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| Number | Title | Issue Date |
| 7439551 | Nitride-based compound semiconductor light emitting device The nitride-based compound semiconductor light emitting device includes a first ohmic electrode, a bonding metal layer, a second ohmic electrode, a nitride-based compound semiconductor layer, and a transparent electrode stacked in this order on a support substrate, ... | 10/21/2008 |
| 7436000 | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to... | 10/14/2008 |
| 7425729 | LED backlight unit An LED backlight unit includes a light source; a board including a circuit pattern printed on an underside thereof, and having at least one mounting hole perforated therein where the light source is inserted; a metal chassis having an inside surface on which an unde... | 09/16/2008 |
| 7425083 | Light emitting device package A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first el... | 09/16/2008 |
| 7420271 | Heat conductivity and brightness enhancing structure for light-emitting diode A heat conductivity and brightness enhancing structure for light-emitting diode, including a bracket having a cathode leg support. A bowl structure is formed on upper end of the cathode leg support for resting a light-emitting chip therein. At least one depression i... | 09/02/2008 |
| 7411281 | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same Die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. A die-down array IC device package includes a heat spreader having a central cavity. A first substrate surface is coupled to the heat... | 08/12/2008 |
| 7400029 | LED illumination system The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 1... | 07/15/2008 |
| 7390129 | Light source, method for manufacturing light source, and projector A light source that has a small size can provide uniform light at high efficiency and can have a high degree of freedom in design, a method for manufacturing this light source, and a projector having this light source include a solid-state light-emitting chip that s... | 06/24/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7387915 | Method for manufacturing heat sink of semiconductor device A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres ... | 06/17/2008 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7375381 | LED illumination apparatus and card-type LED illumination source An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mo... | 05/20/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7361940 | Leadframe and packaged light emitting diode A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supp... | 04/22/2008 |
| 7361936 | Optical transmission and/or receiving device An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carr... | 04/22/2008 |
| 7352062 | Integrated circuit package design A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package su... | 04/01/2008 |
| 7342257 | Optical transmitter An optical transmitter of the invention comprises a thermoelectric module, a light emitting device, and a light receiving device. The thermoelectric module comprises a first plate, a second plate, and a thermoelectric transducer. The first plate is made of insulatin... | 03/11/2008 |
| 7338840 | Method of forming a semiconductor die with heat and electrical pipes Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a p... | 03/04/2008 |
| 7335984 | Microfluidics chips and methods of using same Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the in... | 02/26/2008 |
| 7335926 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7335522 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7317247 | Semiconductor package having heat spreader and package stack using the same A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semicondu... | 01/08/2008 |
| 7304372 | Semiconductor package A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration. ... | 12/04/2007 |
| 7288796 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 10/30/2007 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7282798 | Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation A method and structure for heat transport, cooling, sensing and power generation is described. A photonic bandgap structure (3) is employed to enhance emissive heat transport from heat sources such as integrated circuits (2) to heat spreaders (4... | 10/16/2007 |
| 7271419 | Laser device having a plurality of emission zones A laser device having a semiconductor body (1), which has a plurality of active layers (5, 9) arranged vertically one above the other and serving for generating laser radiation. The active layers are subdivided in the transverse direction into a plural... | 09/18/2007 |
| 7259446 | Heat sink packaging assembly for electronic components A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base boa... | 08/21/2007 |
| 7259403 | Card-type LED illumination source An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate... | 08/21/2007 |
| 7256491 | Thermal interconnect systems methods of production and uses thereof A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder mate... | 08/14/2007 |
| 7253447 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base ... | 08/07/2007 |
| 7253444 | Silicone-filled casing for use with light-emitting unit and method of manufacturing the light-emitting unit A light-emitting unit containing a substrate and light emitting diodes (LEDs) is housed inside a casing constituted by a first member and a second member which are joined together. The second member has a projecting piece which is inserted to the first member, and i... | 08/07/2007 |
| 7250637 | Card type LED illumination source An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The op... | 07/31/2007 |
| 7242028 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 07/10/2007 |
| 7235876 | Semiconductor device having metallic plate with groove A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a s... | 06/26/2007 |
| 7235875 | Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections... | 06/26/2007 |
| 7224047 | Semiconductor device package with reduced leakage A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at... | 05/29/2007 |
| 7199465 | Wire bonding system and method of use A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A suppor... | 04/03/2007 |
| 7196355 | Integrated thermal sensor for optoelectronic modules An optoelectronic module comprising at least one optical component placed on a support, said component comprising an active optical layer and at least one confinement layer which carries at least one electrical contact, wherein said module further comprises a therma... | 03/27/2007 |
| 7196414 | Semiconductor package with heat sink A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive mate... | 03/27/2007 |
