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Class 257/E27.095 - Capacitor and transistor in common trench (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
No. of patents: 10
Last issue date: 06/17/2008


NumberTitleIssue Date
7388274Capacitor below the buried oxide of SOI CMOS technologies for protection against soft errors
Disclosed is a semiconductor structure that incorporates a capacitor for reducing the soft error rate of a device within the structure. The multi-layer semiconductor structure includes an insulator-filled deep trench isolation structure that is formed through an act...
06/17/2008
7262452Method of forming DRAM device having capacitor and DRAM device so formed
In a method of forming a DRAM device having a capacitor and a DRAM device so formed, an interlayer dielectric having at least one layer is formed on a semiconductor substrate. The interlayer dielectric layer and a predetermined portion of the semiconductor substrate...
08/28/2007
7247905Offset vertical device
The present invention includes a method for forming a memory array and the memory array produced therefrom. Specifically, the memory array includes at least one first-type memory device, each of the at least one first-type memory device comprising a first transistor...
07/24/2007
7199416Systems and methods for a memory and/or selection element formed within a recess in a metal line
The subject invention provides systems and methodologies for fabrication of memory and/or selection (e.g., diodes) elements in a recession in a semiconductor layer. In particular, a trench of varying width is created in the semiconductor layer by employing various e...
04/03/2007
7129130Out of the box vertical transistor for eDRAM on SOI
The present invention provides a vertical memory device formed in a silicon-on-insulator substrate, where a bitline contacting the upper surface of the silicon-on-insulator substrate is electrically connected to the vertical memory device through an upper strap diff...
10/31/2006
6066869Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor
A memory cell for a memory array in a folded bit line configuration. The memory cell includes an access transistor formed in a pillar of single crystal semiconductor material. The access transistor has first and second source/drain regions and a body regi...
05/23/2000
5502320Dynamic random access memory (DRAM) semiconductor device
A semiconductor device comprising a semiconductor substrate of first conductivity type, a trench type element isolation region formed in a preset depth from the semiconductor substrate surface, an element region of the first conductivity type surrounded b...
03/26/1996
5164917Vertical one-transistor DRAM with enhanced capacitance and process for fabricating
One embodiment of the present invention is a one transistor DRAM cell having enhanced capacitance and minimized soft error rate by providing an ungrounded cell capacitor plate which is insulated from the substrate. The structure includes a vertical transi...
11/17/1992
5021355Method of fabricating cross-point lightly-doped drain-source trench transistor
A structure and fabrication process for a self-aligned, lightly-doped drain/source n-channel field-effect transistor wherein a trench is formed in a well region in a wafer including an epitaxial layer on a substrate. A first, heavily doped drain region an...
06/04/1991
4954854Cross-point lightly-doped drain-source trench transistor and fabrication process therefor
A structure and fabrication process for a self-aligned, lightly-doped drain/source n-channel field-effect transistor wherein a trench is formed in a well region in a wafer including an epitaxial layer on a substrate. A first, heavily doped drain region an...
09/04/1990
 
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