Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 8120418 | Large-scale integrated circuit A large-scale integrated circuit according to the present invention includes a plurality of functional blocks for independently performing a signal processing operation, and a selection controlling circuit for generating a first control signal to select one of the p... | 02/21/2012 |
| 7969239 | Charge pump circuit and a novel capacitor for a memory integrated circuit A novel capacitor for use in a charge pump circuit has a substrate with a planar surface. A first electrode is in a first plane spaced apart from the planar surface. A second electrode is adjacent to and is spaced apart from the first electrode in the first plane an... | 06/28/2011 |
| 7843259 | Field effect transistor circuit and method of operation of field effect transistor circuit for reducing thermal runaway A field transistor is divided into a number of cells (6) and includes a separate first gate line (20) connected to first transistor cells (8) and a separate second gate line (22) connected to second transistor cells (10). A drive c... | 11/30/2010 |
| 7839208 | Integrated circuit and method for operating An integrated circuit and a method for operating an integrated circuit is disclosed. One embodiment provides a semi-conductor component, an electronic system, and a method for operating an integrated circuit. A method for operating an integrated circuit provides app... | 11/23/2010 |
| 7557645 | Semiconductor device In order to prevent a signal of a signal wiring from receiving a bad influence due to a power supply capacitor, provided is a semiconductor including a high reference potential terminal and a low reference potential terminal composing power supply voltage terminals;... | 07/07/2009 |
| 7557644 | Fully integrated floating power supply for high voltage technologies including N-EPI biasing An integrated circuit for feeding data acquisition circuits is provided. The integrated circuit including an inverter application having a half-bridge driver for driving high and low side switches connected in a half bridge, a data acquisition circuit formed in mono... | 07/07/2009 |
| 7525373 | Compensation of process and voltage variability in multi-threshold dynamic voltage scaling circuits This invention relates to adaptively compensating for variations in integrated chip circuitry due to delays caused by multiple thresholds. The multi-threshold adaptive dynamic scaling system disclosed compensates for normal on-chip variations which affect system pro... | 04/28/2009 |
| 7459965 | Semiconductor integrated circuit The invention provides a semiconductor integrated circuit of which malfunction caused by noise from outside is reduced. The semiconductor integrated circuit has a power supply terminal, a ground terminal, internal circuits supplied with a power supply potential and ... | 12/02/2008 |
| 7385434 | Circuit for preventing latch-up in DC-DC converter There is provided a circuit for preventing latch-up in a DC-DC. The circuit for preventing a latch-up phenomenon in a DC-DC converter, the DC-DC converter having a first and a second DC-DC converters coupled with each other in one chip for receiving an input voltage... | 06/10/2008 |
| 7379713 | Method for wireless data interchange between circuit units within a package, and circuit arrangement for performing the method Method for wireless data interchange between circuit units within a package, and circuit arrangement for performing the method. The invention provides a circuit arrangement having circuit units (101a-101n) which are arranged in a package ... | 05/27/2008 |
| 7352232 | Method and apparatus for extending the size of a transistor beyond one integrated circuit A technique for extending the size of a power transistor beyond one integrated circuit is disclosed. An example apparatus includes a first integrated circuit chip having a first switch, which includes first, second and third terminals. The first integrated circuit c... | 04/01/2008 |
| 7342440 | Current regulator having a transistor and a measuring resistor The invention relates to a current regulator having the following features: a first semiconductor body (1; 1′) having a first and second terminal contact (11, 12), a transistor (T) having a control ... | 03/11/2008 |
| 7334199 | System and method for breaking a feedback loop using a voltage controlled voltage source terminated subnetwork model A system and method is disclosed for breaking a feedback loop by replacing at least one component in the feedback loop with a model containing two physically disconnected subnetworks that have terminals that are connected to ground with voltage controlled, voltage s... | 02/19/2008 |
| 7321257 | Semiconductor device capable of detecting an open bonding wire using weak current An IC chip has a series regulator built therein. A battery voltage is applied to an input pin. An output of a transistor constituting the series regulator occurs at an output pin via an output pad. A feedback signal derived from an output voltage occurs at an end of... | 01/22/2008 |
| 7301363 | Method and system for improving communication between logic elements in an integrated circuit A method, apparatus and machine-readable medium for improving communication between logic elements in an integrated circuit (IC) is provided. This is achieved by using a point-to-point approach for IC placement and routing, to address the increase in complexity in t... | 11/27/2007 |
| 7295448 | Interleaved power converter A power converter architecture interleaves full bridge converters to alleviate thermal management problems in high current applications, and may, for example, double the output power capability while reducing parts count and costs. For example, one phase of a three ... | 11/13/2007 |
| 7289329 | Integration of planar transformer and/or planar inductor with power switches in power converter A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled... | 10/30/2007 |
| 7290158 | Method of controlling data transfer within a semiconductor integrated circuit based on a clock sync control signal A semiconductor integrated circuit device comprises an internal bus, a plurality of internal modules connected to the internal bus and including a main module performing a predetermined function, and a clock generating unit generating a reference clock and a clock s... | 10/30/2007 |
