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Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
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| Number | Title | Issue Date |
| 7368313 | Method of making a differential pressure sensor In a method for manufacturing a micromechanical semiconductor component, e.g., a pressure sensor, a locally limited, buried, and at least partially oxidized porous layer is produced in a semiconductor substrate. A cavity is subsequently produced in the semiconductor... | 05/06/2008 |
| 7369032 | Method of joining a pressure sensor header with an associated transducer element A pressure transducer assembly including: a pressure sensor header; a transducer assembly member; and a joining arrangement disposed at an interface of the header and the transducer assembly member, for joining the header with the transducer assembly member, the joi... | 05/06/2008 |
| 7363819 | High-pressure sensor housing which is simplified by means of a connection element (also emc) A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housin... | 04/29/2008 |
| 7347099 | Pressure transducer with external heater An improved pressure transducer is disclosed. The transducer includes a connector, an enclosure, a sensor portion, and an external heater disposed to heat the sensor portion. In some aspects, the sensor portion includes a sensor constructed from a brittle material a... | 03/25/2008 |
| 7340960 | Miniature sensor A strain sensing apparatus including a deformable substrate is presented. The deformable substrate is configured to detect a strain of the body that can be coupled to the deformable substrate. Sometimes, the deformable substrate is a flexible substrate having an upp... | 03/11/2008 |
| 7337674 | Pressure detector for fluid circuits A pressure measurement device usable for monitoring pressure of fluids such as blood, waste, and replacement fluid in a blood treatment system provides a reliable signal and other benefits by virtue of a number of features of the various embodiments disclosed. The p... | 03/04/2008 |
| 7337540 | Method of manufacturing a structure body bonding with a glass substrate and semiconductor substrate Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing method of a structural body structured with a bonding body formed from... | 03/04/2008 |
| 7330795 | Method and apparatus for providing signal analysis of a BioNEMS resonator or transducer An outputs signal, v(t), is generated from a bioNEMs transducer and mixed with a reference signal and then filtered to generate a correlator output, r(t). The correlator output is detected to generate a signal u(t) and then determined whether the signal u(t) satisfi... | 02/12/2008 |
| 7317199 | Circuit device To provide a circuit device suitable for incorporating a semiconductor element emitting or receiving short-wavelength light. The circuit device includes a casing, a semiconductor element, and a cover portion. The casing has an opening on the top face thereof. The se... | 01/08/2008 |
| 7311007 | Pressure sensor The invention provides a pressure sensor with a housing for a pressure sensing arrangement, e.g. a semi-conductor arrangement. The housing consists of a bottom part and an intermediate member with a through hole forming a sidewall of a cavity for the pressure sensin... | 12/25/2007 |
| 7312096 | Nanotube semiconductor structures with varying electrical properties There is disclosed a nanotube sensor which essentially employs a straight or twisted nanotube deposited on a supporting surface, such as silicon, silicon dioxide and some other semiconductor or metal material. The nanotube is basically a graphite device which is now... | 12/25/2007 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7302862 | Flow rate-measuring device A flow sensor 22 is provided on a wall surface of a flow path 4 in which a fluid to be measured. A member having minimal cross-section flow path 17 which has a diameter extremely smaller than that of the flow path 4 where the flow sensor ... | 12/04/2007 |
| 7294793 | Load cell mounted with a spring biased saddle element A load cell includes a first element, a second element and a sensor measuring force between the first and second elements along a first axis. In some embodiments, lateral and angular decoupling is provided by the provision of a convex surface between the first and s... | 11/13/2007 |
| 7270012 | Semiconductor device embedded with pressure sensor and manufacturing method thereof The method for promoting the size reduction, the performance improvement and the reliability improvement of a semiconductor device embedded with pressure sensor is provided. In a semiconductor device embedded with pressure sensor, a part of an uppermost wiring is us... | 09/18/2007 |
| 7263894 | Sensor and guide wire assembly The invention relates to a sensor (23) adapted for a sensor and guide wire assembly for intravascular measurements in a living body, wherein the sensor (23) comprises a pressure sensitive part (24) and an electronic part (25), said pressu... | 09/04/2007 |
| 7260995 | Pressure sensor having thin pressure sensing membrane A pressure sensor is provided having a chamber partially defined by a flexible membrane which is less than three microns thick, exposed to fluid pressure and is configured to deflect from a reference position due to changes in the fluid pressure, and associated circ... | 08/28/2007 |
| 7258806 | Method of fabricating a diaphragm of a capacitive microphone device A method of fabricating a diaphragm of a capacitive microphone device. First, a substrate is provided, and a dielectric layer on a first surface of the substrate is formed. Than, a plurality of silicon spacers are formed on a surface of the dielectric layer, and a d... | 08/21/2007 |
