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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 7868632 | Composite motion probing An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes.... | 01/11/2011 |
| 7855567 | Electronic device testing system and method The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and ... | 12/21/2010 |
| 7746090 | System for testing connections of two connectors A system for testing connections of two connectors, each of which includes a pair of verification pins and a number of signal pins, includes a verification testing module, a controlling module, a signal testing module, and a reporting module. The verification testin... | 06/29/2010 |
| 7649369 | Probe and method of manufacturing probe In accordance with an increase in speed, a wiring structure has rapidly become more microscopic and thinner and a wiring layer has become extremely thin, and therefore, giving a contact load to a probe for the inspection as has been conventionally done causes damage... | 01/19/2010 |
| 7405578 | Device for monitoring the contact integrity of a joint The invention relates to a device that can be used to monitor the contact integrity of a joint that is of an impervious contact surface between two parts (4 and 5) including a set of conductive patterns (8) which are distributed over the two con... | 07/29/2008 |
| 7404124 | On-chip sampling circuit and method Through addressing circuitry, a sampling circuit can choose a unique internal node/signal on an encapsulated/packaged chip to be output to one or more drivers. The chosen signals available at the target node are directed either through a select circuit to an output ... | 07/22/2008 |
| 7388391 | Method for evaluating at least one electrical conducting structure of an electronic component An apparatus and method for evaluating the integrity of each contact pin of an electronic component having multiple contact pins. In one embodiment, the apparatus includes a test device and a measuring instrument. The test device comprises a component fixture config... | 06/17/2008 |
| 7372283 | Probe navigation method and device and defect inspection device A probe navigation method, a navigation device, and a defect inspection device wherein in a charged particle beam system provided with probes for electrical characteristics evaluation, probing can be easily carried out regardless of the equipment user's level of ski... | 05/13/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7362116 | Method for probing impact sensitive and thin layered substrate A method of moving a substrate to a probe card. The method includes moving a probe card and a substrate vertically closer to one another employing dynamically changing velocities during the moving. More than two different velocities are used during the moving. The v... | 04/22/2008 |
| 7355421 | Semiconductor apparatus testing arrangement and semiconductor apparatus testing method A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode ... | 04/08/2008 |
| 7348786 | Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate... | 03/25/2008 |
| 7330040 | Test circuitry wafer Method and apparatus for testing a plurality of devices on a device wafer. One embodiment provides a test circuitry wafer having a first surface and a second surface, the test circuitry wafer comprising a plurality of contact pads disposed on the first surface for c... | 02/12/2008 |
| 7323894 | Needle alignment verification circuit and method for semiconductor device A needle alignment verification circuit includes a sensor pad, a first transmission line, a control element, a data pad, a second transmission line, and a response element. The sensor pad includes an insulation part and a conduction part. The first transmission line... | 01/29/2008 |
| 7319339 | Inspection apparatus to break the oxide of an electrode by fritting phenomenon Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utiliz... | 01/15/2008 |
| 7307436 | Electrical feedback detection system for multi-point probes An electrical feedback detection system for detecting electrical contact between a multi-point probe and an electrically conducting material test sample surface. The electrical feedback detection system comprises an electrical detector unit connected to a multitude ... | 12/11/2007 |
| 7304489 | Inspection method and inspection apparatus Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utiliz... | 12/04/2007 |
| 7292056 | Membrane with bumps, method of manufacturing the same, and method of testing electrical circuit Provided is a membrane with bumps whose variations in shape are minimized to a least extent and which are capable of supporting a micro electrical circuit. The membrane with bumps includes: a plurality of bumps, each of which is made up of a probe and an electrode, ... | 11/06/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7268571 | Method for validating and monitoring automatic test equipment contactor A method and apparatus is provided for characterizing a contactor for automated semiconductor device testing, the method first comprising placing the contactor on a contactor test board positioned within an automated test apparatus. A first probe of the automated te... | 09/11/2007 |
| 7268568 | Probe card The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object. A probe card A includes: first an... | 09/11/2007 |
| 7269029 | Rapid fire test board A test board for testing a packaged integrated circuit has a set of contacts matching counterpart contacts on a socket. The contacts are each connected to a first voltage plane containing power, a second voltage plane carrying ground, and a set of terminals that wil... | 09/11/2007 |
