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| Number | Title | Issue Date |
| 8394308 | Mold method An apparatus and method for producing an article by molding is disclosed. In one embodiment, the method includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged be... | 03/12/2013 |
| 8366982 | Differential pressure underfill process and equipment The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages. In at least one embodiment, differential pressure is used to meter the underfill material during the underfill deposi... | 02/05/2013 |
| 8303878 | Method of making a light emitting device having a molded encapsulant Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, ... | 11/06/2012 |
| 8268218 | Release film for semiconductor resin molds A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which includes vacuum suction; injecting a sealing resin between the semicondu... | 09/18/2012 |
| 8262970 | Semiconductor device and method of manufacturing thereof A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device... | 09/11/2012 |
| 8226874 | Method and apparatus for protecting an article during operation A process for making a protective assembly for an article, such as a circuit, includes forming a flexible layer of the protective assembly over the circuit to be protected during circuit operation, wherein said protective assembly is non-adhesive to the circuit and ... | 07/24/2012 |
| 8202460 | Microelectronic substrate having removable edge extension element An article including a microelectronic substrate is provided as an article usable during the processing of the microelectronic substrate. Such article includes a microelectronic substrate having a front surface, a rear surface opposite the front surface and a periph... | 06/19/2012 |
| 8158046 | Mold apparatus and method An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged... | 04/17/2012 |
| 8119050 | Method of manufacturing a semiconductor device Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects from this bottom face in the bottom face of a mold cavity correspond... | 02/21/2012 |
| 8092735 | Method of making a light emitting device having a molded encapsulant Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, ... | 01/10/2012 |
| 8048358 | Pop semiconductor device manufacturing method The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and li... | 11/01/2011 |
| 8043545 | Methods and apparatus to evenly clamp semiconductor substrates Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of ... | 10/25/2011 |
| 8003036 | Mold for forming a molding member and method of fabricating a molding member using the same There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. I... | 08/23/2011 |
| 7883655 | Molding apparatus for manufacturing a semiconductor device and method using the same A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which... | 02/08/2011 |
| 7842219 | Mold for forming a molding member and method of fabricating a molding member using the same There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. I... | 11/30/2010 |
| 7833456 | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a semiconductor workpiece and an encapsulant in a mold cavity and driving some of the encapsulant from the mo... | 11/16/2010 |
| 7815836 | Packaging apparatus for optical-electronic semiconductors A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air... | 10/19/2010 |
| 7622067 | Apparatus and method for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and defines an outer shape and a thickness of a re... | 11/24/2009 |
| 7604765 | Electronic circuit device and manufacturing method of the same A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed... | 10/20/2009 |
| 7595017 | Method for using a pre-formed film in a transfer molding process for an integrated circuit A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape... | 09/29/2009 |
| 7501086 | Encapsulation method for leadless semiconductor packages An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically... | 03/10/2009 |
| 7419629 | Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming A molded article manufactured by a fixed mold used with a forming metal mold for molding synthetic resin includes a base mold, a first forming mold secured to the base mold and having a molding recess, and a second forming mold secured to the base mold as it is comb... | 09/02/2008 |
| 7407608 | Resin molding equipment and resin molding method The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section havin... | 08/05/2008 |
| 7402270 | Method and system for integrated circuit packaging According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfac... | 07/22/2008 |
| 7393489 | Mold die for molding chip array, molding equipment including the same, and method for molding chip array Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block wher... | 07/01/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7378455 | Molding composition and method, and molded article A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent c... | 05/27/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7364778 | Container for an electronic component A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electro... | 04/29/2008 |
| 7358599 | Optical semiconductor device having a lead frame and electronic equipment using same An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ... | 04/15/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7355278 | Mold die for a semiconductor device A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a ... | 04/08/2008 |
| 7303709 | Compression molding process A molded article is produced by a method of compression molding employing a specially shaped billet of thermoplastic material which is positioned at a predetermined location in a predetermined orientation with respect to the mold cavity surfaces of a mold part. In a... | 12/04/2007 |
| 7288440 | Method of manufacturing a semiconductor device For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is brought down, whereby an outer peripheral portion of a cavity of the... | 10/30/2007 |
| 7267791 | Method for the production of light-guiding LED bodies in two chronologically separate stages Disclosed is a method for producing light-guiding LED bodies in a mold, using a material that is flowable before becoming definitively solid. Each LED body comprises at least one light-emitting chip and at least two electrical connections that are connected to the c... | 09/11/2007 |
| 7264456 | Leadframe and method for reducing mold compound adhesion problems An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater... | 09/04/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7255610 | Molded part and electronic device using the same An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and... | 08/14/2007 |
| 7253021 | Transfer molding apparatus and method for manufacturing semiconductor devices A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any... | 08/07/2007 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a ... | 07/31/2007 |
