Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 8179530 | Methods and systems for determining a critical dimension and overlay of a specimen Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. ... | 05/15/2012 |
| 8179529 | Alignment systems and methods Method and systems for aligning a first component with a second component are disclosed. For example, a first component may be aligned with a second component during an assembly process, with a first camera used to facilitate the viewing of one or more alignment fea... | 05/15/2012 |
| 8164753 | Alignment mark arrangement and alignment mark structure An alignment mark arrangement includes: a first alignment pattern comprising a plurality of parallel first stripes on a substrate, wherein each of the first stripes includes a first dimension; and a second alignment pattern positioned directly above and overlapping ... | 04/24/2012 |
| 8164752 | Alignment apparatus for aligning multi-layer structures An exemplary alignment apparatus can align a first layer with a second layer. The first layer has a first alignment pattern. The second layer has a second alignment pattern. The alignment apparatus includes a supporting device for supporting the first layer and the ... | 04/24/2012 |
| 8149404 | Method for aligning wafer and alignment apparatus using the method A method of aligning a wafer includes recognizing images of the wafer accommodated on a work table and a notch of the wafer using a camera, designating at least one notch point of the notch in a recognized image, producing at least one reference line using the desig... | 04/03/2012 |
| 8139218 | Substrate distortion measurement A substrate distortion measurement apparatus comprising one or more optical detectors arranged to measure the locations of pits or holes provided in a substrate, a memory arranged to store previously determined locations of the pits or holes in the substrate, and a ... | 03/20/2012 |
| 8139219 | Apparatus and method for semiconductor wafer alignment An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconduc... | 03/20/2012 |
| 8134709 | Method of aligning a substrate In a method of aligning a substrate, a first alignment mark in a single shot region on the substrate may be identified. A second alignment mark in the single shot region may be selectively identified in accordance with the identification of the first alignment mark.... | 03/13/2012 |
| 8107079 | Multi layer alignment and overlay target and measurement method A target system for determining positioning error between lithographically produced integrated circuit fields on at least one lithographic level. The target system includes a first target pattern on a lithographic field containing an integrated circuit pattern, with... | 01/31/2012 |
| 8072601 | Pattern monitor mark and monitoring method suitable for micropattern A method of forming a monitor mark includes forming an insulating film on a semiconductor substrate, and forming a first repetitive line pattern group and a second repetitive line pattern group by patterning the insulating film on the semiconductor substrate, such t... | 12/06/2011 |
| 8064056 | Substrate used in a method and apparatus for angular-resolved spectroscopic lithography characterization A substrate includes an overlay target. The overlay target can include two superposed layers. Each of the two superposed layers includes two gratings with a different pitch from each other. ... | 11/22/2011 |
| 8023112 | Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image,... | 09/20/2011 |
| 8018594 | Lithographic apparatus with multiple alignment arrangements and alignment measuring method A lithographic apparatus has a plurality of different alignment arrangements that are used to perform an alignment measurement on the same mark(s) by: detecting a first alignment mark located on an object and producing a first alignment signal by a first detector; d... | 09/13/2011 |
| 8004679 | Target design and methods for scatterometry overlay determination Disclosed are methods and apparatus for determining overlay error. Radiation that is scattered from each of a plurality of cells of a target is measured. Each cell includes at least a first grating structure formed by a first process and a second grating structure f... | 08/23/2011 |
| 7973931 | Method for determining the position of the edge bead removal line of a disk-like object A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensi... | 07/05/2011 |
| 7933015 | Mark for alignment and overlay, mask having the same, and method of using the same A mark for alignment and overlay, a mask having the same, and a method of using the same are provided. The mark includes a first mark pattern and a second mark pattern. The first mark pattern includes a first pattern and a second pattern, and the second mark pattern... | 04/26/2011 |
| 7933016 | Apparatus and methods for detecting overlay errors using scatterometry Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. A plurality of targets is provided. Each target includes a portion of the first and second structures and each is designed to have an offset between its fi... | 04/26/2011 |
| 7916295 | Alignment mark and method of getting position reference for wafer An alignment mark on a wafer is described, including at least one dense pattern and at least one block-like pattern adjacent thereto and shown as at least one dark image and at least one bright image adjacent thereto. A method of getting a position reference for a w... | 03/29/2011 |
| 7898662 | Method and apparatus for angular-resolved spectroscopic lithography characterization An overlay target on a substrate includes two sets of gratings; the first set having a pitch P1 and the second set having a pitch P2 and each set including a grating with an orientation substantially perpendicular to the first grating of each set. When... | 03/01/2011 |
| 7894062 | Overlay measuring method and overlay measuring apparatus using the same An overlay measuring apparatus includes a light source which generates visible light with a plurality of wavelengths, an optical module which selects visible light with a single wavelength from the visible light generated by the light source, makes the visible light... | 02/22/2011 |
