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| Number | Title | Issue Date |
| 7335538 | Method for manufacturing bottom substrate of liquid crystal display device A method for manufacturing liquid crystal display substrates comprises the steps of: (a) providing a substrate having a transparent electrode layer and a metal layer; (b) forming a patterned photoresist layer through half-tone or diffraction; (c) defining signal lin... | 02/26/2008 |
| 5757062 | Ceramic substrate for semiconductor device A ceramic substrate for use with a semiconductor device, includes an electrical conductor composed of Ag, a resistor composed of oxide, and a barrier layer located between the electrical conductor and the resistor and composed of a material selected from ... | 05/26/1998 |
| 5754093 | Thick-film printed substrate including an electrically connecting member and method for fabricating the same A thick-film resistor in a thick-film printed substrate, the resistance of which is maintained at an appropriate value, is disclosed. In a thick-film printed substrate formed by printing a thick-film conductor and a resistor of lanthanum boride type on a ... | 05/19/1998 |
| 5709927 | Thick film circuit board A thick film circuit board comprising an insulating substrate; conductor wiring layers of a conductive material containing an oxide and formed on the insulating substrate by printing and firing; a resistance layer of a resistive material having a selected... | 01/20/1998 |
| 5699224 | Thick-film capacitor and chip-type composite electronic component utilizing the same Disclosed are a thick-film capacitor and a chip-type composite electronic component. A pair of end electrodes are formed on the insulator substrate. A lower electrode is formed on the insulator substrate. A dielectric layer is formed on the lower electrod... | 12/16/1997 |
| 5617298 | Collinear terminated transmission line structure A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of c... | 04/01/1997 |
| 5504986 | Method of manufacturing collinear terminated transmission line structure with thick film circuitry A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of c... | 04/09/1996 |
| 5362927 | Thick film hybrid circuit board device A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at c... | 11/08/1994 |
| 5256836 | Thick film hybrid circuit board device and method of manufacturing the same A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at c... | 10/26/1993 |
| 5225969 | Multilayer hybrid circuit A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through a printing process and... | 07/06/1993 |
| 5204166 | Thick film resistor composition, hybrid IC using the composition, and process for producing the hybrid IC The present invention relates to a thick film resistor material which is suitable especially for thick film hybrid IC having conductor, resistor, semiconductor element and the like in which Cu is used as the conductor and furthermore, a thick film resisto... | 04/20/1993 |
| 5047368 | Method of manufacturing a thick-film circuit arrangement The invention relates to a method of forming a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and compone... | 09/10/1991 |
| 5029043 | LC circuit incorporated ceramic substrate There is provided a monolithic structure of an LC circuit incorporated component comprising at least one capacitor formed from internal electrodes in layered form in a ceramic monolithic structure, at least one inductor formed from internal conductive str... | 07/02/1991 |
| 4903110 | Single plate capacitor having an electrode structure of high adhesion A single plate capacitor includes a dielectric substrate having high dielectric constant, a first SiO2 film formed ona lower main surface of the dielectric substrate, a first TiW film formed on the first SiO2 film, a solder diffusion... | 02/20/1990 |
| 4839775 | Thick-film circuit arrangement having a ceramic substrate plate The invention relates to a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular i... | 06/13/1989 |
| 4835038 | Substrate coated with multiple thick films A substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are ove... | 05/30/1989 |
| 4830878 | Method of manufacturing a substrate coated with multiple thick films A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks ac... | 05/16/1989 |
| 4730241 | Laminated hybrid integrated DC-DC converter A DC-DC converter of a laminated, hybrid integrated type comprising a laminated transformer having printed conductor layers on its surface and electronic components attached to the surface. The laminated transformer is formed by alternately laminating a p... | 03/08/1988 |
| 4591814 | Electronic component comprising printed circuit elements disposed on a folded tape and method of making such component An electronic component made by the steps of: preparing elongated tape (10), distributing a plurality of pairs of electronic elements (1) over the tape (10) lengthwise of the latter and bonding the pairs to the tape (10) in such a manner that the two elem... | 05/27/1986 |
| 4585580 | Thick film copper compatible resistors based on hexaboride conductors and nonreducible glasses Thick flim resistors and conductors compatible with copper and fireable in nonoxidizing atmosphere are provided. The resistors are based on certain hexaboride conductors such as LaB6 and glasses which are thermodynamically stable to or nonreduc... | 04/29/1986 |
| 4573101 | LC Composite component A chip-type LC composite component in which an inductance element section (51) for producing an inductance component is superposed on a laminated capacitor section (34) for producing a capacitance component. Conductive paths (39, 40, 42, 43, 45, 46, 48, 4... | 02/25/1986 |
