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| Number | Title | Issue Date |
| RE40283 | Mounting apparatus for electronic component An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a boa... | 05/06/2008 |
| 7284321 | Method for testing a chip with a package and for mounting the package on a board A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted ... | 10/23/2007 |
| 7254890 | Method of making a microfluid ejection head structure A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel mate... | 08/14/2007 |
| 7251872 | Method for forming a chip package A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necess... | 08/07/2007 |
| 7249981 | Press-fit pin A press-fit pin is press-fitted into a conductive through-hole disposed on a substrate such as a printed circuit board. The press-fit pin includes a contact portion, a shoulder portion, a press-fit portion, and a tip portion. The contact portion along with the shoul... | 07/31/2007 |
| 7134591 | Method of and apparatus for testing a wire bond connection A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection t... | 11/14/2006 |
| 7124838 | Gripping assembly for impact hammer A gripping assembly mounted on an impact hammer having a longitudinally extending impact axis, the gripping assembly including a pair of opposed elongate gripping arms, having gripping end portions which may be extended and swung toward each other to grip material i... | 10/24/2006 |
| 7093357 | Method for manufacturing an electronic component A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on eac... | 08/22/2006 |
| 7093622 | Apparatus for deforming resilient contact structures on semiconductor components A method for testing and burning-in semiconductor components such as semiconductor dice on a semiconductor wafer, is provided. The method includes the step of providing all of the components on the wafer with resilient contact structures, such as metal pins having i... | 08/22/2006 |
| 7059047 | Sockets for “springed” semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnecti... | 06/13/2006 |
| 7056414 | Connecting method for metal material and electric conductive plastic material and product thereby A method for connecting a metal material with an electric conductive resin material including the steps of heating the connecting portion of the electric conductive resin material with the metal material to a temperature equal to or more than a softening point of th... | 06/06/2006 |
| 7051432 | Method for providing an electrical connection A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wi... | 05/30/2006 |
| 7047623 | Device for installing a linear motor line A device is provided for installing at least one linear motor line in the grooves (14) of an inductor (15) which is situated underneath a cover plate (10). The device includes a vehicle (31) which can be moved on the cover plate (10 | 05/23/2006 |
| 7043831 | Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer; etching the metal layer to form patterns of leads; etching recesses in... | 05/16/2006 |
| 7032292 | Method of manufacturing high Q on-chip inductor A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the auxiliary winding has an admittance that is greater than the admittance... | 04/25/2006 |
| 6997748 | Shielded shell for electronic connector The present invention provides a shielded shell for an electronic connector. The shielded shell comprises an exterior shielded body and an interior shielded body which is received in the exterior shielded body and receives an insulating body with terminals. There is... | 02/14/2006 |
| 6966109 | Method for attaching and for ensuring orientation of components A method attaches a center conductor to one or both of a load end conductor and a line end conductor. The center conductor has two cylindrical projections. The load end conductor and the line end conductor both have a non-circular opening, such as a square opening. ... | 11/22/2005 |
| 6964095 | Method for producing a crimp ear A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately semicylindrical depressions on opposite sides of the centerline of the ear, ... | 11/15/2005 |
| 6935002 | Method of manufacturing a nonreciprocal circuit device A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate wit... | 08/30/2005 |
| 6910267 | Apparatus for telecommunications equipment An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the telecommunications device in which at least one of the electronic mod... | 06/28/2005 |
| 6864572 | Base for heat sink A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. Th... | 03/08/2005 |
| 6797541 | Leadless semiconductor product packaging apparatus having a window lid and method for packaging A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for vie... | 09/28/2004 |
| 6762117 | Method of fabricating metal redistribution layer having solderable pads and wire bondable pads A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond ... | 07/13/2004 |
| 6751849 | Method for connecting a contact body and a flexible conductor, and a compression mold for carrying out said method A movable contact arrangement suitable for use in a switching device has a rigid contact body and a flexible conductor piece connecting the contact body to a fixed conductor. The contact body is connected to the conductor piece by mechanically compressing a section ... | 06/22/2004 |
| 6729026 | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp m... | 05/04/2004 |
| 6725537 | Method of connecting circuit element A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and insertin... | 04/27/2004 |
| 6658728 | Method for fabricating a spring structure on a substrate Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-a... | 12/09/2003 |
| 6655018 | Technique for surface mounting electrical components to a circuit board A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion and a tip portion extending away from the mounting portion. ... | 12/02/2003 |
| 6647620 | Method of making center bond flip chip semiconductor carrier A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is... | 11/18/2003 |
| 6625885 | Method of making an electrical contact device The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to prede... | 09/30/2003 |
| 6581274 | Apparatus for configuring and inserting component leads into printed-circuit boards Apparatus having a mandrel, and a ring having an aperture therein, the ring being slidable over the mandrel. A multilead electronic component having electric leads extending therefrom is positioned atop the mandrel. The ring is pressed over the mandrel, b... | 06/24/2003 |
| 6477766 | Axial-type electronic component inserting apparatus An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger ... | 11/12/2002 |
| 6412166 | Mounting apparatus for electronic component An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to hol... | 07/02/2002 |
| 6407333 | Wafer level packaging An integrated circuit package (50) may include an integrated circuit chip (22) having an integrated circuit (14). A lead frame (28) may be opposite the integrated circuit chip (22). The lead frame (28) may include at least one lead (30) electrically coupl... | 06/18/2002 |
| 6367149 | Method of assembling an IC socket for interconnecting articles with different terminal pitches An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of contact pins disposed on the socket body in substantially eq... | 04/09/2002 |
| 6206273 | Structures and processes to create a desired probetip contact geometry on a wafer test probe The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electric... | 03/27/2001 |
| 6205655 | Axial-type electronic component inserting method In a method of inserting, into a board, axial-type electronic components, wherein each of the electronic components has a pair of lead wires extending from a main body and belongs to an assembly of electronic components connected by a tape as arranged at ... | 03/27/2001 |
| 6161056 | Placement method and apparatus An area division unit divides a part placement area into a plurality of divided areas based on an area granularity. A part gravity value operation unit and a parts replacement unit extract a set of parts at each end of a connection line for each placement... | 12/12/2000 |
| 6115908 | Mounting apparatus for electronic component An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to hol... | 09/12/2000 |
| 6052895 | Conforming press-fit contact pin for printed circuit board A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a subst... | 04/25/2000 |
