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| Number | Title | Issue Date |
| 7443001 | Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering A method for preparing a microelectromechanical system (MEMS) device for subsequent processing is disclosed. The method includes establishing an anti-stiction material on exposed surfaces of the MEMS device. The exposed surfaces include at least an interior surface ... | 10/28/2008 |
| 7435612 | CMOS-MEMS process A fully CMOS compatible MEMS multi-project wafer process comprises coating a layer of thick photoresist on a wafer surface, patterning the photoresist to define a micromachining region, and performing a micromachining in the micromachining region to form suspended m... | 10/14/2008 |
| 7411260 | Semiconductor device and manufacturing method thereof A method for improving productivity when manufacturing a semiconductor device. A lower electrode, insulating films, an upper electrode and insulating films are formed on a semiconductor substrate in a sensor region. A cavity is formed between the insulator films abo... | 08/12/2008 |
| 7393711 | Method of producing a digital fingerprint sensor and the corresponding sensor An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electri... | 07/01/2008 |
| 7382031 | Component including a fixed element that is in a silicon layer and is mechanically connected to a substrate via an anchoring element and method for its manufacture A method and device are for anchoring fixed structural elements and, e.g., for anchoring electrodes for components, e.g., SOI wafer components, whose component structure is formed in a silicon layer on top of a substrate used as support. The fixed element may be mec... | 06/03/2008 |
| 7352040 | Microelectromechanical systems having trench isolated contacts, and methods for fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packagin... | 04/01/2008 |
| 7327003 | Sensor system Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system ... | 02/05/2008 |
| 7317232 | MEM switching device A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the lever mechanism. In one arrangment, the first surface is disposed towar... | 01/08/2008 |
| 7303955 | Semiconductor memory device with high operating current and method of manufacturing the same In a semiconductor memory device with a high operating current and a method of manufacturing the same, a semiconductor substrate is formed in which a memory cell region and a peripheral circuit region including an N-channel metal oxide semiconductor (NMOS) region an... | 12/04/2007 |
| 7304358 | MOS transistor with a deformable gate A MOS transistor with a deformable gate formed in a semiconductor substrate, including source and drain areas separated by a channel area extending in a first direction from the source to the drain and in a second direction perpendicular to the first one, a conducti... | 12/04/2007 |
| 7288824 | Microelectromechanical systems, and devices having thin film encapsulated mechanical structures There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packagin... | 10/30/2007 |
| 7279761 | Post-release capacitance enhancement in micromachined devices and a method of performing the same A MEMS device which utilizes a capacitive sensor or actuator is enhancement by initially fabricating the capacitive assembly which comprises the sensor or actuator as two sets of interdigitated fingers in a noninterdigitated configuration. One of the two sets of fin... | 10/09/2007 |
| 7242066 | Manufacturing method of a microelectromechanical switch The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor... | 07/10/2007 |
| 7230307 | Vertical offset structure and method for fabricating the same A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the s... | 06/12/2007 |
| 7208809 | Semiconductor device having MEMS In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circu... | 04/24/2007 |
| 7205174 | Micromechanical actuator with multiple-plane comb electrodes and methods of making A micro-electro-mechanical component comprising a movable element with comb electrodes, and two stationary elements with comb electrodes aligned and stacked on each other but electrically insulated by a layer of insulation material. The movable element is supported ... | 04/17/2007 |
| 7192798 | Fingerprint sensor apparatus and manufacturing method thereof A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sen... | 03/20/2007 |
| 7176541 | Pressure sensor A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor ch... | 02/13/2007 |
| 7170141 | Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry A method of forming electronics and microelectromechanical on a silicon carbide substrate having a slow etch rate is performed by forming circuitry on the substrate. A protective layer is formed over the circuitry having a slower etch rate than the etch rate of the ... | 01/30/2007 |
| 7148549 | Data storage module suspension system A micro-electro-mechanical device includes a moveable mass supported within a frame. To support the mass within the frame, a first flexure extends between the mass and the frame. An angle softening element is positioned between a first end of the first flexure and t... | 12/12/2006 |
| 7138694 | Single crystal silicon sensor with additional layer and method of producing the same A SOI-based MEMS device has a base layer, a device layer, and an insulator layer between the base layer and the device layer. The device also has a deposited layer having a portion that is spaced from the device layer. The device layer is between the insulator layer... | 11/21/2006 |
| 7135749 | Pressure sensor A pressure sensor includes a silicon-on-insulator (SOI) substrate, a glass substrate bonded to the SOI substrate by anode bonding, a silicon island formed on a part of a silicon layer of the SOI substrate and surrounded by a groove extending to an insulating layer o... | 11/14/2006 |
