Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 7441321 | Method of manufacturing ultrasound transducer device having acoustic backing An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible e... | 10/28/2008 |
| 7439616 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 10/21/2008 |
| 7434305 | Method of manufacturing a microphone A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper su... | 10/14/2008 |
| 7412764 | Method for manufacturing quartz crystal unit and electronic apparatus having quartz crystal unit In a method for manufacturing a quartz crystal unit, a quartz crystal tuning fork resonator is formed by etching a quartz crystal wafer to form a quartz crystal tuning fork base and first and second quartz crystal tuning fork tines connected to the quartz crystal tu... | 08/19/2008 |
| 7412763 | Method of making an acoustic assembly for a transducer A method of making an acoustic assembly for use in a transducer includes forming a multi-layer assembly. The multi-layer assembly includes a first layer member and a second layer member. Each member includes a center portion, an edge portion and an aperture separati... | 08/19/2008 |
| 7404247 | Method for making a pressure sensor A method for making a pressure sensor including the steps of providing a substrate and forming or locating a pressure sensing component on the substrate. The method further includes the step of, after the forming or locating step, etching a cavity in the substrate b... | 07/29/2008 |
| 7401397 | Method of producing an inertial sensor The present invention discloses an inertial sensor comprising a planar mechanical resonator with embedded sensing and actuation for substantially in-plane vibration and having a central rigid support for the resonator. At least one excitation or torquer electrode is... | 07/22/2008 |
| 7360292 | Method of minimizing inter-element signals for surface transducers The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isol... | 04/22/2008 |
| 7353585 | Method of poling ferroelectric materials A method of producing an actuator includes shaping a block of ferroelectric material to provide an active element of the actuator. The element includes a stack of ferroelectric layers with adjacent layers separated by electrodes arranged parallel to end faces of the... | 04/08/2008 |
| 7350287 | Voice coil insertion jig, speaker producing method using the jig, and speaker produced by using the jig A method of manufacturing a speaker using a voice coil insertion jig including providing a voice coil insertion jig, deforming a plurality of moving pieces from a first position elastically toward a central boss side to a second position, inserting the voice coil in... | 04/01/2008 |
| 7343661 | Method for making condenser microphones A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaph... | 03/18/2008 |
| 7322093 | Method for producing a boundary acoustic wave device In a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium, the method includes the step... | 01/29/2008 |
| 7316059 | Method of manufacturing an ultrasonic probe A method of manufacturing an ultrasonic probe including the steps of forming a plurality of first slits on a layered assembly having a first imner electrode member and a second inner electrode member through a top surface of the layered assembly and forming a plural... | 01/08/2008 |
| 7308750 | Method of manufacturing a magnesium diaphragm In a rolling process, the level of rolling performed by a rolling mill for one operation is set to 1 μm to 20 μm. A magnesium substrate is rolled by rollers while being heated by a thermostatic chamber. As a result, there is manufactured a high-quality magnesium s... | 12/18/2007 |
| 7305750 | Method of assembling a loudspeaker A loudspeaker and method of assembly according to this invention provides for precise alignment between the frame and motor structure before they are connected to one another, and employs a fixture to form the moving assembly of the speaker, i.e. the voice coil, upp... | 12/11/2007 |
| 7302748 | Linkage assembly for an acoustic transducer A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of s... | 12/04/2007 |
| 7281311 | Method of attaching a transfer resistant RFID tag to a surface A transfer resistant RFID tag preferably includes an identification chip, a tag coil, a housing and a cap. The identification chip is electrically connected to the tag coil with two wires. A first quantity of bonding compound is applied to a surface that is slightly... | 10/16/2007 |
| 7278200 | Method of tensioning a diaphragm for an electro-dynamic loudspeaker Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor th... | 10/09/2007 |
| 7275298 | Ultrasonic printed circuit board transducer There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer up... | 10/02/2007 |
| 7253706 | Method for manufacturing surface acoustic wave element, as well as surface acoustic wave element manufactured by the same method A method for manufacturing a surface acoustic wave element including: forming a conductive film on a surface of a piezoelectric substrate; forming a photoresist film on the conductive film; printing a pattern by exposing and developing the pattern, which is original... | 08/07/2007 |
