Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8163220 | Method of packaging integrated circuits The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this rela... | 04/24/2012 |
| 8097199 | Molded plastic container and preform having insert-molded insert A method of making a plastic container having an RFID tag in a wall of the container includes providing a mold having a mold core and mounting an insert on the core. The insert includes an RFID tag surrounded by a plastic housing, which preferably is retained on the... | 01/17/2012 |
| 8034275 | Assembly having a component enclosed by a housing, and device and method used in its manufacture To provide an assembly which is as small as possible which contains a well-protected component and effectively dissipates heat, and to provide a device and a method for use in the rapid manufacture of such an assembly, an assembly includes a component and a housing ... | 10/11/2011 |
| 7875227 | Molded plastic container and preform having insert-molded RFID tag An RFID assembly includes a base having a peripheral wall, an RFID inlay including an RFID tag disposed within the peripheral wall, and a disk having a periphery engaged by the peripheral wall to capture the inlay between the base and the disk within the peripheral ... | 01/25/2011 |
| 7829004 | Transfer molding method and system for electronic devices A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot int... | 11/09/2010 |
| 7754130 | Method for manufacturing physical quantity sensor A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is c... | 07/13/2010 |
| 7645408 | Process for manufacturing the elastomeric sleeve of a joint for electrical cables and manufacturing apparatus thereof A process for manufacturing an elastomeric sleeve of a joint for electrical cables. The sleeve has an electric field-control element, an electrical insulating element surrounding the electric field-control element, and at least a semiconductive element having two st... | 01/12/2010 |
| 7618573 | Resin sealing method for electronic part and mold used for the method An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lo... | 11/17/2009 |
| 7431875 | Process of preparing a unitized membrane electrode assembly using compression molding The invention provides a mold for use in a compression molding apparatus that has a frame part (41) with a hole through its center; a bottom plunger (42); and a top plunger (43); wherein the plungers are fabricated to fit substantially snugly in... | 10/07/2008 |
| 7419628 | Method and moulding tool for manufacturing fibre-reinforced products A method and apparatus for manufacturing fiber-reinforced products with integrated insert parts by moulding a heat-bonding resin having a viscosity of about 1-10_6 and about 30-10+6 mPas, between two joinable halves of a separable mould having an upper and lower mou... | 09/02/2008 |
| 7407608 | Resin molding equipment and resin molding method The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section havin... | 08/05/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7365980 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate. ... | 04/29/2008 |
| 7361838 | Cable with strain relief A cable (100) has a wire conductor (1) with an insulative layer enclosing the wire conductor, and a strain relief (2). The strain relief has an internal strain relief (22) enclosing the insulative layer of the wire conductor, and an exter... | 04/22/2008 |
| 7347963 | Method of molding resin to protect a resolver winding At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7 | 03/25/2008 |
| 7322287 | Apparatus for fluid pressure imprint lithography Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing ... | 01/29/2008 |
| 7320771 | Method of making a ribbed part out of thermoplastic material covered in a conductive foil, and a ribbed part The invention relates to a method of making a part (2) of thermoplastic material covered on the surface by an electrically conductive foil (4) of thickness less than 0.1 mm, the part also including a rib (6), and the method comprising a step of ... | 01/22/2008 |
| 7311548 | Jumper installation feedback A jumper including a connecting face, a light-emitting face, and a light pipe extending from the connecting face to the light-emitting face is provided. The light pipe is operable to transmit a light from a provided computer hardware from the connecting face to the ... | 12/25/2007 |
| 7300615 | High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials An electrical component in the form of an inductor or transformer is disclosed which includes one or more coils and a magnetic polymer material located near the coils or supporting the coils to provide an electromagnetic interaction therewith. The magnetic polymer m... | 11/27/2007 |
| 7270778 | Method for attachment of a plastic probe tip to a metal component A method and apparatus for fixedly securing a plastic encapsulated transducer to a metal interface cup for attachment with a machine includes a metal interface cup configured substantially as a cylinder defined by a cylinder wall and a bottom wall closing a bottom o... | 09/18/2007 |
| 7270551 | Distributor module for use in telecommunications and data systems technology A distribution connection module (1) for telecommunications and data technology includes a housing (3) in which input and output contacts (4, 5) for the connection of cables or wires are arranged such that they are externally accessible. The hou... | 09/18/2007 |
| 7264456 | Leadframe and method for reducing mold compound adhesion problems An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater... | 09/04/2007 |
| 7264758 | Method for producing an electrical connector An electrical connector and a method for producing the same are described. A metallic wire is provided. The metallic is folded into a predetermined shape by upper and lower formation devices. One of the formation devices is replaced by a mold, and an insulative mate... | 09/04/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7253021 | Transfer molding apparatus and method for manufacturing semiconductor devices A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any... | 08/07/2007 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a ... | 07/31/2007 |
| 7241414 | Method and apparatus for molding a semiconductor device A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface... | 07/10/2007 |
| 7217600 | Cyclic olefin polymers and catalyst for semiconductor applications An embodiment is a cyclic olefin semiconductor package. Further an embodiment is a combination of a cyclic olefin monomer and a ruthenium-based catalyst that is stable at approximately room temperature and humidity for extended storage life and pot life, and that ca... | 05/15/2007 |
| 7217335 | Method of manufacturing a soft hearing aid A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, th... | 05/15/2007 |
| 7211215 | Mould, encapsulating device and method of encapsulation The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, where... | 05/01/2007 |
| 7208113 | Sealing material tablet method of manufacturing the tablet and electronic component device To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an... | 04/24/2007 |
| 7205175 | Method for encapsulating a chip and/or other article Method for encapsulating a chip with encapsulant, one portion of the surface of which chip must remain free of encapsulant, comprising the following steps: fixing the chip on a carrier with a suitable conductor structure, placing carrier and chip in one part of a mo... | 04/17/2007 |
| 7201867 | Method of installing circuit member in resin-molded panel A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a cir... | 04/10/2007 |
| 7196904 | IC package with an implanted heat-dissipation fin An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchangi... | 03/27/2007 |
| 7178235 | Method of manufacturing an optoelectronic package A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enab... | 02/20/2007 |
| 7172130 | Electronic device, rubber product, and methods for manufacturing the same The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered wit... | 02/06/2007 |
| 7168161 | Manufacturing method of solid-state image sensing device In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor ch... | 01/30/2007 |
| 7169345 | Method for integrated circuit packaging According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes ... | 01/30/2007 |
| 7166252 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clampin... | 01/23/2007 |
| 7159785 | Core piece and non-contact communication type information carrier using the core piece An inexpensive non-contact communication type information carrier with good handling capability and productivity, characterized in that an IC chip 1 formed integral with the antenna coil 3 is mounted in a recessed portion 6 of a core piece body ... | 01/09/2007 |
