"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
Simon Newcomb, astronomer ; Said in 1902, less than two years before the first flight at Kitty Hawk
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| Number | Title | Issue Date |
| 7442987 | Non-volatile memory devices including divided charge storage structures A semiconductor memory device includes a substrate having first and second source/drain regions therein and a channel region therebetween. The device also includes first and second charge storage layers on the channel region, a first insulating layer on the channel ... | 10/28/2008 |
| 7420243 | Non-volatile memory device with buried control gate and method of fabricating the same In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memor... | 09/02/2008 |
| 7391078 | Non-volatile memory and manufacturing and operating method thereof A non-volatile memory is provided. A substrate having a plurality of trenches and a plurality of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjace... | 06/24/2008 |
| 7385244 | Flash memory devices with box shaped polygate structures A method for forming an improved etching hardmask oxide layer in a polysilicon etching process including providing a planarized semiconductor wafer process surface including adjacent first exposed polysilicon portions and exposed oxide portions; selectively etching ... | 06/10/2008 |
| 7355243 | Flash memory device and method for fabricating the same A flash memory device including an isolation layer for defining active regions in a semiconductor substrate. The active region is a region in which flash memory cells are to be formed. The device also includes a gate stack is formed to come across the active region ... | 04/08/2008 |
| 7345335 | Semiconductor integrated circuit, booster circuitry, and non-volatile semiconductor memory device In a capacitor-containing semiconductor integrated circuit, a portion in which a plurality of capacitors are serially connected together is arranged so that at least part of the capacitors is formed as a well capacitor. ... | 03/18/2008 |
| 7332789 | Isolation trenches for memory devices Methods and apparatus are provided. A first dielectric plug is formed in a portion of a trench that extends into a substrate of a memory device so that an upper surface of the first dielectric plug is recessed below an upper surface of the substrate. The first diele... | 02/19/2008 |
| 7323349 | Self-aligned cross point resistor memory array A method of fabricating resistor memory array includes preparing a silicon substrate; depositing a bottom electrode, a sacrificial layer, and a hard mask layer on a substrate P+ layer; masking, patterning and etching to remove, in a first direction, a portion of the... | 01/29/2008 |
| 7312496 | Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same A semiconductor device comprises a first transistor having a composite gate structure containing a lamination of a first polycrystalline silicon film, an interlayer insulating film, and a second polycrystalline silicon film; and a second transistor having a single g... | 12/25/2007 |
| 7304345 | Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device A semiconductor device, which ensures device reliability especially in fine regions and enables great capacitance and high-speed operations, has memory cells including, in a first region of a main surface of a semiconductor substrate, a gate insulating film, a float... | 12/04/2007 |
| 7301196 | Nonvolatile memories and methods of fabrication In a nonvolatile memory, substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions are dielectric regions protruding above the substrate. Then select gate lines (140) are formed. Then a floa... | 11/27/2007 |
| 7253470 | Floating gate with unique profile by means of undercutting for split-gate flash memory device A split-gate flash memory device has a floating gate with a lateral recess at its bottom sidewall by adding an undercutting step. The split-gate flash memory device has a floating gate with a lateral recess on a substrate, an integrated dielectric layer lining the s... | 08/07/2007 |
| 7122853 | Method to improve yield and simplify operation of polymer memory cells Systems and methodologies are provided for simplifying a polymer memory cell's operation by employing a post polymer growth treatment to form ionic or super ionic metal compounds therein. Such post polymer growth treatment facilitates distribution and mobility of me... | 10/17/2006 |
| 6995436 | Nonvolatile semiconductor memory device In a memory cell, the substrate contact region of an NMOS transistor and the well contact region of a PMOS transistor are arranged perpendicularly to a floating gate. In a cell array, the memory cell and another memory cell arranged axisymmetrically with respect to ... | 02/07/2006 |
| 5595920 | Method of manufacturing a semiconductor memory device for use with image pickup A semiconductor memory device includes: an insulated gate transistor having a plurality of main electrode regions provided along a major surface of a substrate and a channel region provided between the plurality of main electrode regions, and a gate elect... | 01/21/1997 |
| 5567962 | Semiconductor memory device A semiconductor memory device includes: an insulated gate transistor having a plurality of main electrode regions provided along a major surface of a substrate and a channel region provided between the plurality of main electrode regions, and a gate elect... | 10/22/1996 |
| 5436496 | Vertical fuse device A vertical fuse structure including a lightly-doped shallow emitter 30 provides improved fusing characteristics. The structure includes a buried collector 14, an overlying base 30, and an emitter 44 above the base 30. In one preferred embodiment, the emit... | 07/25/1995 |
| 5331197 | Semiconductor memory device including gate electrode sandwiching a channel region A semiconductor memory device includes: an insulated gate transistor having a plurality of main electrode regions provided along a major surface of a substrate and a channel region provided between the plurality of main electrode regions, and a gate elect... | 07/19/1994 |
| 5212102 | Method of making polysilicon Schottky clamped transistor and vertical fuse devices An improved method for fabricating polysilicon Schottky clamped transistors and vertical fuse devices in the same semiconductor structure is disclosed. The resulting structure yields an improved Schottky clamped transistor and vertical fuse device. The im... | 05/18/1993 |
| 5144404 | Polysilicon Schottky clamped transistor and vertical fuse devices An improved method for fabricating polysilicon Schottky clamped transistors and vertical fuse devices in the same semiconductor structure is disclosed. The resulting structure yields an improved Schottky clamped transistor and vertical fuse device. The im... | 09/01/1992 |
