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| Number | Title | Issue Date |
| 8400237 | Circuit device including a nano-composite dielectric film A circuit device includes a substrate 11, and a transmission line 10. The transmission line 10 includes a dielectric film 13 formed on the substrate 11, and a signal line formed on the dielectric film 13. The dielectric film... | 03/19/2013 |
| 8390401 | Coplanar waveguide An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically coupled toget... | 03/05/2013 |
| 8362856 | RF transition with 3-dimensional molded RF structure A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a seco... | 01/29/2013 |
| 8344828 | Metamaterial transmission line apparatus and method of implementing the same A metamaterial transmission line for transmitting an electromagnetic wave. The metamaterial transmission line may include a substrate including a substrate configured to include a an upper portion and a lower portion on which a ground plane is formed, a signal line ... | 01/01/2013 |
| 8279025 | Slow-wave coaxial transmission line having metal shield strips and dielectric strips with minimum dimensions An integrated circuit structure includes an interconnect structure over a semiconductor substrate and a coaxial transmission line. The coaxial transmission line includes a signal line, a top plate over the signal line and electrically insulated from the signal line,... | 10/02/2012 |
| 8274343 | Stacked coplanar waveguides having signal and ground lines extending through plural layers An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect... | 09/25/2012 |
| 8212634 | Vertical coplanar waveguide with tunable characteristic impedance design structure and method of fabricating the same An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line includes a signal line, an upper ground line spaced apart from and above the signal line, and a lower grou... | 07/03/2012 |
| 8198962 | Carrier for high frequency signals having conducting wires with roughness portions and a carrier layout method A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thick... | 06/12/2012 |
| 8193880 | Transmitting radio frequency signal in semiconductor structure A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric.... | 06/05/2012 |
| 8183961 | Complementary-conducting-strip structure for miniaturizing microwave transmission line The present invention provides a complementary-conducting-strip (CCS) structure for miniaturizing microwave transmission line. The CCS structure comprises a substrate; a transmission part formed on the substrate, the transmission part consisted of M metal layers and... | 05/22/2012 |
| 8159315 | Substrate, communication module, and communication apparatus A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground l... | 04/17/2012 |
| 8154364 | High-frequency transmission line having ground surface patterns with a plurality of notches therein A high-frequency transmission line includes: a dielectric substrate; a signal line formed on one surface of the dielectric substrate; a first and a second surface ground patterns formed so as to sandwich the signal line at a given distance from the signal line on th... | 04/10/2012 |
| 8143974 | Coplanar waveguide having trenches covered by a passivation film and fabrication method thereof A coplanar waveguide includes a signal line formed on a major surface of a high-resistivity silicon substrate, a pair of ground conductors placed on opposite sides of the signal line, and a pair of trenches formed in the substrate between the signal line and the gro... | 03/27/2012 |
| 8106729 | Complementary-conducting-strip transmission line structure with plural stacked mesh ground planes This invention discloses a complementary-conducting-strip transmission line (CCS TL) structure. The CCS TL structure includes a substrate, at least one first mesh ground plane, m second mesh ground planes having m first inter-media-dielectric (IMD) layers interlaced... | 01/31/2012 |
| 8058954 | Transmission line with a cross-hatched ground plane that is either filled with conductive paint or covered by a conductive foil Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar grou... | 11/15/2011 |
| 8058953 | Stacked coplanar waveguide having signal and ground lines extending through plural layers An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect... | 11/15/2011 |
| 7999638 | Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas... | 08/16/2011 |
| 7978029 | Multiple-layer signal conductor A multiple-layer signal conductor has increased surface area for mitigation of skin effect. Parallel extending elongated strips of conductive material are placed in parallel layers and are separated by a thin layer of dielectric. The elongated strips are conductivel... | 07/12/2011 |
| 7952453 | Structure design for minimizing on-chip interconnect inductance A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line. ... | 05/31/2011 |
| 7855623 | Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference c... | 12/21/2010 |
| 7812694 | Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is dispose... | 10/12/2010 |
| 7791437 | High frequency coplanar strip transmission line on a lossy substrate A substrate having two high frequency components positioned on substrates typically used for lower frequency devices. A coplanar strip transmission line, providing for transmission of high frequency signals, comprises first, second and third parallel, spaced conduct... | 09/07/2010 |
