Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7884632 | Semiconductor inspecting device In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface ... | 02/08/2011 |
| 7859283 | Probe apparatus, probing method, and storage medium A probe apparatus is capable of being scaled-down and reducing a manufacturing cost thereof in a probe apparatus having a plurality of probe apparatus main bodies. A loader unit for transferring a wafer between carriers accommodating therein wafers and the probe app... | 12/28/2010 |
| 7855568 | Probe apparatus with mechanism for achieving a predetermined contact load A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably connect the cylinder mechanisms to a head plate horizontally supporting ... | 12/21/2010 |
| 7852097 | Methods and apparatuses for improved positioning in a probing system An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information fro... | 12/14/2010 |
| 7852096 | Spring-loaded, removable test fixture for circuit board testers A circuit board tester that uses an axial translation to bring a unit under test (UUT) into physical and electric contact with a series of electrical probes. The element on the tester that comes into contact with the UUT, on the side opposite the probes, is both spr... | 12/14/2010 |
| 7847570 | Laser targeting mechanism An automated test equipment system includes a peripheral including first mechanical alignment features; a test head including second mechanical alignment features arranged in a pattern corresponding to the first mechanical alignment features and configured to engage... | 12/07/2010 |
| 7839156 | Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable contact body belonging to the sensor unit, the method used in inspec... | 11/23/2010 |
| 7821278 | Method and device for testing of non-componented circuit boards The invention relates to a method and a device for the testing of noncomponented circuit boards. The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to the... | 10/26/2010 |
| 7808259 | Component assembly and alignment A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the... | 10/05/2010 |
| 7800387 | Method for detecting tips of probes, alignment method and storage medium storing the methods, and probe apparatus There is provided a method for detecting a height of a tip of a probe before detecting a horizontal position of the probe tips of the probe, by using an alignment device having a first imaging unit and a second imaging unit provided at the mounting table. In the met... | 09/21/2010 |
| 7795892 | Probe card Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into... | 09/14/2010 |
| 7791363 | Low temperature probing apparatus A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and c... | 09/07/2010 |
| 7791362 | Inspection apparatus An inspection apparatus includes a movable mounting table having a temperature control device, an elevation drive unit for vertically moving the mounting table, a controller for controlling the elevation drive unit and a probe card having probes arranged above the m... | 09/07/2010 |
| 7791361 | Planarizing probe card A novel planarizing probe card for testing a semiconductor device is presented. The probe card is adapted to come into contact with a probe card mount that is in adjustable contact with the prober. The probe card includes a printed circuit board affixed to a stiffen... | 09/07/2010 |
| 7782071 | Probe card analysis system and method A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell... | 08/24/2010 |
| 7777511 | Inspection apparatus having a capacitive pressure sensor between the mounting body and the support body An inspection apparatus includes a movable mounting table for mounting thereon a target object, a probe card disposed above the mounting table and a control unit for controlling the mounting table. The target object is inspected by bringing a plurality of electrode ... | 08/17/2010 |
| 7777510 | Wafer inspecting apparatus, wafer inspecting method and computer program There is provided a wafer inspecting apparatus which reduces a preheating time of a probe, and prevents the probe and a wafer from being damaged. The apparatus has a stage (10) which allows a semiconductor wafer (W) to be mounted on a top face thereof and hea... | 08/17/2010 |
| 7772862 | Alignment method, tip position detecting device and probe apparatus An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the pro... | 08/10/2010 |
| 7768285 | Probe card for semiconductor IC test and method of manufacturing the same Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (5), and which has, in a peripheral portion thereof, a thin film sheet (9) fixed to a support, such... | 08/03/2010 |
| 7764076 | Method and apparatus for aligning and/or leveling a test head One embodiment of the present invention is an alignment apparatus useful to align a test head that includes: (a) two or more fluid chambers disposed in fixed relation to each other, the chambers having a movable wall and one or more apertures for admitting or releas... | 07/27/2010 |
| 7759955 | Method and device for position detection using connection pads A semiconductor and method is disclosed. One embodiment includes a detector arrangement to detect the position of a connection element. A probe tip, the detector arrangement including first connection pads are arranged on a substrate surface. A first circuit is conn... | 07/20/2010 |
