Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 8127435 | Electronic component mounting apparatus The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting s... | 03/06/2012 |
| 8112875 | Vacuum suction nozzle for component mounting apparatus A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceram... | 02/14/2012 |
| 8091216 | Electronic parts mounting apparatus and electronic parts mounting method An electric parts mounting apparatus includes rotary type multi-nozzle mounting heads. Each of the mounting heads has a plurality of suction nozzles disposed in a radial manner on a rotor mechanism, which rotates around a rotation shaft. A parts mount mechanism is c... | 01/10/2012 |
| 8020283 | High-speed RFID circuit placement device A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a... | 09/20/2011 |
| 7971346 | Applicator for electrical or electronic components Stock having printed circuits thereon is conveyed in a transport plane by a conveying device, and electronic components carried by a transfer belt are transferred to the stock under pressure exerted by the belt. The electronic components are transferred to the belt ... | 07/05/2011 |
| 7950140 | Connection device for electric components A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4 | 05/31/2011 |
| 7886427 | Component mounting head A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, d... | 02/15/2011 |
| 7849588 | Electronic component mounting apparatus with setting device setting measurement positions for printed board An electronic component mounting apparatus includes a component feeding device that supplies an electronic component to a pickup position, a suction nozzle that picks up the electronic component supplied to the pickup position and mounts the picked up electronic com... | 12/14/2010 |
| 7841073 | Electronic component mounting apparatus The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting s... | 11/30/2010 |
| 7805832 | Transfer apparatus for transferring a component of integrated circuitry The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a ... | 10/05/2010 |
| 7793408 | Apparatus for transferring semiconductor chip The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of th... | 09/14/2010 |
| 7752742 | Infrared camera packaging Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gas... | 07/13/2010 |
| 7650688 | Bonding tool for mounting semiconductor chips A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank... | 01/26/2010 |
| 7637004 | Electronic device manufacturing method and supporter A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the suppo... | 12/29/2009 |
| 7603766 | Electronic-component holding apparatus and mounting system An electronic-component holding apparatus and an electronic-component mounting system each of which assures that a nozzle head holding a plurality of suction nozzles is easily attached to, and detached from, a head holding member, are provided. A suction surface of ... | 10/20/2009 |
| 7603767 | Workpiece picking and placing method A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure befo... | 10/20/2009 |
| 7581310 | Electronic component mounting apparatus The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the ... | 09/01/2009 |
| 7546678 | Electronic component mounting apparatus This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where th... | 06/16/2009 |
| 7546679 | High speed valve assembly Apparatus and associated systems or methods include a linear machine with an elongate, axially-slidable core member (i.e., shaft). In one embodiment, the shaft includes at least one radial aperture to provide fluid (e.g., air) communication from an interior volume o... | 06/16/2009 |
| 7526860 | Method of manufacturing nozzle plate, liquid ejection head, and image forming apparatus comprising liquid ejection head The method of manufacturing a nozzle plate, comprises the steps of: providing a liquid-repelling film on a first surface of a nozzle plate having a nozzle for ejecting liquid; then performing semi-curing of the liquid-repelling film; then providing a mask having a m... | 05/05/2009 |
| 7437818 | Component mounting method A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from... | 10/21/2008 |
| 7430798 | Electronic component attaching tool An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching... | 10/07/2008 |
| 7426781 | Placement unit for mounting electric components onto substrates A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary drive for the holder mounted within the housing. The holder is connected... | 09/23/2008 |
| 7406759 | Releasing method and releasing apparatus of work having adhesive tape In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the h... | 08/05/2008 |
| 7401401 | Mounting head of electronic component mounting apparatus The invention is directed to reduction of torque by reduction of an outside diameter of a mounting head. A cylindrical cam rotation motor is provided under a nozzle rotation motor. A first rotation axis member as a rotor of the nozzle rotation motor is provided alon... | 07/22/2008 |
| 7392582 | Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresp... | 07/01/2008 |
| 7373718 | Test device for a heat dissipating fan A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vert... | 05/20/2008 |
| 7367252 | Integrated circuit package separators An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond... | 05/06/2008 |
| 7367115 | Component mounting apparatus A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. Th... | 05/06/2008 |
| 7367601 | Substrate transfer apparatus and substrate transfer method The present invention provides a substrate carrying apparatus capable of surely carrying a substrate with electronic parts mounted thereon, at low costs without causing the electronic parts to fall off the substrate, and without damaging the substrate. A substrate c... | 05/06/2008 |
| 7363702 | Working system for circuit substrate A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sen... | 04/29/2008 |
| 7353596 | Component mounting method In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so ... | 04/08/2008 |
| 7354085 | Method of mounting component on circuit formation object A suction nozzle (21) has an outer nozzle member (30), a nozzle body (40), and an urging member (50) for urging the nozzle body (40) in a direction away from the outer nozzle member (30). The suction nozzle (21) also ... | 04/08/2008 |
| 7353589 | Component mounting apparatus A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a hea... | 04/08/2008 |
| 7350289 | Component feeding head apparatus, for holding a component arrayed In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a he... | 04/01/2008 |
| 7340827 | Component mounting apparatus A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles to move to a location to be driven by an actuator that is provided at ... | 03/11/2008 |
| 7340872 | Method of and device for packaging electronic components thus packaged The invention relates to a method of packaging an electronic component such as semiconductor device, where by the component is positioned in a cavity of a foil by tweezers and is supported by means of a further foil which is attached to the foil at one side thereof.... | 03/11/2008 |
| 7331097 | Method of manufacturing a workpiece chuck A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers app... | 02/19/2008 |
| 7330773 | Multiple insertion head The invention relates to a multiple insertion head for mounting components onto substrates, the insertion head including a carrier which is arranged in such a way that it can rotate about a rotational axis and is provided with many receiving tools that are arranged ... | 02/12/2008 |
| 7325298 | Pressure apparatus and chip mounter A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serv... | 02/05/2008 |
