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| Number | Title | Issue Date |
| 8174355 | Semiconductor device and method for manufacturing the same A resistor R1 formed by forming a first resistor layer 5a of 20 nm thickness including a tantalum nitride film at a concentration of nitrogen of less than 30 at % and a second resistor layer of 5 nm thickness including a tantalum nitride film at... | 05/08/2012 |
| 8004386 | Thin film resistor structure and fabrication method thereof A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess r... | 08/23/2011 |
| 7982582 | Sulfuration resistant chip resistor and method for making same A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electro... | 07/19/2011 |
| 7940157 | Resistor layout structure and manufacturing method thereof A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resi... | 05/10/2011 |
| 7915996 | Electronic component and method for producing the same An electronic component and a method for producing the electronic component achieve efficient production of resistive elements with various resistances. The electronic component includes a pair of terminals opposite each other and a resistive element disposed betwee... | 03/29/2011 |
| 7830241 | Film resistor embedded in multi-layer circuit board and manufacturing method thereof A resistor structure embedded in a multi-layer circuit board and manufacturing method thereof are provided. Resistive material is coated on any layer among the multi-layer circuit board, and two symmetric electrodes are formed in the geometric center of the resistiv... | 11/09/2010 |
| 7782173 | Chip resistor The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR co... | 08/24/2010 |
| 7733211 | Chip resistor and its manufacturing process A chip resistor (1) includes a chip substrate (2) a mutually separated terminal electrodes (3, 4) formed on the upper surface of the substrate (2), and a meandering resistor film (5) formed between the two terminal electrodes (3... | 06/08/2010 |
| 7595716 | Electronic component and method for manufacturing the same To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element dispo... | 09/29/2009 |
| 7427911 | Electrical device having a heat generating resistive element The invention provides an electrical device having improved insulation and reduced partial discharge. The electrical device comprises an electrically conductive resistive element provided on a heat transfer medium for transferring heat from the element. The heat tra... | 09/23/2008 |
| 7394344 | Chip resistor and method for manufacturing the same A chip resistor includes a chip substrate, a terminal electrode formed on an upper surface of the chip substrate in a region close to the respective end portions, and a resistant film formed in a zigzag-folded shape on the upper surface of the chip substrate between... | 07/01/2008 |
| 7372127 | Low cost and versatile resistors manufactured from conductive loaded resin-based materials Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The cond... | 05/13/2008 |
| 7369034 | Chip variable resistor A chip variable resistor which is capable of keeping the resistance at an adjusted value and can be manufactured easily is provided. An insulating substrate is formed with a through-hole capable of receiving a driver, and the upper surface of the insulating s... | 05/06/2008 |
| 7352273 | Chip resistor The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the fi... | 04/01/2008 |
| 7348873 | Multilayer positive temperature coefficient thermistor and method for designing the same A multilayer PTC thermistor reliably decreases the resistance by decreasing the thickness of ceramic layers composed of a BaTiO3 semiconductor ceramic and achieves a resistance close to the resistance calculated from the multilayer structure. The thermist... | 03/25/2008 |
| 7342480 | Chip resistor and method of making same A chip resistor includes a resistor element of a rectangular solid made of an alloy composed of high-resistant metal and low-resistant metal. The resistor has connection terminal electrodes disposed at the ends of the resistor element that are spaced longitudinally ... | 03/11/2008 |
| 7330099 | Chip resistor and manufacturing method therefor A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insu... | 02/12/2008 |
| 7310036 | Heat sink for integrated circuit devices A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal c... | 12/18/2007 |
| 7309848 | Sealing structure of ceramic heater A ceramic heater is provided which may be built in a gas sensor to heat a sensor element up to a desired activation temperature. The ceramic heater includes a pair of electrical conductors formed on a ceramic body. Each of the conductors is equipped with a terminal.... | 12/18/2007 |
| 7305754 | Method of manufacturing chip resistor In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by... | 12/11/2007 |
| 7297902 | High performance defrosters for transparent panels The present invention provides a window assembly having a transparent panel and a conductive heater grid formed integrally with the transparent panel. The conductive heater grid has a first group of grid lines and a second group of grid lines, with opposing ends of ... | 11/20/2007 |
| 7283033 | Axial leaded over-current protection device An axial leaded over-current protection device comprised of a plurality of PTC devices, a first terminal metal strip, and a second terminal metal strip. One end of the first terminal metal strip diverges into a plurality of electrode strips, and the plurality electr... | 10/16/2007 |
