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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 7442576 | Placement of absorbing material in a semiconductor device A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die. ... | 10/28/2008 |
| 7439553 | Liquid crystal display device In a liquid crystal display device, a recessed portion is formed in a portion of a periphery of a lower frame, a columnar member is provided to the recessed portion, the columnar member is allowed to pass through a hole formed in a projecting portion which is provid... | 10/21/2008 |
| 7435997 | Component comprising a large number of light-emitting-diode chips A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the ... | 10/14/2008 |
| 7425083 | Light emitting device package A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first el... | 09/16/2008 |
| 7419842 | Encapsulation of electroluminescent devices with shaped spacers A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components fr... | 09/02/2008 |
| 7416910 | Pyramid socket suspension An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates formed in crystalline silicon substrates; a first plurality of complem... | 08/26/2008 |
| 7414269 | Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a numbe... | 08/19/2008 |
| 7411225 | Light source apparatus A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well... | 08/12/2008 |
| 7408251 | Semiconductor packaging device comprising a semiconductor chip including a MOSFET A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing member, the semiconductor chip having a source electrode and a gate ... | 08/05/2008 |
| 7394109 | LED lighting device An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative con... | 07/01/2008 |
| 7387913 | 3D optoelectronic micro system A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by conn... | 06/17/2008 |
| 7378294 | Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60 | 05/27/2008 |
| 7371594 | Nitride semiconductor device and method for fabricating the same that minimizes cracking The present invention relates to a nitride semiconductor device and a method for fabricating the same. According to the present invention, there is an advantage in that trenches isolating respective nitride semiconductor unit devices from one another are filled with... | 05/13/2008 |
| 7358109 | Surface emitting laser package having integrated optical element and alignment post A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches ca... | 04/15/2008 |
| 7352011 | Wide emitting lens for LED useful for backlighting Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak... | 04/01/2008 |
| 7348193 | Hermetic seals for micro-electromechanical system devices The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a substrate with one or a plurality of optical, opto-electronic, elect... | 03/25/2008 |
| 7345322 | Light emitting diode An LED including a substrate having a pair of terminal electrodes, at least one LED element mounted on the substrate, a frame disposed on the substrate, holes provided in the substrate, concave portions provided in positions of the frame facing the holes, and a pair... | 03/18/2008 |
| 7339198 | Light-emitting diode chip package body and packaging method thereof AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating dispo... | 03/04/2008 |
| 7335922 | Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced... | 02/26/2008 |
| 7332361 | Xerographic micro-assembler Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a so... | 02/19/2008 |
| 7329904 | LED lamp device An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to yellow-green-based color in response to light received from the light emitti... | 02/12/2008 |
| 7291866 | Semiconductor light emitting device and semiconductor light emitting unit A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner ... | 11/06/2007 |
| 7285434 | Semiconductor package and method for manufacturing the same A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on th... | 10/23/2007 |
| 7282785 | Surface mount type semiconductor device and lead frame structure thereof A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side... | 10/16/2007 |
| 7279723 | LED lamp An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emit... | 10/09/2007 |
| 7276782 | Package structure for semiconductor A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deform... | 10/02/2007 |
| 7259402 | High efficiency group III nitride-silicon carbide light emitting diode A method and resulting structures are disclosed for fabricating a high efficiency high extraction light emitting diode suitable for packaging. The method includes the steps of adding a light emitting active portion of wide-bandgap semiconductor material to a conduct... | 08/21/2007 |
| 7247514 | Semiconductor device and method for producing the same A method for producing a semiconductor device of the present invention includes forming a surface electrode on a semiconductor element, forming a solder layer by plating on one principal surface of the surface electrode, mounting the semiconductor element on the sub... | 07/24/2007 |
| 7244965 | Power surface mount light emitting die package A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conduc... | 07/17/2007 |
| 7227194 | Semiconductor light emitting device A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shape... | 06/05/2007 |
| 7223617 | Semiconductor laser device and a method of mounting a semiconductor laser component on a submount A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semico... | 05/29/2007 |
| 7208772 | High power light emitting diode package The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial ... | 04/24/2007 |
| 7199452 | Semiconductor device and manufacturing method for same A semiconductor device in which semiconductor chip(s) is or are mounted onto substrate(s) incorporating patterned wiring and the entirety or entireties has or have been sealed with resin(s), wherein by forming electrically conductive pattern(s) for shielding at end ... | 04/03/2007 |
| 7192797 | Light emitting device and manufacture method thereof A flip-chip LED including a light emitting structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer is provided. The light emitting structure includes a first conductive layer, an active layer, and a second conduc... | 03/20/2007 |
| 7176503 | Light emitting diode package and light source comprising the same An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to... | 02/13/2007 |
| 7166496 | Method of making a packaged semiconductor device A clip-less packaged semiconductor device includes at least one semiconductor die having bottom and top surfaces each having at least one electrode. A leadframe comprising a sheet of conductive material having top and bottom surfaces, the top surface being substanti... | 01/23/2007 |
| 7161190 | Semiconductor light-emitting device and method of manufacturing the same A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the firs... | 01/09/2007 |
| 7161187 | Light emitting diode and manufacturing method thereof A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat r... | 01/09/2007 |
| 7161186 | Sideway-emission light emitting diode A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the receiv... | 01/09/2007 |
| 7144748 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 12/05/2006 |
