Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 8179226 | Array type chip resistor The present invention provides an array type chip resistor including: a substrate formed in a rectangular parallelepiped shape; lower electrodes disposed on both sides of a bottom surface of the substrate at equal spaces; side electrodes extended from some of lower ... | 05/15/2012 |
| 8081059 | Chip resistor and manufacturing method thereof A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each elec... | 12/20/2011 |
| 8058968 | Method for manufacturing rectangular plate type chip resistor and rectangular plate type chip resistor A method for manufacturing rectangular plate type chip resistors and a rectangular plate type chip resistor obtained by this method. The method includes the steps of (A) providing a resistive alloy plate strip of predetermined width and thickness, (B) forming an ins... | 11/15/2011 |
| 8035476 | Chip resistor and method for making the same The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second prote... | 10/11/2011 |
| 8013713 | Resistor, particularly SMD resistor, and associated production method The invention relates to a resistor (18), particularly an SMD resistor, including a planar, metallic support element (19) that has a top surface and a bottom surface, a planar resistor element (21) which is made of a resistive material and is di... | 09/06/2011 |
| 8009012 | Stacked electronic part and method of manufacturing the same Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, a... | 08/30/2011 |
| 7948355 | Embedded resistor devices An embedded resistor device includes a resistor, a ground plane located near a first side of the resistor and electrically coupled to a first end of the resistor, at the ground plane a hole is provided, a first dielectric layer exists between the resistor and the gr... | 05/24/2011 |
| 7940158 | Chip resistor and its manufacturing method A chip resistor (1) according to the present invention includes an insulating substrate (2) which is in the form of an elongated rectangle in plan view, a pair of upper electrodes (3, 4) in the form of a strip formed on the upper surface of the ... | 05/10/2011 |
| 7907046 | Chip resistor and method for producing the same The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) ... | 03/15/2011 |
| 7876196 | Chip resistor and method of making the same A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface ... | 01/25/2011 |
| 7825769 | Terminal structure of chiplike electric component A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-b... | 11/02/2010 |
| 7786842 | Chip resistor and manufacturing method thereof The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2), a resistor film (5) inc... | 08/31/2010 |
| 7782174 | Chip resistor Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 | 08/24/2010 |
| 7772961 | Chip-shaped electronic part A chip-shaped electronic part includes: a substrate; a pair of upper surface electrodes formed on an upper surface of the substrate; a functional element formed to be electrically connected to the upper surface electrode pair; a pair of lower surface electrodes form... | 08/10/2010 |
| 7701323 | Low profile discrete electronic components and applications of same Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within ... | 04/20/2010 |
| 7675401 | Electronic circuit board A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and... | 03/09/2010 |
| 7667569 | Chip resistor, and its manufacturing method A chip resistor includes: a pair of upper surface electrodes formed at opposing side portions of a rectangular substrate as opposed to each other with respect to a center line of the rectangular substrate extending in a direction connecting the side portions; a resi... | 02/23/2010 |
| 7667568 | Chip resistor and manufacturing method thereof A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each elec... | 02/23/2010 |
| 7659806 | Chip resistor and method of making the same A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface ... | 02/09/2010 |
| 7629872 | Chip type component and its manufacturing process A chip-type component 11 includes an insulating chip substrate 12 whose upper surface is provided with a resistor element 13 and a cover coat 14 covering the resister film. At the opposite ends of the substrate, terminal electrode films | 12/08/2009 |
| 7525410 | Point contact array, not circuit, and electronic circuit using the same There are provided a point contact array, in which a plurality of point contacts are arranged, each point contact electrically and reversibly controlling conductance between electrodes and being applicable to an arithmetic circuit, a logic circuit, and a memory devi... | 04/28/2009 |
| 7403095 | Thin film resistor structure and method of fabricating a thin film resistor structure A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) l... | 07/22/2008 |
| 7403094 | Thin film resistor and dummy fill structure and method to improve stability and reduce self-heating An integrated circuit thin film resistor structure includes a first dielectric layer (18A) disposed on a semiconductor layer (16), a first dummy fill layer (9A) disposed on the first dielectric layer (18B), a second dielectric layer (1... | 07/22/2008 |
| 7394344 | Chip resistor and method for manufacturing the same A chip resistor includes a chip substrate, a terminal electrode formed on an upper surface of the chip substrate in a region close to the respective end portions, and a resistant film formed in a zigzag-folded shape on the upper surface of the chip substrate between... | 07/01/2008 |
| 7378937 | Chip resistor and method of making the same A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces an... | 05/27/2008 |
| 7361869 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no de... | 04/22/2008 |
| 7357898 | Microfluidics packages and methods of using same Microfluidics packages and methods of use are described, comprising in one embodiment a substrate having a top surface and means to lower pressure on the top surface; a fluidics card having a bottom surface and means to allow fluids to traverse through the card; and... | 04/15/2008 |
| 7355504 | Electrical devices An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a ma... | 04/08/2008 |
| 7352273 | Chip resistor The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the fi... | 04/01/2008 |
| 7351639 | Increasing an electrical resistance of a resistor by oxidation or nitridization A method and structure for increasing an electrical resistance of a resistor that is within a semiconductor structure, by oxidizing or nitridizing a fraction of a surface layer of the resistor with oxygen/nitrogen (i.e., oxygen or nitrogen) particles, respectively. ... | 04/01/2008 |
| 7342480 | Chip resistor and method of making same A chip resistor includes a resistor element of a rectangular solid made of an alloy composed of high-resistant metal and low-resistant metal. The resistor has connection terminal electrodes disposed at the ends of the resistor element that are spaced longitudinally ... | 03/11/2008 |
| 7339455 | Platinum resistor temperature sensor A platinum temperature sensor incorporating an evaporation-suppressing layer containing platinum in the vicinity of the platinum thin-film resistor of the sensor. The evaporation-suppressing layer is preferably positioned between the platinum resistor and a porous l... | 03/04/2008 |
| 7334318 | Method for fabricating a resistor A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method... | 02/26/2008 |
| 7330099 | Chip resistor and manufacturing method therefor A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insu... | 02/12/2008 |
| 7326889 | PTC element and production process thereof A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline ... | 02/05/2008 |
| 7326999 | Chip resistor and method for manufacturing same A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first sur... | 02/05/2008 |
| 7327214 | Chip resistor and method of making the same A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insu... | 02/05/2008 |
| 7323751 | Thin film resistor integration in a dual damascene structure A thin film resistor and at least one metal interconnect are formed in an integrated circuit. A first dielectric layer is formed over a metal interconnect layer. A thin film resistor is formed on the first dielectric layer and a second dielectric layer formed over t... | 01/29/2008 |
| 7310036 | Heat sink for integrated circuit devices A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal c... | 12/18/2007 |
| 7305754 | Method of manufacturing chip resistor In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by... | 12/11/2007 |
