Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
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| Number | Title | Issue Date |
| 7859282 | Electrical connecting apparatus An electrical connecting apparatus for use in electrical measurement of a device under test comprises a supporting member and a flat plate-like probe base plate. On one surface of the probe base plate are provided multiple probes abutting on electrical connecting te... | 12/28/2010 |
| 7804316 | Pusher, pusher unit and semiconductor testing apparatus A pusher 200 that pushes a semiconductor device under test 300 against a test socket 500 in a semiconductor test apparatus 20 is provided that includes a main body section 210 that is thermally coupled with the thermal source 40... | 09/28/2010 |
| 7800386 | Contact device and method for producing the same Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film o... | 09/21/2010 |
| 7800385 | Apparatus and method for testing electrical interconnects A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the requ... | 09/21/2010 |
| 7759954 | Semiconductor probe having resistive tip and method of fabricating the same Provided are a semiconductor probe having a resistive tip and a method of fabricating the semiconductor probe. The semiconductor probe includes a resistive tip which is doped with a first impurity, and of which an apex portion is doped with a low concentration of a ... | 07/20/2010 |
| 7737712 | Probe-testing device and method of semiconductor device A probe-testing device includes probe tips configured to apply inputs to pads of a semiconductor chip, wherein one of the probe tips is connected to a calibration pad for impedance adjustment and a calibration resistor is connected thereto. ... | 06/15/2010 |
| 7675305 | Vertical-type electric contactor and manufacture method thereof A vertical-type electric contactor connected to a bump of an electric contactor is provided. The vertical-type electric contactor includes a support beam, vertically bonded with the bump, in which at least two elastic parts are spaced apart from each other; a fixed ... | 03/09/2010 |
| 7671613 | Probing blade conductive connector for use with an electrical test probe A conductive connector includes a flexible-deflectable extension having a probing end and a head connection end. A conductive transmission path extends between the probing end and the head connection end. A pogo-rotational-action pin is electrically connected to the... | 03/02/2010 |
| 7602202 | Semiconductor probe with high resolution resistive tip having doping control layer and method of fabricating the same A semiconductor probe and a method of fabricating the same are provided. The semiconductor probe includes a cantilever doped with first impurities, a resistive tip which protrudes from an end of the cantilever and doped lightly with second impurities, doping control... | 10/13/2009 |
| 7602203 | Probe and probe card An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A through hole is formed in the contactor. In the probe, a fitting/loc... | 10/13/2009 |
| 7541823 | Circuit board checker and circuit board checking method The present invention provides an inspection apparatus for circuit board for conducting electrical inspection by electrically connecting inspection object electrodes of the circuit board to a plurality of inspection electrodes formed in accordance with a pattern cor... | 06/02/2009 |
| 7518388 | Contactor for electronic components and test method using the same A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an ... | 04/14/2009 |
| 7511521 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component In one embodiment, the invention provides a test assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component. The assembly comprises a contactor assembly to interconnect with the test component, a ... | 03/31/2009 |
| 7482824 | Polycrystalline contacting component and test tool having the contacting component A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact i... | 01/27/2009 |
| 7449903 | Method and system for the optical inspection of contact faces at semiconductor devices with different appearances A system and method is provided that reliably determines the position of contact needle tips on a contact pad irrespective of the contact pad geometry and the character of the contact pad surface. For example, optical recognition of the surface of the contact pad is... | 11/11/2008 |
| 7443179 | Zero motion contact actuation A device for testing small electronic components includes a test plate for moving a plurality of spaced electronic components to a test station. A roller is designed to press on the test plate and electronic component exerting a first force between 10-20 grams when ... | 10/28/2008 |
| 7436193 | Thin film probe card contact drive system A probe card includes a flexible membrane, a plurality of probes attached to the flexible membrane, and a layer of foam connected to the flexible membrane so that when the probes are moved into the flexible membrane, the layer of foam is also deflected to produce a ... | 10/14/2008 |