| 7246425 | Method of manufacturing a speaker In manufacturing a speaker, ultrasonic complex vibration welding is applied at least to: a process of fixedly putting together a magnet, a pot yoke a the pole piece; a process of fixing, to a portion of an inner circumference of a frame, an outer periphery of a spid... | 07/24/2007 |
| 7237315 | Method for fabricating a resonator A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so that a bias voltage is applied t... | 07/03/2007 |
| 7213322 | Method for manufacturing surface acoustic wave device A piezoelectric substrate is provided with interdigital transducer electrodes including a first electrode layer, a second electrode layer, and a third electrode layer that is principally made of aluminum. The piezoelectric substrate has a stepped structure on the su... | 05/08/2007 |
| 7210213 | Method for manufacturing a dynamic speaker A speaker collective substrate with component insertion hole sections and electrode sections has a plurality of speaker forming areas. An electrical speaker section, which comprises a magnetic circuit section and a vibration section, is inserted into each of the com... | 05/01/2007 |
| 7204009 | Manufacturing method of acoustic sensor The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a s... | 04/17/2007 |
| 7197798 | Method of fabricating a composite apparatus A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to form a stack of alternating la... | 04/03/2007 |
| 7194793 | Method for producing an edge reflection type surface acoustic wave device A method for adjusting a frequency characteristic of an edge reflection type surface acoustic wave device includes the step of obtaining a frequency characteristic of an edge reflection type surface acoustic wave device having a piezoelectric substrate. The edge ref... | 03/27/2007 |
| 7152299 | Method of assembling a loudspeaker Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor th... | 12/26/2006 |
| 7127793 | Method of producing solid state pickup device A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a ... | 10/31/2006 |
| 7107665 | Method for manufacturing microphone assembly A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone. ... | 09/19/2006 |
| 7110561 | Transparent panel-form loudspeaker A transparent panel-form loudspeaker consists of a transparent sound radiation panel that can radiate sound with desired pressure level over a specific frequency range when subjected to the flexural vibration induced by a preselected number of transducers located at... | 09/19/2006 |
| 7103948 | Method of manufacturing piezoelectric wafers of saw identification tags The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that... | 09/12/2006 |
| 7103960 | Method for providing a backing member for an acoustic transducer array A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are prov... | 09/12/2006 |
| 7093343 | Method of manufacturing an acoustic transducer An acoustic transducer design having a slotted oval-shaped shell and active transducer elements located on the inner surface of the shell is disclosed. The design provides a high power, ultra-low frequency oval projector having a number of applications, including un... | 08/22/2006 |
| 7091818 | Noise suppressor unit for a power source module The invention relates to a noise suppressor unit for installing a common mode choke for a noise suppressor in a power source module onto a circuit board of the power source module, the module being arranged onto a circuit board of a plug-in unit. The noise suppresso... | 08/15/2006 |
| 7080442 | Manufacturing method of acoustic sensor The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a s... | 07/25/2006 |
| 6993812 | Method of manufacturing the piezoelectric transducer Inner individual electrodes are formed at intervals on a piezoelectric ceramic layer so as to correspond in a one-to-one relationship with ink channels, and an inner common electrode are formed on another piezoelectric ceramic layer. The required number of piezoelec... | 02/07/2006 |
| 6988300 | Method of producing a piezoelectric element A piezoelectric element contains a piezoelectric ceramic body having a layered perovskite structure, and has the C axis selected and oriented in the thickness direction. In the piezoelectric ceramic body, line shaped electrodes are formed perpendicular to the C axis... | 01/24/2006 |
| 6931698 | Method for fabricating piezoelectric/electrostrictive device A piezoelectric/electrostrictive device is provided including a functional element. The functional element includes a base portion, a deformable portion assuming the form of a thin plate and extending from the base portion to thereby form a plane, a piezoelectric/el... | 08/23/2005 |
| 6928718 | Method for array processing of surface acoustic wave devices An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Eac... | 08/16/2005 |