| 7755376 | Camera based pin grid array (PGA) inspection system with pin base mask and low angle lighting An inspection system, for inspecting pin grid arrays on integrated circuit devices includes a pin base mask configured to receive a device having a pin grid array. A dark-field, low-angle lighting system emits light onto the pin grid array. The pin base mask and low... | 07/13/2010 |
| 7750653 | Automated contact alignment tool An electronic testing machine that tests electronic components using test contacts is disclosed. A contact takes a plurality of electrical readings for a component retained in a test plate as the test plate is moved in microsteps. These electrical readings can be us... | 07/06/2010 |
| 7741861 | Test apparatus for the testing of electronic components In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The ... | 06/22/2010 |
| 7733107 | Charged device model contact plate A tester for applying very fast transmission line pulses (“VFTLP”) to select pins of a device under test (“DUT”), for example, an integrated circuit. The tester also provides for leakage measurement testing of the DUT after VFTLP testing. An end of a coaxial... | 06/08/2010 |
| 7733108 | Method and arrangement for positioning a probe card A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position a... | 06/08/2010 |
| 7728612 | Probe card assembly and method of forming same A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until... | 06/01/2010 |
| 7724008 | Methods and apparatus for planar extension of electrical conductors beyond the edges of a substrate Concurrent electrical access to the pads of integrated circuits on a wafer is provided by an edge-extended wafer translator that carries signals from one or more pads on one or more integrated circuits to contact terminals on the inquiry-side of the edge-extended wa... | 05/25/2010 |
| 7724007 | Probe apparatus and probing method A probe apparatus includes an imaging unit imaging probes and a first and a second imaging unit imaging the wafer surface. The apparatus further includes a control unit obtaining positions of a mounting table at which focuses of the imaging unit and the first imagin... | 05/25/2010 |
| 7719297 | Probe apparatus and method for measuring electrical characteristics of chips and storage medium therefor A probe apparatus for sequentially testing electrical characteristics of chips includes an imaging unit for capturing images of the electrode pads of the inspection substrate, and a unit for calculating contact positions at which the probes are expected to contact w... | 05/18/2010 |
| 7710135 | Method for registering probe card and a storage medium storing program thereof A probe card registration method is for registering a probe card for use in inspecting electrical characteristics of a target object in a probe apparatus for performing the inspecting. The probe card registration method includes detecting a height of a load sensor p... | 05/04/2010 |
| 7701236 | Each inspection units of a probe apparatus is provided with an imaging unit to take an image of a wafer A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other ... | 04/20/2010 |
| 7692437 | Systems and methods for testing packaged microelectronic devices Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of t... | 04/06/2010 |
| 7688096 | Contact load measuring apparatus and inspecting apparatus An inspecting apparatus is provided for inspecting electrical characteristics of an object (W) to be inspected, such as a semiconductor wafer. The inspecting apparatus is provided with a placing table (11) for supporting the object, a lift mechanism (12 | 03/30/2010 |
| 7671614 | Apparatus and method for adjusting an orientation of probes Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mo... | 03/02/2010 |
| 7649370 | Evaluation method of probe mark of probe needle of probe card using imaginary electrode pad and designated determination frame An evaluation method of a probe mark of a probe needle of a probe card, includes the steps of: forming the probe mark of the probe needle on a probe mark evaluation wafer; recognizing the probe mark with imaging; and overlapping an imaginary electrode pad with the p... | 01/19/2010 |
| 7633306 | System and method of measuring probe float A system and method allow accurate calculation of probe float through optical free-hanging and electrical planarity measurement techniques. In accordance with an examplary embodiment, probe float may be determined by acquiring a free-hanging planarity measurement, o... | 12/15/2009 |
| 7629805 | Method and system to dynamically compensate for probe tip misalignement when testing integrated circuits Method for dynamically compensating probe tip misalignment with a semiconductor wafer. The wafer is located on a handler and the wafer is adjusted to a first temperature. Probe tips of an inspection system are moved to a first position centered above pads of a test ... | 12/08/2009 |
| 7629804 | Probe head assembly for use in testing multiple wafer die A wafer probe head assembly for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs formed on a wafer to be tested includes an adapter board and a probe card assembly including a space trans... | 12/08/2009 |
| 7626405 | Suspension system and adjustment mechanism for an integrated chip and method Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a pressure plate member adapted to fit compatibly within the clamp assembly. ... | 12/01/2009 |
