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| Number | Title | Issue Date |
| 8424195 | Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected t... | 04/23/2013 |
| 8402639 | Electronic component mounting system It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multipl... | 03/26/2013 |
| 8375570 | Electronic component mounting system and electronic component mounting method An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and... | 02/19/2013 |
| 8359735 | Head assembly for chip mounter A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recogniti... | 01/29/2013 |
| 8359734 | Alignment jig for electronic component A jig securing alignment and positional accuracy in all directions (x, y, z) for an electrical component to be soldered to a PCB is provided. The jig positions the IC in the x and y directions, and keeps the IC from rotating. The jig also holds the IC down during th... | 01/29/2013 |
| 8336195 | Electronic component mounting apparatus The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU se... | 12/25/2012 |
| 8333010 | Electronic component mounting apparatus In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachme... | 12/18/2012 |
| 8307543 | Semiconductor chip attaching apparatus Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate havi... | 11/13/2012 |
| 8302291 | Component mounting system A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in eac... | 11/06/2012 |
| 8215005 | Chip mounting system A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage ... | 07/10/2012 |
| 8196287 | Electronic component installation apparatus An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance pat... | 06/12/2012 |
| 8176624 | Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optic... | 05/15/2012 |
| 8166637 | Apparatus for mounting a flip chip on a substrate An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) positio... | 05/01/2012 |
| 8156636 | Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging pr... | 04/17/2012 |
| 8132317 | Apparatus for manufacture of electronic assemblies A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conv... | 03/13/2012 |
| 8099860 | Electronic component mounting apparatus The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a reco... | 01/24/2012 |
| 8091215 | Tape feeder and mounting apparatus When a component (X) is fed to a pickup position (53) but no suction action is carried out due to a variety of reasons, a reverse feeding action is carried out to return the component (X), which has been fed to the pickup position (53), to a position u... | 01/10/2012 |
| 8051554 | IC socket with attached electronic component An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic compon... | 11/08/2011 |
| 8051555 | Circuit manufacturing apparatus An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electric... | 11/08/2011 |
| 8015696 | Device for mounting light emitting element A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element. A suction head is inserted between a first camera and a second came... | 09/13/2011 |
| 8015697 | Chip mounter for recognizing BGA package through chip mounter Provided is a chip mounter for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes... | 09/13/2011 |
| 8001678 | Component mounting apparatus A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first c... | 08/23/2011 |
| 7979979 | Clamp assembly for an assembler of integrated circuitry on a carrier The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking di... | 07/19/2011 |
| 7975371 | Apparatus for manufacturing a multilayer chip capacitor The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, ... | 07/12/2011 |
| 7895736 | Method and apparatus for electronic component mounting A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance pro... | 03/01/2011 |
| 7827677 | Component mounting apparatus A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The pl... | 11/09/2010 |
| 7814645 | Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by hold... | 10/19/2010 |
| 7797819 | Component mounting apparatus A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a hea... | 09/21/2010 |
| 7797820 | Component mounting apparatus In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so ... | 09/21/2010 |
| 7735216 | Micro-electromechanical sub-assembly having an on-chip transfer mechanism Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appro... | 06/15/2010 |
| 7726012 | Component-mounting apparatus and component-positioning unit having roller member with sloped positioning surface A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device tha... | 06/01/2010 |
| 7716819 | Device and method for turning over electronic components Device for turning over electronic components, comprising a turntable (1) for driving the electronic components to be turned over in succession between the following stationary locations: a location (A) for loading them onto the turntable; a start of turning ... | 05/18/2010 |
| 7716818 | Method for transferring a substrate A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the s... | 05/18/2010 |
| 7712208 | Electronic component mounting apparatus The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU se... | 05/11/2010 |
| 7676907 | Component placement device as well as a method for transporting substrates through such a component placement device A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder a... | 03/16/2010 |
| 7650687 | Die attaching apparatus Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being... | 01/26/2010 |
| 7621039 | Component mounting apparatus with pivotable transfer mechanism Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component ... | 11/24/2009 |
| 7603765 | Device for inspecting and rotating electronic components The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fi... | 10/20/2009 |
| 7587814 | Printed-board supporting apparatus A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark... | 09/15/2009 |
| 7578054 | Linear driving mechanism for electronic component mounting apparatus In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven ... | 08/25/2009 |
