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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7954235 | Method of making a seal about a copper-based terminal A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; applying a conformal coating ... | 06/07/2011 |
| 7913383 | Manufacture of waterproof wire connectors A method of manufacturing gel containing wire connectors with a silicone gel that remains in an unseparated state wherein the temperature of the gel precursors are elevated before being mixed and dispensed into the cavity of a wire connector where the mixed gel prec... | 03/29/2011 |
| 7752753 | Method for manufacturing water-proof electronic device A method being applied to manufacture a water-proof electronic device (200, 200a) is disclosed in the present invention. In the method, at least one inner component is assembled into at least one water-proof shell to form at least one sub-assembly, whi... | 07/13/2010 |
| 7712213 | Angular encapsulation of tandem stacked printed circuit boards A method is provided for making an encapsulated stack of circuit boards. The method includes assembling the stack of circuit boards from a plurality of circuit boards, the circuit boards being spaced apart from each other; inserting the stack into an internal volume... | 05/11/2010 |
| 7617600 | Process of making an electronic circuit device having flexibility and a reduced footprint An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and form... | 11/17/2009 |
| 7552532 | Method for hermetically encapsulating a component A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to... | 06/30/2009 |
| 7392581 | Method for manufacturing a magnetic element A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) ... | 07/01/2008 |
| 7387740 | Method of manufacturing metal cover with blind holes therein An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; ste... | 06/17/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7333844 | Uterine tissue monitoring device and method The invention provides a devices, methods and systems to measure and record uterine tissue environment components such as pH during the course of uterine artery occlusion. The uterus becomes ischemic due to the occlusion thereof, and its pH drops sharply within minu... | 02/19/2008 |
| 7332376 | Method of encapsulating packaged microelectronic devices with a barrier Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attache... | 02/19/2008 |
| 7310872 | Computer enclosure A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at leas... | 12/25/2007 |
| 7310873 | Method of manufacturing an implantable lead An implantable lead body for a medical device with improved conductor lumens separates and insulates conductors while permitting access to the conductors through the implantable lead outer surface. The implantable lead comprises a lead body, a stylet lumen, at least... | 12/25/2007 |
| 7299548 | Method of waterproof of electric cable joint Sealing material is injected into a cap receiving an electric cable joint without remaining air bubbles. The cap has an opening at both ends and receives the joint, the electric cable being in the upper side and the joint being in the lower side. The sealing materia... | 11/27/2007 |
| 7296345 | Method for manufacturing a memory device A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then... | 11/20/2007 |
| 7296350 | Method for fabricating a drop generator A method for fabricating a drop generator with a uniquely formed nonconductive mandrel, which when encapsulated with electroplated metal, shapes and defines the internal ink channel entails identifying a non-conductive dimensionally stable structure with a shape ada... | 11/20/2007 |
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is al... | 11/13/2007 |
| 7281305 | Method of attaching a capacitor to a feedthrough assembly of a medical device A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the term... | 10/16/2007 |
| 7276396 | Die handling system A system may include singulation of a semiconductor wafer to separate a plurality of integrated circuit die that are integrated into the semiconductor wafer; coupling of a support to an integrated circuit substrate of one of the plurality of integrated circuit die, ... | 10/02/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7268430 | Semiconductor device and process for manufacturing the same The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pr... | 09/11/2007 |
| 7263768 | Method of making a semiconductor device having an opening in a solder mask The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carr... | 09/04/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7246421 | Method for manufacturing surface acoustic wave device A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of co... | 07/24/2007 |
| 7231712 | Method of manufacturing a module A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and t... | 06/19/2007 |
| 7230829 | Overmolded electronic assembly with insert molded heat sinks An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material. The substrate includes a plurality of conductive traces formed on a ... | 06/12/2007 |
| 7225534 | Telecommunications cable jacket adapted for post-extrusion insertion of optical fiber and methods for manufacturing the same The present disclosure relates to a telecommunications cable having a jacket including a feature for allowing post-extrusion insertion of an optical fiber or other signal-transmitting member. The present disclosure also relates to a method for making a telecommunica... | 06/05/2007 |
| 7217996 | Ball grid array socket having improved housing A ball grid array (BGA) socket includes an insulative housing (11), a number of terminals (12) and a protecting device (114). The insulative housing includes a mating surface (111), a mounting surface (112) opposite to mating surfa... | 05/15/2007 |
| 7215131 | Segmented contactor A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled ... | 05/08/2007 |
| 7193161 | SiP module with a single sided lid A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid the... | 03/20/2007 |
| 7178235 | Method of manufacturing an optoelectronic package A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enab... | 02/20/2007 |
| 7174627 | Method of fabricating known good dies from packaged integrated circuits A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the integrated circuit package is removed or ground away to expose the bonding loc... | 02/13/2007 |
| 7171748 | Method of manufacturing a liquid jet recording head Disclosed is a manufacturing method of a liquid jet recording head which includes a forming step of forming a recess portion between a flexible film wiring board and a recording element board, a providing step of providing in the recess portion an electrical connect... | 02/06/2007 |
| 7168161 | Manufacturing method of solid-state image sensing device In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor ch... | 01/30/2007 |
| 7146720 | Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial A method for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate using the combi... | 12/12/2006 |
| 7148564 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadfr... | 12/12/2006 |
| 7134903 | Insulation displacement connection A connector for engaging an electrical conductor that includes a wire surrounded by insulation includes a housing formed with a first slot engageable with the wire and including first and second laterally-spaced surfaces having between them a first width that is les... | 11/14/2006 |