| 7277006 | Chip resistor Chip resistor includes the rectangular first substrate made of ceramics and having surfaces, the rectangular second substrate made of ceramics and having surfaces, and a joint layer interposed between the surfaces, and electrodes are formed on two opposing sides of ... | 10/02/2007 |
| 7276442 | Method for forming a metallization layer A method for depositing metal on a semiconductor device having a substrate, an exposed first surface, and an exposed second surface is provided. Metal ions are deposited on the exposed first surface and on the exposed second layer by applying a first voltage between... | 10/02/2007 |
| 7262682 | Resistor element, stress sensor, and method for manufacturing them A stress sensor in which the direction and magnitude of a stress being applied to a post bonded to or integrated with an insulating board can be grasped from variation in the resistance of resistor elements being stimulated by application of the stress while suppres... | 08/28/2007 |
| 7241131 | Thick film heater apparatus A thick-film electric heater having thick-film layers applied directly on a thermally conductive non-flat substrate. Preferably, the substrate is cylindrically shaped. A dielectric layer is silk-screened on the substrate surface. A resistive layer is silk-screened o... | 07/10/2007 |
| 7227443 | Fixed network resistor A fixed resistor network has an insulating substrate, a plurality of film resistors arranged on a top surface of the insulating substrate, terminal electrodes formed for the film resistors on each lengthwise sidewall of the insulating substrate at a given pitch alon... | 06/05/2007 |
| 7224258 | Fine line thick film resistors by photolithography The present invention is directed to a thick film patterned resistor on a substrate and to a method of forming it. The method involves providing a substrate with opposed surfaces, where one surface is coated with a layer of a resistor composition. A photoresist is a... | 05/29/2007 |
| 7223668 | Method of etching metallic thin film on thin film resistor An Al film is formed on a barrier metal covering a thin film resistor to have a first opening. A photo-resist is formed on the Al film and in the opening, and is patterned to have a second opening having an opening area smaller than that of the first opening and ope... | 05/29/2007 |
| 7221253 | Fusible resistor and method of fabricating the same A fusible resistor and method of fabricating the same is provided. The fusible resistor has a very low resistance of 20 to 470 mΩ. by depositing thin films as a fusible element made of a material with low resistivity such as copper having a temperature coefficient ... | 05/22/2007 |
| 7199028 | Method for manufacturing semiconductor device Provided is a method for manufacturing a semiconductor device capable of preventing a solution from penetrating a lower layer by forming a poly silicon layer stacked of the films having the different grain boundary structures at border, wherein the solution is used ... | 04/03/2007 |
| 7190016 | Capacitor structure Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed. ... | 03/13/2007 |
| 7189317 | Semiconductor manufacturing system for forming metallization layer A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A second layer is formed outwardly from the first layer. Portions of the sec... | 03/13/2007 |
| 7184245 | Head slider to be adhered to precise positioning actuator, head gimbal assembly with the head slider, method for adhering the head slider to the actuator, manufacturing method of head slider and manufacturing method of head gimbal assembly A head slider provided with at least one head element, to be fixed to an actuator for precisely positioning the at least one head element, including adhering sections to be adhered to the actuator, and recesses for receiving an adhesive. At least one of the recesses... | 02/27/2007 |
| 7154373 | Surface mounting chip network component A surface mounting chip network component in which a network having three or more odd number of terminals are formed on the surface of an insulating substrate and Tomb Stone Phenomenon is suppressed. Even number of network circuits are formed on the surface of the i... | 12/26/2006 |
| 7152593 | Ignition terminal An ignition terminal assembly including a serpentine conduction element having an end and a formed terminal connected to said end. ... | 12/26/2006 |
| 7131047 | Test system including a test circuit board including resistive devices A test system includes a device under test and a test circuit board. The device under test includes a plurality of contacts configured to provide output signals. The test circuit board may convey the output signals from the device under test to an analyzer. The test... | 10/31/2006 |
| 7126195 | Method for forming a metallization layer A method for forming a metallization layer (30). A first layer (14) is formed outwardly from a semiconductor substrate (10). Contact vias (16) are formed through the first layer (14) to the semiconductor substrate (10). A se... | 10/24/2006 |
| 7102376 | Power semiconductor module with detector for detecting main circuit current through power semiconductor element A power semiconductor module has a detector for detecting main circuit current passing through a power semiconductor element. The detector includes first and second circuit patterns; a bonding wire connected at first and second bonding points with the first and seco... | 09/05/2006 |
| 7098768 | Chip resistor and method for making the same A chip resistor includes: an insulating chip substrate 11 having an upper surface formed with a resistive film 12 and a pair of left and right upper electrodes 13 at two ends thereof; a cover coat 14 covering the resistive film; auxiliary... | 08/29/2006 |