| 4961102 | Junction programmable vertical transistor with high performance transistor An oxide-isolated RAM and PROM process is disclosed wherein a RAM circuit includes a lateral PNP transistor formed in the same island of silicon material as a vertical NPN device and further wherein contact is made to the base of the lateral PNP and to th... | 10/02/1990 |
| 4949150 | Programmable bonding pad with sandwiched silicon oxide and silicon nitride layers The present invention is a bonding pad structure and method for making the same which can be connected at the metalization step to form passive or active devices in addition to forming a bonding pad. A P-doped region is formed in an epitaxial layer in the... | 08/14/1990 |
| 4835590 | Semiconductor memory device using junction short type programmable element A semiconductor memory device using a junction short type programmable element comprises an epitaxial layer formed on a semiconductor substrate, the epitaxial layer having an opposite conductive type to that of the semiconductor substrate, the epitaxial l... | 05/30/1989 |
| 4805141 | Bipolar PROM having transistors with reduced base widths A semiconductor device having a vertical transistor consisting of a semiconductor substrate, a first semiconductor region, and a second semiconductor region operatively functioning as a collector, a base, and an emitter of a transistor. By providing a hig... | 02/14/1989 |
| 4792833 | Junction-shorting type semiconductor read-only memory having increased speed and increased integration density In a junction-shorting type PROM, including transistors, a highly doped region having the same conductivity type as a base is provided between a pair of memory cells. This region is a base contact region which commonly connects paired bases at a surface t... | 12/20/1988 |
| 4782466 | Programmable semiconductor read only memory device A programmable semiconductor read only memory device which includes a memory cell array formed by a plurality of memory cells arranged in a matrix arrangement. Each memory cell in the memory cell array includes a transistor having a gate thereof coupled t... | 11/01/1988 |
| 4719599 | Programmable read-only memory device provided with test cells A programmable read-only memory device of a junction destruction type is provided with a test circuit for the purpose of detecting a parasitic thyristor effect which may occur in the data programming operation by the user. The test circuit includes first ... | 01/12/1988 |
| 4654688 | Semiconductor device having a transistor with increased current amplification factor A semiconductor device having a lateral transistor consisting of a semiconductor substrate, a first semiconductor region, and a second semiconductor region operatively functioning as a collector, a base, and an emitter of a transistor. By providing a high... | 03/31/1987 |
| 4624046 | Oxide isolation process for standard RAM/PROM and lateral PNP cell RAM An oxide-isolated RAM and PROM process is disclosed wherein a RAM circuit includes a lateral PNP transistor formed in the same island of silicon material as a vertical NPN device and further wherein contact is made to the base of the lateral PNP and to th... | 11/25/1986 |
| 4536858 | Junction short-circuiting-type programmable read-only memory device A junction short-circuiting-type programmable read-only memory (PROM) device comprises a plurality of striped buried layers (12) and a plurality of striped collector regions (13) thereon. In each of the collector regions, a plurality of base regions (15-0... | 08/20/1985 |
| 4480318 | Method of programming of junction-programmable read-only memories A method of programming a cell in a PROM, wherein the cell comprises a bipolar transistor having a floating base, comprises applying a current rising with time across the emitter to collector contacts of the bipolar transistor with the collector contact s... | 10/30/1984 |
| 4453233 | Semiconductor memory device and method of manufacturing the same A programmable semiconductor memory device with an emitter follower type poly-silicon fuse comprises: a first semiconductor region of first conductivity type; a first insulation layer for separating elements formed in the first semiconductor region; a sec... | 06/05/1984 |
| 4412308 | Programmable bipolar structures A switchable bipolar structure, suitable for use in a programmable read only memory, is provided which includes a rectifying contact disposed on a N type semiconductor substrate with a P type diffusion region formed in the substrate spaced within a minori... | 10/25/1983 |
| 4329703 | Lateral PNP transistor Shallow, boron implanted regions are formed by ion implanting. Disclosed is a PNP transistor device (lateral type) having a P type emitter region preferably made with a boron implant.... | 05/11/1982 |
| 4312046 | Vertical fuse and method of fabrication In a memory array wherein each cell includes an emitter follower, a diode is formed on the emitter by a thin layer which is capable of being shorted by vertical migration of bit line atoms through the layer and into the emitter region. The thin layer is f... | 01/19/1982 |
| 4287569 | Semiconductor memory device In a semiconductor memory device having a plurality of memory cells located at a cross position of a plurality of bit lines and a plurality of word lines, the memory cell comprising a series circuit of an information storing element such as a diode or a f... | 09/01/1981 |
| 4228451 | High resistivity semiconductor resistor device This disclosure relates to a low power write-once, read-only semiconductor memory (PROM or programmable read only memory) array wherein the semiconductor resistors located in the word line decoder and driver and also in the bit line decoder and sense ampl... | 10/14/1980 |
| 4196228 | Fabrication of high resistivity semiconductor resistors by ion implanatation This disclosure relates to a low power write-once, read-only semiconductor memory (PROM or programmable read only memory) array wherein the semiconductor resistors located in the word line decoder and driver and also in the bit line decoder and sense ampl... | 04/01/1980 |
| 4153949 | Electrically programmable read-only-memory device A matrix of columns and rows of conductors with transistors located at the intersection thereof on a semiconductor chip is formed utilizing the washed emitter process which locates the ohmic contact windows close to the PN junction so that a small size pi... | 05/08/1979 |
| 4152627 | Low power write-once, read-only memory array This disclosure relates to a low power write-once, read-only semiconductor memory (PROM or programmable read only memory) array wherein the semiconductor resistors located in the word line decoder and driver and also in the bit line decoder and sense ampl... | 05/01/1979 |