesive dev... | 01/18/2011 |