| 7705696 | Structure design for minimizing on-chip interconnect inductance A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line. ... | 04/27/2010 |
| 7626476 | Multi-metal coplanar waveguide A coplanar waveguide CPW using multi-layer interconnection CMOS technology is provided. In the CPW including an interlayer insulator disposed on a substrate, metal multilayers disposed on the interlayer insulator, and a ground line-a signal line-a ground line formed... | 12/01/2009 |
| 7583168 | Resonator An object of the present invention is to provide a resonator capable of constituting a variable filter which has a small size, high mass productivity, low loss and high reproducibility of frequency. According to the present invention, a resonator having a line struc... | 09/01/2009 |
| 7545241 | Nanoparticle transmission line element and method of fabricating the same A microstrip line element is composed of a first electrode layer (10) as a substrate which is more of a metal, a dielectric layer (20) formed by oxidizing, nitriding or oxiynitriding the first electrode layer (10), a conductor layer (30) ... | 06/09/2009 |
| 7518473 | Methods for designing switchable and tunable broadband filters using finite-width conductor-backed coplanar waveguide structures This invention uses the structures of the finite-sized conductor-backed coplanar waveguides for designing broadband switchable and tunable signal filters. The design methods construct a plurality of configurations, which including waveguides, via holes, metallic pos... | 04/14/2009 |
| 7468645 | Signal line circuit device A signal line circuit device is disposed on top of a mounting substrate. The signal line circuit device comprises a dielectric layer, a signal line formed on one surface of the dielectric layer, and a spacer (formed from a solder or a photo solder resist), which is ... | 12/23/2008 |
| 7436267 | Microstrip line dielectric overlay A printed circuit board has a dielectric constant different from the dielectric constant of free space, with at least two microstrip lines routed adjacent to one another on a surface of the printed circuit board. A dielectric coating is applied to at least one of th... | 10/14/2008 |
| 7432774 | Microstrip line dielectric overlay A printed circuit board has a dielectric constant different from the dielectric constant of free space, with at least two microstrip lines routed adjacent to one another on a surface of the printed circuit board. A dielectric coating is applied to at least one of th... | 10/07/2008 |
| 7432776 | Dielectric-filled transmission lines A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission... | 10/07/2008 |
| 7432775 | High speed electronics interconnect having a dielectric system with cylindrical holes therein Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground ... | 10/07/2008 |
| 7425877 | Lange coupler system and method A system and method for the fabrication of high reliability high performance Lange couplers (optionally including capacitors (1011), inductors (1012), multi-layer interconnects (1013), and resistors (1014)) on various thin film hybrid sub... | 09/16/2008 |
| 7414492 | Flexible microwave transmission line A power amplifier (power amplifier) having multiple solid state sub-amplifiers connected in parallel between the power amplifier input and the power amplifier output are described. The signal input to the power amplifier is provided to an RF splitter connected betwe... | 08/19/2008 |
| 7397320 | Non-uniform transmission line for reducing cross-talk from an aggressor transmission line A non-uniform transmission line, including at least a first section with length L1, uniform width W1 and thickness h1, and a second section with length L2, uniform width W2 and thickness h2, joined together to form a composi... | 07/08/2008 |
| 7388448 | Semi-suspended coplanar waveguide on a printed circuit board A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces. ... | 06/17/2008 |
| 7385455 | Monolithic integrated circuit with integrated interference suppression device The invention discloses a monolithic integrated circuit with at least one signal connection carrying a signal and with an interference suppression device integrated in the circuit to reduce radiated interference. The interference suppression device has at least one ... | 06/10/2008 |
| 7372144 | High speed electronics interconnect and method of manufacture Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and i... | 05/13/2008 |
| 7369828 | Electronically tunable quad-band antennas for handset applications An electronically tunable quad-band antenna which includes a tunable high band antenna tuned by at least one tunable varactor associated therewith; the tunable high band antenna further includes a substrate, a patch element on said substrate, at least one voltage tu... | 05/06/2008 |
| 7369020 | Transmission line comprising a plurality of serially connected rotational direction-reversal structures One transmission line includes a first signal conductor which is placed on one surface of a substrate formed from a dielectric or semiconductor and which is formed so as to be curved toward a first rotational direction within the surface, and a second signal conduct... | 05/06/2008 |