| 7279795 | Stacked die semiconductor package In one embodiment, the present invention includes a semiconductor package including a first semiconductor die with first active circuitry and a second semiconductor die with second active circuitry. An intermediate substrate may be located in the package between the... | 10/09/2007 |
| 7256068 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/14/2007 |
| 7230470 | Power switch using a field-effect transistor (FET) pair A power switch, and a method, for use with a power switch having a field-effect transistor (FET) including source, drain and gate terminals. The power switch includes a first field-effect transistor (FET) having a first drain coupled to the drain terminal, a first s... | 06/12/2007 |
| 7221040 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 05/22/2007 |
| 7215128 | Output circuit for semiconductor device, semiconductor device having output circuit, and method of adjusting characteristics of output circuit To decrease the circuit scale necessary for the calibration of the output circuit and to decrease the time required for the calibration operation. The invention includes a first output buffer and a second output buffer that are connected to a data pin, and a calibra... | 05/08/2007 |
| 7212065 | Semiconductor integrated circuit device capable of restraining variations in the power supply potential To restrain variations in the power supply potential caused among a plurality of integrated circuits as well as the voltage drop of the power supply potential that has reached each block. A semiconductor integrated circuit device is provided with integrated circuits... | 05/01/2007 |
| 7199653 | Semiconductor device with operation mode set by external resistor A semiconductor device capable of setting a large number of operation modes with a single external terminal, while ensuring a stable operation mode regardless of fluctuations in the power supply voltage. The semiconductor device includes an internal circuit having a... | 04/03/2007 |
| 7199676 | Frequency adjustment circuit A frequency adjustment circuit that maintains a target frequency even when frequency adjustment data of zapping circuit is changed by an external noise is offered. The frequency adjustment circuit includes a reset signal generation circuit, a frequency adjustment da... | 04/03/2007 |
| 7180763 | Power converter A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge ter... | 02/20/2007 |
| 7176566 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 02/13/2007 |
| 7170199 | Matrix converter for transforming electrical energy A matrix converter for transforming electrical energy between at least one voltage source, in particular a power supply network, and at least one current source, in particular a load, said converter including a matrix of switches connecting said voltage sources to s... | 01/30/2007 |
| 7166918 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 01/23/2007 |
| 7167043 | Decoupling circuit for co-packaged semiconductor devices A model for noise coupling in copackaged semiconductor devices due to coupling through parasitic impedances, and a method and decoupling circuit to minimize the effects of such noise. In one example, which is not intended to be limiting either as to the application ... | 01/23/2007 |
| 7157973 | Layout technique for matched resistors on an integrated circuit substrate Provided a method of reducing impedance variations in an electrical circuit structured and arranged for placement on an integrated circuit (IC) substrate. The method includes forming sets of parallel connected resistors, each set corresponding to one of the impedanc... | 01/02/2007 |
| 7142033 | Differential clocking scheme in an integrated circuit having digital multiplexers A system for distributing a small signal differential signal to a circuit element. The system includes: a first converter configured to convert a first small signal differential signal to a first two phase full CMOS differential signal for input into the differentia... | 11/28/2006 |
| 7135759 | Individualized low parasitic power distribution lines deposited over active integrated circuits An integrated circuit (IC) chip, mounted on a leadframe, has a network of power distribution lines deposited on the surface of the chip so that these lines are located over active components of the IC, connected vertically by metal-filled vias to selected active com... | 11/14/2006 |
| 7132313 | Diamond heat spreading and cooling technique for integrated circuits A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the... | 11/07/2006 |
| 7129765 | Differential clock tree in an integrated circuit A clock distribution network having: a main trunk configured to provide a differential clock signal; a plurality of branches coupled to the main trunk for distributing the differential clock signal to a plurality of circuit elements on the integrated circuit; and a ... | 10/31/2006 |
| 7126406 | Programmable logic device having an embedded differential clock tree A clock distribution network having: a backbone clock signal line configured to provide a differential clock signal; multiple branches coupled to the backbone clock signal line for distributing the differential clock signal to multiple programmable function elements... | 10/24/2006 |
| 7115462 | Processes providing high and low threshold p-type and n-type transistors Methods of fabricating negative-channel metal-oxide semiconductor (NMOS) devices and positive-channel metal-oxide semiconductor (PMOS) devices having complementary threshold voltages are described. Elements of lower-threshold voltage NMOS devices are formed at first... | 10/03/2006 |
| 7091584 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/15/2006 |
| 7084690 | Semiconductor integrated circuit device In integrated circuit (IC) devices, skew concerns between the clock pulses supplied to different latches hinder high speed operation. An IC device therefor includes a first clock processor means to generate a third clock pulse in response to first and second clock p... | 08/01/2006 |