| 4493789 | Electroconductive paste and process for producing electroconductive metallized ceramics using the same A highly electroconductive paste for metallizing comprising (a) a high-melting metal powder such as W, Mo, Mo-Mn, Pt, etc., powder, (b) an additive such as MgO, CaO, SiO2, Al2 O3, etc., in an amount of 0.1 to 3 parts by we... | 01/15/1985 |
| 4424251 | Thick-film multi-layer wiring board A thick-film multi-layer wiring board in which the thick-film resistor provided in the inner layer is coated with a glass material selected from (a) and (b) below: (a) crystallized glass which is crystallized at 850° C. or above, and (b) amorphous glass ... | 01/03/1984 |
| 4406944 | Devices for mounting infrared lamps in furnaces Mounting devices are provided for mounting the end portions of a replaceable infrared lamp on the sidewalls of heating chamber formed of a compressed insulation material with sheet metal covers on the outer surface thereof. Each mounting device comprises ... | 09/27/1983 |
| 4401709 | Overglaze inks Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component... | 08/30/1983 |
| 4397800 | Ceramic body having a metallized layer A ceramic body having a metallized layer which comprises a ceramic substrate and a metallized layer fired on the substrate to be integrated or further comprises a conductive layer consisting of a noble metal or noble metal alloy to be joined onto the meta... | 08/09/1983 |
| 4377642 | Overglaze inks Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component... | 03/22/1983 |
| 4369220 | Crossover dielectric inks used in forming a multilayer electrical circuit Novel thick-film crossover dielectric inks useful in constructing multilayer circuits on suitable substrates are provided. The subject inks comprise a barium magnesium borosilicate glass powder, a pinhole reducing component comprising silicon dioxide, an ... | 01/18/1983 |
| 4369254 | Crossover dielectric inks Novel thick-film crossover dielectric inks useful in constructing multilayer circuits on suitable substrates are provided. The subject inks comprise a barium magnesium borosilicate glass powder, a pinhole reducing component comprising silicon dioxide, an ... | 01/18/1983 |
| 4350618 | Thick film conductors for use in microelectronic packaging In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area ... | 09/21/1982 |
| 4323652 | Starting mixture for a dielectric composition, screen printing paste having such a starting mixture, and product obtained Dielectric composition, screen printing paste having such a composition and products obtained. The invention describes a dielectric composition which may be used in particular as an insulating screen-printing paste, which is compatible with a copper-conta... | 04/06/1982 |
| 4323483 | Mixed oxide bonded copper conductor compositions Thick film copper conductor compositions useful for forming microwave conduit conductors are disclosed. The compositions contain copper, copper oxide, lead oxide and bismuth oxide dispersed in an inert liquid vehicle.... | 04/06/1982 |
| 4322316 | Thick film conductor employing copper oxide A thick film conductor, a process for producing such, and a thick film conductor paste of: A. 7 to 27 weight percent boron; and B. zero to 35 weight percent glass frit; and C. balance essentially copper oxide.... | 03/30/1982 |
| 4317750 | Thick film conductor employing nickel oxide A thick film conductor, a process for producing such, and a thick film conductor paste of: A. 12 to 25 weight percent boron; and B. zero to 35 weight percent glass frit; and C. balance essentially nickel oxide; wherein the combined weight of boron and glass frit is... | 03/02/1982 |
| 4274124 | Thick film capacitor having very low internal inductance A decoupling capacitor for highly integrated, fast switching logic circuit modules. The capacitor comprises stacked ceramic sheets having metallized surfaces. The sheets are connected together in groups. Alternate groups are connected to a first electrode... | 06/16/1981 |
| 4255291 | Air-fireable conductor composition Air-fireable thick film conductor compositions are provided. The conductor composition is a paste containing (1) an inorganic powder made from an intermetallic phase copper-aluminum powder, aluminum powder and a glass frit and (2) an inert organic liquid ... | 03/10/1981 |
| 4251397 | Vehicle for thick film resistors fireable in nonoxidizing atmosphere Vehicles useful for thick film resistors fireable in nonoxidizing atmosphere, which are based on copolymers of ethylene and vinyl acetate, are provided. Pastes based on such vehicles, hexaboride conductors, and nonreducible glasses have high viscosity, go... | 02/17/1981 |
| 4230493 | Gold conductor compositions Superior thick film gold conductor compositions useful in electronic microcircuits containing small amounts of silver. Improved properties prior to heat aging include surface characteristics, malleability and electrical conductivity. Improved properties o... | 10/28/1980 |
| 4225468 | Temperature coefficient of resistance modifiers for thick film resistors Temperature coefficient of resistance (TCR) modifiers, useful in thick film resistor compositions, which can be fired in nonoxidizing atmosphere and which are based on LaB6 and glass powders dispersed in a vehicle, are provided. Among such TCR ... | 09/30/1980 |
| 4070200 | Compositions containing diethylene glycol ether In electronic compositions of inorganic powders dispersed in vehicles of solvent and polymer, said compositions being useful for printing inorganic powders on dielectric substrates, followed by firing to produce various electronic functions, improved vehi... | 01/24/1978 |
