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| Number | Title | Issue Date |
| 7884630 | IC carrie, IC socket and method for testing IC device An IC device (10) held on an IC carrier (24) is a double-sided electrode type BGA IC device (10) provided with bump electrodes (14) on a first surface of a package. The IC device has, on a second surface opposite the first surface, (a) a ... | 02/08/2011 |
| 7876116 | Compliant chuck for semiconducting device testing and chiller thereof A compliant chuck has a top base assembly, a bottom bracket assembly, a contact plate, a sensor device, a thermoelectric cooling module and a heat-dissipating module. The bottom bracket assembly has a center opening. The contact plate is disposed between the top bas... | 01/25/2011 |
| 7830163 | Testing circuit board for testing devices under test The invention discloses a testing circuit board for placing a device under test and further testing the device under test according to a plurality of testing signals generated by a tester. The testing circuit board includes a circuit board and a plurality of sets of... | 11/09/2010 |
| 7825676 | Contactor and test method using contactor A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that cont... | 11/02/2010 |
| 7825677 | Test jig for testing a packaged high frequency semiconductor device A test jig is for testing electrical characteristics of a high frequency semiconductor device in a package having a ground electrode and a high frequency signal electrode. The test jig includes a test circuit substrate with a microstrip line structure, a grounding b... | 11/02/2010 |
| 7816932 | Test system with high frequency interposer An interposer with a conductive housing is disclosed. Conductive members pass through insulators positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced ground structure for signal conductors passing throu... | 10/19/2010 |
| 7816933 | Semi-generic in-circuit test fixture A semi-generic test fixture for testing printed circuit boards (PCBs) and/or for testing printed circuit boards assemblies (PCBAs) is presented. The semi-generic test fixture implements a combination of generic and customized parts for tester-to-fixture interface in... | 10/19/2010 |
| 7808258 | Test interposer having active circuit component and method therefor A device under test (DUT) is tested via a test interposer. The test interposer includes a first set of contacts at a first surface to interface with the contacts of a load board or other interface of an automated test equipment (ATE) and a second set of contacts at ... | 10/05/2010 |
| 7768284 | Test apparatus for testing a semiconductor device, and method for testing the semiconductor device A test apparatus for testing a semiconductor device having contact pads on its top and its back, and to a method for testing the semiconductor device is disclosed. In one embodiment, the test apparatus has a test socket which is mounted on a test printed circuit boa... | 08/03/2010 |
| 7737711 | Test apparatus having pogo probes for chip scale package A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body com... | 06/15/2010 |
| 7733106 | Apparatus and method of testing singulated dies An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to all... | 06/08/2010 |
| 7728611 | Compressive conductors for semiconductor testing An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly. The interconnect assembly comprises a plurality of electrical conductors, the plurality of con... | 06/01/2010 |
| 7688094 | Electrical connecting apparatus In an electrical connecting apparatus, a first guide is arranged in a plate-shaped lower base in which the contactors are arranged. The first guide has a first space for guiding a device under test so that its electrodes will contact the tips of contactors and for p... | 03/30/2010 |
| 7688095 | Interposer structures and methods of manufacturing the same Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and ... | 03/30/2010 |
| 7683648 | Integrated circuit socket and method of use for providing adjustable contact pitch An integrated circuit socket apparatus and method of use are provided. Included is a body capable of receiving an integrated circuit including a plurality integrated circuit contacts. Further provided is a bottom adapter assembly removably coupled to the body. The b... | 03/23/2010 |
| 7667473 | Flip-chip package having thermal expansion posts A semiconductor package having a substrate and a die includes a plurality of conductive posts attached to the substrate and bonded to an active surface of the die via a plurality of corresponding microbumps. The conductive posts are flexible and extend beyond the to... | 02/23/2010 |
| 7663387 | Test socket A support block has a first face, a second face opposed to the first face, and first and second through holes communicating between the first face and the second face, and is formed with resin material. The first face, the second face, and the first and second throu... | 02/16/2010 |
| 7656179 | Relay connector having a pin block and a floating guide with guide hole A relay connector connects a terminal of a connector to be inspected provided on a board for inspection to a measuring instrument. The relay connector includes: a pin block; a floating guide, arranged so as to approach and separate with respect to the pin block and ... | 02/02/2010 |
