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| Number | Title | Issue Date |
| 8176624 | Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optic... | 05/15/2012 |
| 8166637 | Apparatus for mounting a flip chip on a substrate An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) positio... | 05/01/2012 |
| 8156636 | Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging pr... | 04/17/2012 |
| 8132317 | Apparatus for manufacture of electronic assemblies A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conv... | 03/13/2012 |
| 8099860 | Electronic component mounting apparatus The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a reco... | 01/24/2012 |
| 8091215 | Tape feeder and mounting apparatus When a component (X) is fed to a pickup position (53) but no suction action is carried out due to a variety of reasons, a reverse feeding action is carried out to return the component (X), which has been fed to the pickup position (53), to a position u... | 01/10/2012 |
| 8051555 | Circuit manufacturing apparatus An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electric... | 11/08/2011 |
| 8051554 | IC socket with attached electronic component An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic compon... | 11/08/2011 |
| 8015696 | Device for mounting light emitting element A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element. A suction head is inserted between a first camera and a second came... | 09/13/2011 |
| 8015697 | Chip mounter for recognizing BGA package through chip mounter Provided is a chip mounter for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes... | 09/13/2011 |
| 8001678 | Component mounting apparatus A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first c... | 08/23/2011 |
| 7979979 | Clamp assembly for an assembler of integrated circuitry on a carrier The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking di... | 07/19/2011 |
| 7975371 | Apparatus for manufacturing a multilayer chip capacitor The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, ... | 07/12/2011 |
| 7895736 | Method and apparatus for electronic component mounting A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance pro... | 03/01/2011 |
| 7827677 | Component mounting apparatus A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The pl... | 11/09/2010 |
| 7814645 | Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by hold... | 10/19/2010 |
| 7797819 | Component mounting apparatus A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a hea... | 09/21/2010 |
| 7797820 | Component mounting apparatus In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so ... | 09/21/2010 |
| 7735216 | Micro-electromechanical sub-assembly having an on-chip transfer mechanism Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appro... | 06/15/2010 |
| 7726012 | Component-mounting apparatus and component-positioning unit having roller member with sloped positioning surface A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device tha... | 06/01/2010 |
| 7716819 | Device and method for turning over electronic components Device for turning over electronic components, comprising a turntable (1) for driving the electronic components to be turned over in succession between the following stationary locations: a location (A) for loading them onto the turntable; a start of turning ... | 05/18/2010 |
| 7716818 | Method for transferring a substrate A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the s... | 05/18/2010 |
| 7712208 | Electronic component mounting apparatus The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU se... | 05/11/2010 |
| 7676907 | Component placement device as well as a method for transporting substrates through such a component placement device A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder a... | 03/16/2010 |
| 7650687 | Die attaching apparatus Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being... | 01/26/2010 |
| 7621039 | Component mounting apparatus with pivotable transfer mechanism Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component ... | 11/24/2009 |
| 7603765 | Device for inspecting and rotating electronic components The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fi... | 10/20/2009 |
| 7587814 | Printed-board supporting apparatus A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark... | 09/15/2009 |
| 7578054 | Linear driving mechanism for electronic component mounting apparatus In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven ... | 08/25/2009 |
| 7568281 | Substrate accommodating tray pallet and substrate transfer system A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the s... | 08/04/2009 |
| 7555831 | Method of validating component feeder exchanges A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the ... | 07/07/2009 |
| 7555832 | Semiconductor chip attachment A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point. ... | 07/07/2009 |
| 7552527 | Non-contact interface for pick-and-place machines In an for controlling a feeder or feeder cart used in a pick-and-place electronics assembly machine, non-physical contact transmitters and receivers transfer data, such as feeder trigger signals, feeder ready signals, and component identification and usage informati... | 06/30/2009 |
| 7516539 | Apparatus for transplanting multi-board An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platf... | 04/14/2009 |
| 7513032 | Method of mounting an electronic part to a substrate A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting unit 12; an electronic part supplying step supplying the... | 04/07/2009 |
| 7500305 | Placement system for populating a substrate with electronic components A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receivi... | 03/10/2009 |
| 7480986 | Apparatus for feeding components from packaged component band An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to the stand beside the platform, and a second guiding unit installable ... | 01/27/2009 |
| 7480985 | CPU pickup device A CPU pickup device for mounting a CPU (50) to a socket (61) includes a main body (10), a suction piece (20) and a positioning mechanism (30). The suction piece is attached to the main body. The suction piece includes a suction cup... | 01/27/2009 |
| 7472472 | Electronic part mounting apparatus In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by ... | 01/06/2009 |
| 7440813 | System and methods for automatic generation of component data A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automaticall... | 10/21/2008 |
