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| Number | Title | Issue Date |
| 8161644 | Leveling method for burying evaporating section of heat pipe into thermally conductive seat A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface ... | 04/24/2012 |
| 8136245 | Method for combining heat pipes with a fixing base In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is prov... | 03/20/2012 |
| 8033017 | Method for manufacturing evaporator for loop heat pipe system Provided is a method of manufacturing an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to a method of manufacturing an evaporator for a loop heat pipe system which provides a... | 10/11/2011 |
| 7954237 | Method for manufacturing heat pipe and capillary structure thereon A method for manufacturing a heat pipe and a capillary structure thereon is provided, and the steps of the method are as follows. A hollow pipe which has an open end and a closed end is provided. A mold is placed into the hollow pipe through the open end. The mold i... | 06/07/2011 |
| 7895747 | Method for manufacturing a heat pipe with a planished end surface The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted i... | 03/01/2011 |
| 7866043 | Method of flatting evaporating section of heat pipe embedded in heat dissipation device A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining a... | 01/11/2011 |
| 7849598 | Method for manufacturing an isothermal plate A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the se... | 12/14/2010 |
| 7849597 | Method for making heat-dissipation device having vacuum chamber and working fluid therein A method (100) and an apparatus for manufacturing a heat-dissipation device (10) with a vacuum chamber and a working fluid therein are disclosed. The method includes the following steps: vacuuming a hollow metal casing (12) through a first open ... | 12/14/2010 |
| 7814655 | Heat sink in the form of a heat pipe and process for manufacturing such a heat sink A heat sink designed as a heat pipe has an interior space in a body of the heat sink that is closed toward the outside. The interior space has at least one vapor channel and at least one fluid space connected with the vapor space and having a porous or capillary str... | 10/19/2010 |
| 7802362 | Method of making heat pipe having composite capillary wick A method of making a heat pipe includes the steps of: providing a mandrel, a capillary wick and a straight tubular shell; inserting the mandrel and the capillary wick into the shell; cramming powder into the shell, wherein the powder can be sintered between the shel... | 09/28/2010 |
| 7743502 | Chemically compatible, lightweight heat pipe The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal and a method for making such apparatus. The magnesium alloy vessel has a hol... | 06/29/2010 |
| 7730617 | Method for connecting heat-dissipating body and heat pipe and structure thereof A method for connecting a heat-dissipating body and a heat pipe and the structure thereof are used to improve the efficiency of heat conduction. The structure includes a heat-dissipating body and a heat pipe. The central position of the heat-dissipating body is prov... | 06/08/2010 |
| 7631426 | Method of manufacturing a heat pipe A powder feeding apparatus of manufacturing a heat pipe includes a vibration tray having a supporting board and a plurality of pipes positioned in the supporting board of the tray. A mandrel is coaxially inserted in each of the pipes. A feeder is located correspondi... | 12/15/2009 |
| 7603775 | Heat spreader with vapor chamber and method of manufacturing the same A heat spreader (100) includes a metal casing (60) formed by electrodeposition and defining a vapor chamber (40) therein, and a mesh (12b) lining an inner surface of the metal casing. A method for manufacturing the heat spreader in... | 10/20/2009 |
| 7559143 | Method for manufacturing a heat pipe A powder feeding apparatus and a method of manufacturing a heat pipe are disclosed. The method includes: a) proving the powder feeding apparatus including a vibrating tray and a pump (800); b) positioning a tube in the vibrating tray; c) inserting a mandrel (... | 07/14/2009 |
| 7543380 | Heat pipe and method for sealing the heat pipe A heat pipe includes a body with working fluid contained therein and a sealing structure forming on an end of the body. The sealing structure includes a single layer sealing portion formed at a distal end thereof. The sealing structure further comprises a two layer ... | 06/09/2009 |
| 7536784 | Sintering apparatus for heat pipe and method for manufacturing the same A sintering method for a wick structure of a heat pipe includes the steps of inserting a shaft inside the pipe body such that a tapered head is assembled to the shrunk end to achieve a second positioning point, wherein another end of the shaft extending to the filli... | 05/26/2009 |
| 7493693 | Method for fabricating multi-layer wick structure of heat pipe A method for fabricating a multi-layer wick structure of a heat pipe includes providing a first and a second weaving meshes, overlaying and winding the first and the second weaving meshes to form an open circular structure with the first weaving mesh encircling the ... | 02/24/2009 |