| 7656177 | Test apparatus There is provided a test apparatus that tests an electronic device. The test apparatus includes a socket board in which a socket for mounting thereon the electronic device is provided, and a test head that detachably holds the socket board and transmits source power... | 02/02/2010 |
| 7656178 | Method for calibrating semiconductor device tester A method for calibrating a semiconductor device tester is disclosed. In accordance with method of the present invention, a timing is calibrated using a programmable delay device and calibration boards so as to remove a timing difference between channels and compensa... | 02/02/2010 |
| 7633305 | Method for evaluating semiconductor wafer and apparatus for evaluating semiconductor wafer The present invention is a method for evaluating a semiconductor wafer by measuring an electric characteristic of the semiconductor wafer by using a mercury electrode, wherein when the semiconductor wafer is held on a wafer chuck that the mercury electrode is formed... | 12/15/2009 |
| 7619426 | Performance board and cover member A performance board which is attached to a semiconductor test apparatus and on which devices under test are mounted is provided. The performance board includes: a substrate; sockets which are attached to the surface of the substrate and on which devices under test a... | 11/17/2009 |
| 7602201 | High temperature ceramic socket configured to test packaged semiconductor devices A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole o... | 10/13/2009 |
| 7598760 | High temperature ceramic die package and DUT board socket A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped p... | 10/06/2009 |
| 7576552 | Surface mount package fault detection apparatus A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount packag... | 08/18/2009 |
| 7576551 | Test socket and test board for wafer level semiconductor testing A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured fo... | 08/18/2009 |
| 7573279 | Jig for Kelvin test A jig for Kelvin Test includes a first probe and a second probe which are arranged in parallel in a socket comprised of insulating material. Probes include a conductive tube and a conductive plunger, contained in at least one end side of the tube, and having a dista... | 08/11/2009 |
| 7550985 | Methods of testing memory devices A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a dista... | 06/23/2009 |
| 7548079 | Semiconductor device including analog voltage output driver LSI chip having test circuit An LSI chip includes a plurality of output terminals and a test circuit. The test circuit includes a single test signal input terminal, a single test signal output terminal, a shift register, and a plurality of switches. The shift register includes an input terminal... | 06/16/2009 |
| 7548078 | Performance board for electronically connecting a device under test with a test apparatus for testing a device under test There is provided a test apparatus having a test head containing test modules for sending/receiving signals to/from a device-under-test, a device mounting section having a socket for mounting the device-under-test and a performance board placed on the test head to c... | 06/16/2009 |
| 7541822 | Wafer burn-in and text employing detachable cartridge A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plat... | 06/02/2009 |
| 7511520 | Universal wafer carrier for wafer level die burn-in A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the ... | 03/31/2009 |
| 7477062 | LSI test socket for BGA There is provided an LSI socket containing a pogo-pin type decoupling capacitor for reducing the potential fluctuation of power supplies and GNDs at the time of testing LSI incorporated in a BGA package. The LSI socket comprises a printed board 102 containing... | 01/13/2009 |
| 7477063 | Universal insert tool for fixing a BGA package under test A universal insert for carrying a BGA package under test primarily comprises a meshed base, at least a latch, and a plurality of lift pins. The meshed base has a component cavity, a mounting surface and a plurality of aligning ball holes in the component cavity wher... | 01/13/2009 |
| 7471096 | Contactor for electronic parts and a contact method A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second... | 12/30/2008 |
| 7456644 | Functional and stress testing of LGA devices Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card... | 11/25/2008 |
| 7443183 | Motherboard test machine A test machine for testing a printed circuit board (PCB) (50) includes a base box (10), a top test device (70), a raising board (41), and a control system. The top test device is pivotably secured to the base box, for testing the PCB. The... | 10/28/2008 |
| 7429497 | Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, inc... | 09/30/2008 |
| 7430123 | Rack for computer system modules A rack for mounting modules of a computer system to be tested includes a chassis including a bracing frame for mounting test components of the computer system, and a top panel attached to the chassis, the top panel includes a braces member, receiving a module for te... | 09/30/2008 |
| 7427768 | Apparatus, unit and method for testing image sensor packages The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packag... | 09/23/2008 |