| 7894063 | Lithographic method A method includes determining relative positional relationships between applied fields on a substrate, one of the applied fields including a first field; in a lithographic apparatus, using an alignment apparatus to obtain at least one absolute positional relationshi... | 02/22/2011 |
| 7884935 | Pattern transfer apparatus, imprint apparatus, and pattern transfer method A pattern transfer apparatus transfers an imprint pattern formed on a mold, provided with an alignment mark, to a resin material on a substrate, provided with an alignment mark. A first image pickup device obtains an image of an object positioned at a first object p... | 02/08/2011 |
| 7884936 | Apparatus and methods for scattering-based semiconductor inspection and metrology Disclosed are apparatus and methods for inspecting or measuring one or more semiconductor targets. An incident beam is directed towards a first target as the first target substantially, continuously moves such that the incident beam remains directed at such first ta... | 02/08/2011 |
| 7876439 | Multi layer alignment and overlay target and measurement method A target system for determining positioning error between lithographically produced integrated circuit fields on at least one lithographic level. The target system includes a first target pattern on a lithographic field containing an integrated circuit pattern, with... | 01/25/2011 |
| 7876440 | Apparatus and methods for detecting overlay errors using scatterometry Disclosed are apparatus and methods for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample. Targets A, B, C and D that each include a portion of the first and ... | 01/25/2011 |
| 7847939 | Overlay measurement target In an overlay metrology method used during semiconductor device fabrication, an overlay alignment mark facilitates alignment and/or measurement of alignment error of two layers on a semiconductor wafer structure, or different exposures on the same layer. A target is... | 12/07/2010 |
| 7821638 | Alignment mark An alignment mark on a substrate includes a first pattern and a second pattern. The first pattern has a substantially planar upper surface by which parallel light is specularly reflected. The second pattern forms an interface with the first pattern and has a plurali... | 10/26/2010 |
| 7808638 | Scatterometry target and method Embodiments of the invention include a SCOL targeting groups configured to increase target to target separation and thereby increase target utility to simultaneous exposures to multiple illumination dots and associated inspection methodologies. The embodiments of th... | 10/05/2010 |
| 7804596 | Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key In an overlay key used for measuring overlay accuracy between first and second layers on a substrate, a first mark may be formed in the first layer, and a second mark may be formed on the second layer. The first mark may include first patterns having a first pitch a... | 09/28/2010 |
| 7791727 | Method and apparatus for angular-resolved spectroscopic lithography characterization An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength depende... | 09/07/2010 |
| 7773220 | Method and system for collecting alignment data from coated chips or wafers A process and system for determining alignment data for partially obscured features on wafers or chips when a wafer or chip is substantially coated by an over bump applied material, e.g. a resin or film, and using that data to align the wafers or chips for subsequen... | 08/10/2010 |
| 7751046 | Methods and systems for determining a critical dimension and overlay of a specimen Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. ... | 07/06/2010 |
| 7751047 | Alignment and alignment marks A lithographic substrate provided with an alignment mark, the alignment mark having a plurality of features spaced apart from one another, each feature being spaced apart from adjacent features by a different distance is disclosed. Further, there is disclosed a meth... | 07/06/2010 |
| 7684039 | Overlay metrology using the near infra-red spectral range A method and tool for conducting NIR overlay metrology is disclosed. Such methods involve generating a filtered illumination beam including NIR radiation and directing that illumination beam onto an overlay target to produce an optical signal that is detected and us... | 03/23/2010 |
| 7684040 | Overlay mark and application thereof An overlay mark is described, wherein the overlay mark is used for checking the alignment accuracy between a lower layer defined by two exposure steps and a lithography process for defining an upper layer, including a part of the lower layer and a photoresist patter... | 03/23/2010 |
| 7667842 | Structure and method for simultaneously determining an overlay accuracy and pattern placement error The present invention provides a technique for obtaining overlay error and PPE error information from a single measurement structure. This is accomplished by forming periodic sub-structures in at least two different device layers in a single measurement structure, w... | 02/23/2010 |
| 7663753 | Apparatus and methods for detecting overlay errors using scatterometry Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. Target A is designed to have an offset Xa between its first and second structures portions; target B is designed to have an offset Xb; target C is designed... | 02/16/2010 |
| 7656529 | Overlay error measurement using fourier optics The present invention discloses an overlay alignment measurement apparatus and method. The overlay target is periodic and is illuminated by coherent radiation; a Fourier transform lens optically computes the Fourier transform of the target. Analysis of the spatial f... | 02/02/2010 |
| 7656528 | Periodic patterns and technique to control misalignment between two layers A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by t... | 02/02/2010 |
| 7643144 | Alignment apparatus and alignment method An adjusting unit for making positional adjustment of the optical axis adjustment mask, based on the observation by the one optical unit, such that the reference mark at the one location or the other location and the optical axis adjusting alignment mark correspondi... | 01/05/2010 |