| 7472479 | Heat pipe and method of producing the same A heat pipe (50) and a method (100) of producing the heat pipe are disclosed. The method includes the following steps: (1) inserting a mandrel (10) into a hollow metal casing (20) with a porous structure (30) combined to an outer s... | 01/06/2009 |
| 7467466 | Method for sealing a heat pipe A method for sealing a heat pipe, includes the steps of: providing a metallic pipe with an end sealed and an opposite open portion; pressing the open portion of the pipe to form a two layer portion by using two pairs of pressing molds; welding an end part of the two... | 12/23/2008 |
| 7467465 | Flexible production process for fabricating heat pipes A flexible production process for fabricating a heat pipe, having the processes of (a) performing pre-process on a heat-pipe material, (b) performing annealing process on the heat-pipe material, (c) introducing working fluid into the heat-pipe material, (d) removing... | 12/23/2008 |
| 7464463 | Method for making a heat dissipating device A method for making a heat dissipating device includes the steps of: mounting an elastically deformable member on a container body in such a manner that the elastically deformable member covers a periphery of an opening in the container body and that the elastically... | 12/16/2008 |
| 7461450 | Method for making a heat dissipating device A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner... | 12/09/2008 |
| 7454835 | Method of manufacturing heat transfer device A method for manufacturing a heat transfer device is described. The method includes: mortising a porous core into a first hollow tube; mortising a second hollow tube on the first hollow tube; covering a heat conductor on the first hollow tube; and connecting a conne... | 11/25/2008 |
| 7430803 | Gas removing apparatus for removing non-condensate gas from a heat pipe and method for the same A method and gas removing apparatus removes non-condensate gas from a heat pipe. The gas removing apparatus includes at least one heating unit, a sealing unit and a height-adjusting unit. The heating unit heats the heat pipe and includes a clip to clamp the heat pip... | 10/07/2008 |
| 7430804 | Apparatus and method for manufacturing heat pipe A method of manufacturing a heat pipe, including the steps of: providing a hollow body with an open end and an opposite close end; filling a predetermined quantity of working fluid into the hollow body through the open end thereof after an interior of the hollow bod... | 10/07/2008 |
| 7404255 | Apparatus and method for removing non-condensing gas in heat pipe An apparatus and a method for removing non-condensing gas in heat pipe are disclosed, In this method, a resilient pad is abutted against an opening of a pipe body of the heat pipe after a working fluid is filled into the heat pipe. The heat pipe is then heated to re... | 07/29/2008 |
| 7382047 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fi... | 06/03/2008 |
| 7367383 | Multi-layer wick structure of heat pipe A multi-layer wick structure of the heat pipe, comprising a hollow heat pipe body and a weave mesh of the wick structure provided on the internal surface of the heat pipe body, wherein the weave mesh of the wick structure is subjected to at least one folding such th... | 05/06/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7356912 | Method for ventilating a seat The present invention is directed towards a method of forming a ventilated seat. More specifically, in one aspect, the present invention is directed towards providing an insert in fluid communications with an air mover and a seating surface, wherein the system optio... | 04/15/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7322102 | Isothermal plate assembly with predetermined shape and method for manufacturing the same An isothermal plate assembly with predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein. A flattened heat pipe is bent into the pre... | 01/29/2008 |
| 7322400 | Cooling apparatus having low profile extrusion A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process. ... | 01/29/2008 |
| 7322402 | Heat pipe structure and method for fabricating the same A method for fabricating a heat pipe structure which includes a tubular member, and a woven wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of th... | 01/29/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7316265 | Method for passive phase change thermal management In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity. ... | 01/08/2008 |
| 7305850 | Distillation process using microchannel technology The disclosed invention relates to a process for distilling a fluid mixture in a microchannel distillation unit, the microchannel distillation unit comprising a plurality of microchannel distillation sections, the fluid mixture comprising a more volatile component a... | 12/11/2007 |
| 7294734 | Process for converting a hydrocarbon to an oxygenate or a nitrile This invention relates to a process for converting a hydrocarbon reactant to a product comprising an oxygenate or a nitrile, the process comprising: (A) flowing a reactant composition comprising the hydrocarbon reactant, and oxygen or a source of oxygen, and optiona... | 11/13/2007 |
| 7275409 | Method for manufacturing a heat pipe having an enlarged portion A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowi... | 10/02/2007 |
