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| Number | Title | Issue Date |
| 8188814 | High voltage isolation dual capacitor communication system According to one embodiment, there is provided a high voltage isolation dual capacitor communication system comprising communication drive and sense electrodes and corresponding first and second capacitors that are formed in two separate devices. The two devices are... | 05/29/2012 |
| 7999640 | RF module In a radio-frequency wave module including a transmission path based on a distributed parameter element, the transmission path being part of an input/output terminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted co... | 08/16/2011 |
| 7978031 | High frequency module provided with power amplifier The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC... | 07/12/2011 |
| 7978030 | High-speed interconnects In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-sp... | 07/12/2011 |
| 7741935 | High voltage isolation semiconductor capacitor digital communication device and corresponding package According to one embodiment, there is provided a semiconductor digital communication device comprising communication drive and sense electrodes formed in a single plane, where the electrodes have relatively high sidewalls. The relatively high sidewalls permit low el... | 06/22/2010 |
| 7576629 | Semiconductor device having signal line and reference potential planes separated by a vertical gap A semiconductor device according to the one embodiment of the present invention comprises a signal line; and a reference potential plane which is separated from the signal line and opposed to the signal line, the reference potential plane being provided with a disco... | 08/18/2009 |
| 7573359 | Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes int... | 08/11/2009 |
| 7498907 | Transmission line substrate and semiconductor package A transmission line substrate includes a spurious-wave suppression circuit in which a divider divides a signal line of a driving control signal connected to a semiconductor device into two signal lines of the same phase. A delay unit is connected to one of the two s... | 03/03/2009 |
| 7471175 | Planar mixed-signal circuit board A mixed-signal circuit board can provide a flexible arrangement of multiple RF transmission mediums in a single lightweight and compact structure as well as support embedding electronic devices within RF transmission paths. The transmission mediums may include a voi... | 12/30/2008 |
| 7436270 | Structure and method for improving the reliability of surface mounted ceramic duplexers A duplexer assembly is provided and includes a circuit board and a duplexer connected to the circuit board by a joint material, wherein the joint material provides a joint thickness of at least about 10 mils. ... | 10/14/2008 |
| 7432778 | Arrangement and method impedance matching An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node (204a) for receiving an output current to be impedance matched; a second node (212, 214) for receiving output current from the first node; a f... | 10/07/2008 |
| 7411279 | Component interconnect with substrate shielding An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive la... | 08/12/2008 |
| 7400222 | Grooved coaxial-type transmission line, manufacturing method and packaging method thereof Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and removing signal interference between adjacent signal lines, thus allowi... | 07/15/2008 |
| 7388451 | Thickness tapered substrate launch A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is positioned in a gap in the substrate, on which are formed conventional mi... | 06/17/2008 |
| 7368666 | Surface-mounting type electronic circuit unit without detachment of solder A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface th... | 05/06/2008 |
| 7365415 | High frequency semiconductor device A semiconductor device has a mounting substrate and a semiconductor package mounted on the mounting substrate. The mounting substrate has a substrate body, input/output line conductors on the upper surface of the substrate body, a front-face grounding conductor on t... | 04/29/2008 |
| 7366629 | High frequency module board device The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose m... | 04/29/2008 |
| 7361994 | System to control signal line capacitance A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane coupled to the conductive plane, a conductive via passing through the di... | 04/22/2008 |
| 7358604 | Multichip circuit module and method for the production thereof A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrat... | 04/15/2008 |
| 7351641 | Structure and method of forming capped chips As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal ... | 04/01/2008 |
| 7348597 | Apparatus for performing high frequency electronic package testing Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC, coupled to the interface structure for providing circuit connections, and a... | 03/25/2008 |
| 7342471 | Systems and methods for blocking microwave propagation in parallel plate structures Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequen... | 03/11/2008 |
| 7335965 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 02/26/2008 |
| 7335968 | High permeability composite films to reduce noise in high speed interconnects A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed ... | 02/26/2008 |
| 7335931 | Monolithic microwave integrated circuit compatible FET structure A field effect transistor structure includes a single crystal substrate having: a source, gate and drain electrodes disposed on an upper surface of the substrate, the gate electrode having a region thereof disposed between a region of the drain electrode and a regio... | 02/26/2008 |
| 7327016 | High permeability composite films to reduce noise in high speed interconnects An electronic system is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating ma... | 02/05/2008 |
| 7312671 | Multiplier crystal oscillator The present invention has a configuration such that in a multiplier crystal oscillator wherein a multilayer board having earthing metal films on both principal planes of an intermediate board, and mount boards laminated on both sides thereof, and at least one multip... | 12/25/2007 |
| 7304377 | Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device On a piezoelectric substrate 23, there are provided surface acoustic wave devices F1 and F2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in ... | 12/04/2007 |
| 7298235 | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module... | 11/20/2007 |
| 7294904 | Integrated circuit package with improved return loss A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The high-inductance portion of the trace is proximate to a port of the integrated ... | 11/13/2007 |
| 7295083 | Structure for electromagnetically shielding a substrate A circuit board that requires electromagnetic shielding is enclosed in a cavity formed between a metal case and a base substrate. A ground plane, which is electrically conductive, is embedded in each of the base substrate and the circuit board. The metal case is ele... | 11/13/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7286365 | Electronic substrate for a three-dimensional electronic module The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-out... | 10/23/2007 |
| 7268304 | Microelectronic connection components having bondable wires A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate.... | 09/11/2007 |
| 7259454 | Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device The invention provides a semiconductor chip manufacturing method, including a step of forming a front-surface-side concave portion in a semiconductor substrate having a front surface and a rear surface, a functional device being formed on the front surface, the fron... | 08/21/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7259644 | Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an unbent curved surface and corresponding to the pattern of the micros... | 08/21/2007 |
| 7248129 | Microstrip directional coupler A microwave directional coupler includes a microstrip conductor formed on a dielectric substrate and forming a main transmission line having in and out ports that receive signals to be coupled. A substantially U-shaped microstrip conductor is formed over the dielect... | 07/24/2007 |
| 7248222 | High-frequency module A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other su... | 07/24/2007 |
| 7243410 | Method for manufacturing a probe card A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial sub... | 07/17/2007 |
