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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Application No. | Application Title | Issue Date |
| 20120001297 | Techniques for Placement of Active and Passive Devices within a Chip A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer... | 01/05/2012 |
| 20110284869 | High Voltage Durability III-Nitride HEMT A high voltage durability III-nitride semiconductor device comprises a support substrate including a first silicon body, an insulator body over the first silicon body, and a second silicon body over the insulator body. The high voltage durability III-nitride semiconduct... | 11/24/2011 |
| 20110233783 | SUBSTRATE ARRANGEMENT In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate i... | 09/29/2011 |
| 20110180902 | REVERSE CONDUCTING IGBT In a reverse conducting IGBT, diode cathode regions are formed dispersedly on the back side of a device chip. When the distribution density of the diode cathode region becomes low, VF of a fly-back diode, that is, a forward voltage drop becomes large. On the other hand,... | 07/28/2011 |
| 20090073667 | Semiconductor chip package and printed circuit board A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other s... | 03/19/2009 |
| 20080315356 | Semiconductor die with backside passive device integration According to an exemplary embodiment, a semiconductor die includes a backside surface opposite an active surface. The active surface includes at least one active device. The semiconductor die includes at least one passive device situated on the backside surface. The sem... | 12/25/2008 |
| 20080203526 | Semiconductor device equipped with thin-film circuit elements A plurality of wirings, column-shaped electrodes, sealing films, and soldering balls, are provided on a third upper-layer insulating film formed on a silicon substrate. A spirally configured thin-film inductive element is disposed beneath the bottom surface of a ground ... | 08/28/2008 |