| 7252012 | Device and method for testing paving materials A device and method for directly measuring the critical temperatures for thermal cracking of asphalt binders. The exemplary comprises a metal ring, a strain gauge attached to the inner surface of the ring, an environmental chamber, one or more signal amplifiers, and... | 08/07/2007 |
| 7252007 | Method for the manufacturing of a capacitive pressure sensor, and a capacitive pressure sensor The invention relates to measuring devices for the measuring of pressure, and more specifically to capacitive pressure sensors. The silicon crystal planes {111} are located at the corners of a wet etched membrane well of a pressure sensor element according to... | 08/07/2007 |
| 7242089 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 07/10/2007 |
| 7242012 | Lithography device for semiconductor circuit pattern generator General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 07/10/2007 |
| 7223696 | Methods for maskless lithography General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 05/29/2007 |
| 7212096 | Pressure sensor header having an integrated isolation diaphragm A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a jo... | 05/01/2007 |
| 7210362 | Diaphragm type load detection sensor, load detection unit and electronic scale using same Disclosed is a diaphragm type load detection sensor, comprising: a mounting portion attached to a installation plate; a strain generation portion provided on the mounting portion and having a load applied portion formed at the center thereof to which a load to be de... | 05/01/2007 |
| 7211873 | Sensor device having thin membrane and method of manufacturing the same A sensor device for use in an automobile as an airflow sensor is composed of a silicon substrate in which a cavity is formed and a base plate bonded to the silicon substrate. An upper end of the cavity is closed with a thin membrane including a sensor element such a... | 05/01/2007 |
| 7193239 | Three dimensional structure integrated circuit A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 03/20/2007 |
| 7176545 | Apparatus and methods for maskless pattern generation General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 02/13/2007 |
| 7166911 | Packaged microchip with premolded-type package A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. ... | 01/23/2007 |
| 7159448 | Combustion-chamber pressure sensor having a metallic diaphragm containing a piezoresistive, thin metallic layer A pressure sensor for measuring the pressure in a space acted upon by high pressure. The signals detected by the pressure sensor are supplied to evaluation electronics. A sensor diaphragm is accommodated on the end of the pressure sensor pointing towards the space a... | 01/09/2007 |
| 7153758 | Anodic bonding method and electronic device having anodic bonding structure In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded membe... | 12/26/2006 |
| 7152483 | High pressure sensor comprising silicon membrane and solder layer A device for measuring pressure, e.g., for measuring high pressure, including a pressure transducer that is arranged in a housing and includes sensor elements and a sensor diaphragm on a first side, and on a second side opposite the first side is provided with a cut... | 12/26/2006 |
| 7151431 | Resistor element, stress sensor and method for manufacturing them A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8 | 12/19/2006 |
| 7138901 | Temperature measuring device and system and method incorporating the same A system having a heat source, a component coupled to the heat source, and at least one thermistor coupled to the component and adapted to monitor temperature of the component, wherein the thermistor has a core-shell microstructure having a shell disposed about a co... | 11/21/2006 |
| 7138295 | Method of information processing using three dimensional integrated circuits A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 11/21/2006 |
| 7124639 | Ultra high temperature hermetically protected wirebonded piezoresistive transducer An ultra high temperature hermetically protected transducer includes a sensor chip having an active area upon which is deposited piezoresistive sensing elements. The elements are located on the top surface of the silicon wafer chip and have leads and terminals exten... | 10/24/2006 |
| 7116209 | Strain gauges The present invention provides a strain gauge comprising a resistive layer. The resistive layer comprises metallic or semiconducting nanoparticles or aggregates thereof in which the nanoparticles or aggregates thereof are separated by insulating and/or semiconductin... | 10/03/2006 |
| 7107853 | Pressure transducer for measuring low dynamic pressures in the presence of high static pressures A sensor is described, which basically consists of a leadless high sensitivity differential transducer chip which responds to both static and dynamic pressure. Located on the transducer are two sensors. One sensor has a thicker diaphragm and responds to both static ... | 09/19/2006 |
| 7100458 | Flexure system for strain-based instruments A device for measuring forces on a sensor body, comprising a beam. An array comprising at least one recess is formed in the beam. The array has a length-to-height ration of less than 1.0. At least one strain transducer is mounted in at least one recess, wherein when... | 09/05/2006 |
| 7096739 | Pressure sensor containing fluorine-based adhesive A pressure sensor is provided with a semiconductor device that is capable of detecting a pressure, a terminal that is connected to the semiconductor device by a bonding wire, a housing having an accommodation space for the semiconductor device, the bonding wire, and... | 08/29/2006 |