| 7405578 | Device for monitoring the contact integrity of a joint The invention relates to a device that can be used to monitor the contact integrity of a joint that is of an impervious contact surface between two parts (4 and 5) including a set of conductive patterns (8) which are distributed over the two con... | 07/29/2008 |
| 7404124 | On-chip sampling circuit and method Through addressing circuitry, a sampling circuit can choose a unique internal node/signal on an encapsulated/packaged chip to be output to one or more drivers. The chosen signals available at the target node are directed either through a select circuit to an output ... | 07/22/2008 |
| 7398181 | Method for retrieving reliability data in a system An aspect of the present invention is a method for retrieving reliability data in a system. The method includes coupling a device to the system, collecting the reliability data with the device and retrieving the reliability data from the device. ... | 07/08/2008 |
| 7394265 | Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive A probe card on which micro probe needles are arranged at high density and with high precision without need of a complicated structure or variation in needle height. A probe card 1 installed in a wafer tester includes a board 2 having a wiring pattern ... | 07/01/2008 |
| 7385412 | Systems and methods for testing microfeature devices Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate having a front side, a backside, and a plurality of microelectronic d... | 06/10/2008 |
| 7385407 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component In one embodiment, the invention provides a test assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component. The assembly comprises a contactor assembly to interconnect with the test component, a ... | 06/10/2008 |
| 7372286 | Modular probe card A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circu... | 05/13/2008 |
| 7368926 | Electric signal connecting device and probe assembly and probing device using the same The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into c... | 05/06/2008 |
| 7368814 | Surface mount adapter apparatus and methods regarding same An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package)... | 05/06/2008 |
| 7365550 | Low impedance test fixture for impedance measurements A test fixture couples with a test instrument to measure impedance of a device. An upper layer of the test fixture has (a) a first and a second solder pad for electrical connection to the device, (b) a first, second, third and fourth multi-solder pad for electrical ... | 04/29/2008 |
| 7362113 | Universal wafer carrier for wafer level die burn-in A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wa... | 04/22/2008 |
| 7358751 | Contact pin assembly and contactor card A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling str... | 04/15/2008 |
| 7354305 | Area array device test adapter Methods and systems are provided for testing circuits having electronic devices. In one embodiment, an electronic device test adapter comprises a base interface section, at least one test interface section, and at least one flexible section. The base interface secti... | 04/08/2008 |
| 7355421 | Semiconductor apparatus testing arrangement and semiconductor apparatus testing method A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode ... | 04/08/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7330037 | Electrical characteristic measuring probe and method of manufacturing the same In an electrical characteristic measuring probe of the present invention constructed by assembling a plurality of probe parts, each comprising a base portion, a plurality of terminal portions extended outward from one end of the base portion, wiring patterns extende... | 02/12/2008 |
| 7330670 | Bottom level detection device for burst mode optical receiver A bottom level detection device is disclosed for a burst mode optical receiver. The receiver includes a converter for converting a burst mode signal into a voltage signal and an automatic gain controller for automatically controlling a gain of the converter. The bot... | 02/12/2008 |
| 7330036 | Engagement Probes An engagement probe for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes po... | 02/12/2008 |
| 7319337 | Method and apparatus for pad aligned multiprobe wafer testing A control unit of a wafer prober for implementing wafer examination, using a probe card including a multiple number of probes, executes a multiple number of measuring operations by bringing the probes of the probe card into contact with bonding pads formed on a wafe... | 01/15/2008 |
| 7319339 | Inspection apparatus to break the oxide of an electrode by fritting phenomenon Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utiliz... | 01/15/2008 |
| 7317311 | Wafer handling checker A plurality of wafers each having a conductive film on each face thereof are housed in slots of a cassette, and a potential of “H” level is applied from a control box to each wafer via an electrode. A conductive suction part of a vacuum pincette is connected to ... | 01/08/2008 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
