Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7219419 | Component mounting apparatus including a polishing device Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (... | 05/22/2007 |
| 7214873 | Electrical transmission line and a substrate An electrical transmission line has an electrical wire, a guard pattern disposed parallel to the electrical wire, and a plurality of insulation studs fastened to the guard pattern for separating the electrical wire and the guard pattern. The guard pattern has a non-... | 05/08/2007 |
| 7215115 | Module to control a rotating output shaft and module to change a driving condition of vehicle A sensor and a control circuit are provided externally of a gear cover. This enhances reliability of a shift controller operated by an electric actuator and a motor driven control module similar thereto, and constitute them compact. Further, this provides a rotating... | 05/08/2007 |
| 7212013 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing... | 05/01/2007 |
| 7208935 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing... | 04/24/2007 |
| 7191516 | Method for shielding integrated circuit devices A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greate... | 03/20/2007 |
| 7186049 | Pin to thin plate joint and method for making the joint A pin to plate joint and method of making the joint comprising a plate comprising an entry side and an exit side with the plate defining cutouts, and the pin movable through the plate from the entry side to the exit side and in doing so pushes tab members at angles ... | 03/06/2007 |
| 7168964 | High density connector and method of manufacture Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact exte... | 01/30/2007 |
| 7168160 | Method for mounting and heating a plurality of microelectronic components A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electr... | 01/30/2007 |
| 7066376 | Methods for manufacturing a tactile sensor using an electrically conductive elastomer The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a go... | 06/27/2006 |
| 7065858 | Method for welding components of a disk drive head suspension A method of affixing head suspension components to one another using an edge weld formed at the edge of one head suspension assembly component positioned in an overlapping fashion relative to another head suspension assembly component, and an apparatus assembled by ... | 06/27/2006 |
| 7050285 | Surge protector assembly with ground-connector status indicator circuitry There is provided a surge protector assembly for use with a 66-M type terminal connector block having a plurality of parallel rows of opposed terminals which are laterally spaced apart from each other. The surge protector assembly includes a housing module formed of... | 05/23/2006 |
| 7044776 | Wire connector An open-face electrical wire connector for forming an electrical connection to a wire connector lug wherein the wire connector lug, which is free of any sealant, is located in a portion of a housing that can be brought into engagement with another portion of a housi... | 05/16/2006 |
| 7029529 | Method and apparatus for metallization of large area substrates A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stampi... | 04/18/2006 |
| 7025640 | Circuit board inter-connection system and method An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The ter... | 04/11/2006 |
| 7013557 | Method of packaging electronic components without creating unnecessary solder balls A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited. Solder paste is printed on the lands using the mask which has a conve... | 03/21/2006 |
| 6993835 | Method for electrical interconnection of angularly disposed conductive patterns A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used to apply a conductive metal ball at the junction of angularly disposed... | 02/07/2006 |
| 6988312 | Method for producing multilayer circuit board for semiconductor device The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for ... | 01/24/2006 |
| 6981316 | Method of manufacturing vehicle electric power distribution system A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a po... | 01/03/2006 |
| 6976855 | Solder reserve transfer device and process A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit ... | 12/20/2005 |
| 6971889 | Electrical connector with continuous strip contacts An electrical connector contact strip including spaced electrical contacts, a body and fusible elements. The spaced electrical contacts each have a main section and a tab section extending from an end of the main section. The body includes dielectric material molded... | 12/06/2005 |
| 6939173 | Low cross talk and impedance controlled electrical connector with solder masses An electrical connector, comprising: a dielectric base; a plurality of ground or power contacts in the dielectric base; a plurality of signal contacts in the dielectric base and angled relative to the ground or power contacts; and a plurality of solder balls secured... | 09/06/2005 |
| 6921965 | Die surface magnetic field shield A semiconductor topography is provided which includes a magnetic field shield layer formed upon a semiconductor device. In particular, the semiconductor topography may include a ferromagnetic layer adapted to shield underlying layers from external magnetic fields. S... | 07/26/2005 |
| 6919506 | Device for fastening an electrical component on a mounting board A device for fastening an electrical component to a mounting board includes a sleeve that at least partially surrounds the electrical component, and a tensioning device that is separate from the sleeve and that holds the electrical component in the sleeve. The tensi... | 07/19/2005 |
| 6910265 | Air suction component placement nozzle A pick and place system comprises a pick and place nozzle. The nozzle includes a groove comprising tapered sides that feed into a depression at the bottom of the groove, and a plurality of air holes configured to allow air suction to attract a component and hold it ... | 06/28/2005 |
| 6884708 | Method of partially plating substrate for electronic devices The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and adhered or bonded to, via holes 22 of a TAB tape ... | 04/26/2005 |
| 6871395 | Methods for manufacturing a tactile sensor using an electrically conductive elastomer The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a go... | 03/29/2005 |
| 6851184 | Method for manufacturing a printed circuit board A printed circuit board (PCB) and method of forming same is performed without incoming lines for plating. The plating is preferably performed on ball pad areas and/or bonding pad areas being the top layer of a multi-layer PCB. A metal layer that later forms circuit ... | 02/08/2005 |
| 6845556 | Techniques for reworking circuit boards with ni/au finish Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and t... | 01/25/2005 |
| 6751857 | Conductive contamination reliability solution for assembling substrates A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads ... | 06/22/2004 |
| 6722030 | Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chi... | 04/20/2004 |
| 6705006 | Method for replacing an electrical net on a printed circuit board Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electricall... | 03/16/2004 |
| 6684494 | Parts replacing method and parts replacing apparatus An electronic parts replacing apparatus comprises: a holder for holding a piece of electronic parts to be replaced; a head detachably provided to the holder; and a guide bar for guiding the head to move close to or away from a circuit board. After holding... | 02/03/2004 |
| 6655018 | Technique for surface mounting electrical components to a circuit board A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion and a tip portion extending away from the mounting portion. ... | 12/02/2003 |
| 6634092 | Apparatus for replacing parts connected to circuit board A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and rem... | 10/21/2003 |
| 6594891 | Process for forming multi-layer electronic structures A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material... | 07/22/2003 |
| 6568054 | Method of producing a multilayer electronic part A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Term... | 05/27/2003 |
| 6515233 | Method of producing flex circuit with selectively plated gold Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semi... | 02/04/2003 |
| 6438827 | Ceramic electronic part and method for producing the same A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent t... | 08/27/2002 |
| 6410861 | Low profile interconnect structure Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mou... | 06/25/2002 |