| 7081657 | MEMS and method of manufacturing MEMS The present invention relates to micro electro-mechanical systems (MEMS) and production methods thereof, and more particularly to vertically integrated MEMS systems. Manufacturing of MEMS and vertically integrated MEMS is facilitated by forming, preferably on a wafe... | 07/25/2006 |
| 6686634 | Semiconductor device and a method of producing the same In an integrated pressure sensor including a semiconductor substrate having a p type single crystal silicon substrate and an n type epitaxial layer of which a portion is etched by electrochemical etching to have a diaphragm, an impurity diffusion layer pi... | 02/03/2004 |
| 6677176 | Method of manufacturing an integrated electronic microphone having a floating gate electrode The present invention provides an integrated electronic microphone formed as part of a semiconductor device, and a manufacturing method therefor. The microphone is formed with a sensing electrode as part of a sensing membrane, and the sensing electrode is... | 01/13/2004 |
| 6649988 | Semiconductor pressure sensor decreasing creep stress in <110> crystalline axis direction Metal wiring segments, which are located at peripheral positions of a diaphragm, are formed on a main surface of a thick portion of a semiconductor substrate. A ratio S/d is larger than 100, where an area of the diaphragm is S μm2 and a thickn... | 11/18/2003 |
| 6649989 | Micromechanical diaphragm A micromechanical diaphragm is described which has a partially n-doped p-substrate on its surface and a top n-epitaxial layer, one or more n-epitaxial layers which are p-doped in the diaphragm area being arranged on the p-substrate.... | 11/18/2003 |
| 6642594 | Single chip multiple range pressure transducer device A single chip multiple range pressure transducer device including a wafer having a plurality of simultaneously formed thinned regions. The thinned regions are separated by a fixed portion, and each have a same minimum thickness. The thinned regions have a... | 11/04/2003 |
| 6631646 | Electrically insulated strain gage An insulated strain gage including a layer of semiconductive material and a layer of insulating material, where a side of the first insulating layer is disposed adjacent to a side of the semiconductive layer. A method of manufacturing the insulated strain... | 10/14/2003 |
| 6579612 | Magnetostrictive sensor structure A sensor for measuring magnetostriction of and/or magnetic thin film is constructed by depositing a thin film nonferromagnetic electrically insulating layer followed by a thin film layer of a sensor material which is piezoresistive and nonferromagnetic. T... | 06/17/2003 |
| 6551853 | Sensor having membrane structure and method for manufacturing the same In a sensor having a membrane structure, a sensor chip (silicon substrate) is provided with a through hole that is open on both upper and lower surfaces of the silicon substrate. A sensor element having a membrane structure is formed on the upper surface ... | 04/22/2003 |
| 6495388 | Surface micro-machined sensor with pedestal A surface micro-machined sensor uses a pedestal in a cavity to support a flexible structure and reduce the span of the flexible structure. The reduced span per sense area allows larger sensor areas without permitting forces to permanently deform the flexi... | 12/17/2002 |
| 6388299 | Sensor assembly and method A sensor device that provides a relatively uniform electric field between a diaphragm and a substrate, regardless of the displacement of the diaphragm is disclosed. The sensor device provides a uniform spacing between the diaphragm and the substrate over ... | 05/14/2002 |
| 6278167 | Semiconductor sensor with a base element and at least one deformation element The invention relates to a semiconductor sensor having a base element (4) and at least one deformation element (8). The deformation element (8) is composed of a semiconductor substrate that is doped with a dopant of a first conductivity type. Piezoresisto... | 08/21/2001 |
| 6211558 | Surface micro-machined sensor with pedestal A surface micro-machined sensor uses a pedestal in a cavity to support a flexible structure and reduce the span of the flexible structure. The reduced span per sense area allows larger sensor areas without permitting forces to permanently deform the flexi... | 04/03/2001 |
| 6194236 | Electrochemical etching method for silicon substrate having PN junction An etching method for a silicon substrate, which can easily smooth the etching surface of the (110)-oriented silicon, is disclosed. A container is filled with KOH solution. In the KOH solution is immersed a (110)-oriented silicon wafer having a PN junctio... | 02/27/2001 |
| 6184561 | Semiconductor pressure sensor having strain gauges and stress balance film In a semiconductor pressure sensor having a diaphragm portion and strain gauges on the diaphragm portion, Al stress balance films are provided around the diaphragm portion to balance changes in stress of the strain gauges, which are produced by a change i... | 02/06/2001 |
| 6011273 | Thin-film semiconductor device having pressure sensitive and non-sensitive regions The present invention provides a thin-film semiconductor device suitable for an areal-pressure-distribution detector and the like. The thin-film semiconductor device according to the present invention comprises an insulating substrate 1, and element regio... | 01/04/2000 |
| 5949118 | Etching method for silicon substrates and semiconductor sensor An etching method for a silicon substrate, which can easily smooth the etching surface of the (110)-oriented silicon, is disclosed. A container is filled with KOH solution. In the KOH solution is immersed a (110)-oriented silicon wafer having a PN junctio... | 09/07/1999 |
| 5946549 | Method for manufacturing sensor using semiconductor A method for manufacturing sensors using semiconductors that is optimal for obtaining compact sensors is described. The method includes the steps of (a) applying an n-type silicon layer to the upper surface of a silicon substrate, (b) applying a p-type si... | 08/31/1999 |