| 7259579 | Method and apparatus for semiconductor testing utilizing dies with integrated circuit A method and apparatus for testing semiconductor wafers in which certain contact areas of dies not used in the testing and required to be at a predetermined voltage during testing are connected to the predetermined voltage via an integrated circuit in the die. ... | 08/21/2007 |
| 7256592 | Probe with trapezoidal contractor and device based on application thereof, and method of producing them A probe is disclosed, comprising a beam, which has a front end, an intermediate portion and a base end. The leading end is a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe. The probe includes a substantia... | 08/14/2007 |
| 7253649 | Automatic mercury probe for use with a semiconductor wafer An upward facing probing mechanism using mercury probe contacts for accurate automatic multi-site measurements of a semiconductor wafer, especially of ultra-shallow ion implanted layers on a semiconductor wafer held top surface facing downward. A fixed force is appl... | 08/07/2007 |
| 7250782 | Method for testing non-componented circuit boards A method of testing circuit boards, in particular non-componented circuit boards in which the level of the surface of a circuit board to be tested is detected automatically in a contacting process, and the further contacting operations are then controlled on the bas... | 07/31/2007 |
| 7245137 | Test head assembly having paired contact structures A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can include first spring contact structures and second spring contact str... | 07/17/2007 |
| 7230439 | Method for detecting and monitoring wafer probing process instability A system and method for detecting and monitoring wafer probe stability including the steps of, probing each die on a wafer, and for each die determining whether the result of the probe is a pass or a fail. If the result of a probe is a fail, re-probing the die and d... | 06/12/2007 |
| 7227370 | Semiconductor inspection apparatus and manufacturing method of semiconductor device When electrical properties of semiconductor chips of a semiconductor wafer are inspected by bringing plural contact terminals disposed on the principal surface of a probe sheet of a probe cassette constituting a semiconductor inspection apparatus into contact with p... | 06/05/2007 |
| 7221177 | Probe apparatus with optical length-measuring unit and probe testing method A probe apparatus with control-position detection means is provided for testing an electrical characteristic of a to-be-tested object formed on a substrate W. The probe apparatus includes a prober chamber, a susceptor provided in the prober chamber for placing there... | 05/22/2007 |
| 7221176 | Vacuum prober and vacuum probe method In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stag... | 05/22/2007 |
| 7216809 | Appliance with an IC card reader and overload protection The appliance comprises an IC card reader for an operation with an IC card and a power supply for providing a supply voltage, in particular for the IC card. The appliance comprises further an overload protection circuit, which simulates an IC card extraction in case... | 05/15/2007 |
| 7215132 | Integrated circuit and circuit board In an integrated circuit implemented on a circuit board, output lines of an output circuit that outputs a logic signal are connected to the circuit board by soldering of a leadless terminal that cannot be seen as being implemented. A fault diagnosing unit tests an o... | 05/08/2007 |
| 7208936 | Socket lid and test device Various embodiments related to an integrated lid and test device for a socket, such as a land grid array (LGA) socket, that functions as a lid, as a testing device, and/or as a pick and place lid. Specifically, the integrated lid may provide test capability, in manu... | 04/24/2007 |
| 7209849 | Test system, added apparatus, and test method There is provided a test system that tests a device under test. The test system includes a test apparatus that tests the device under test on the basis of an event, and an added apparatus that is added between the device under test and the test apparatus when an int... | 04/24/2007 |
| 7202682 | Composite motion probing An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes.... | 04/10/2007 |
| 7196532 | Test probe for semiconductor package An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball... | 03/27/2007 |
| 7190183 | Selecting die placement on a semiconductor wafer to reduce test time A die placement of dies on a wafer is selected to reduce test time of the dies by obtaining a die placement and determining placements of a tester head needed to test the dies in the die placement. A number of touchdowns needed in the determined placements of the te... | 03/13/2007 |
| 7183785 | Test system and method for reduced index time A system for testing with an automated test equipment (ATE). The ATE includes a tester, an interface board connected to the tester, a first socket and a second socket of the interface board, a first manipulator arm connected to the tester, and a second manipulator a... | 02/27/2007 |
| 7185247 | Pseudo bus agent to support functional testing Methods, systems, and apparatuses are provided to emulate bus transactions for a device under test (DUT). Test data is sent from a testing device to a cache of a DUT. When data needs to be read or written to locations outside of the cache (e.g., bus action is needed... | 02/27/2007 |
